公开(公告)号：US20070269986A1

公开(公告)日：2007-11-22

申请号：US11829798

申请日：2007-07-27

申请人： William Kalenian ,  Tom Walsh ,  Dave Halley

发明人： William Kalenian ,  Tom Walsh ,  Dave Halley

IPC分类号： H01L21/302

CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

摘要翻译： 本实施例提供了用于处理诸如晶片的物体的方法和系统，包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人，传送站和多个端部执行器。 处理模块与前端模块耦合，使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴，所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。

公开(公告)号：US20060035563A1

公开(公告)日：2006-02-16

申请号：US11173992

申请日：2005-07-01

申请人： William Kalenian ,  Tom Walsh ,  Dave Halley

发明人： William Kalenian ,  Tom Walsh ,  Dave Halley

IPC分类号： B24B51/00

CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

公开(公告)号：US08052504B2

公开(公告)日：2011-11-08

申请号：US11829798

申请日：2007-07-27

申请人： William J. Kalenian ,  Tom Walsh ,  Dave Halley

发明人： William J. Kalenian ,  Tom Walsh ,  Dave Halley

IPC分类号： B24B49/00

CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

摘要翻译： 本实施例提供了用于处理诸如晶片的物体的方法和系统，包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人，传送站和多个端部执行器。 处理模块与前端模块耦合，使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴，所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。

公开(公告)号：US08565919B2

公开(公告)日：2013-10-22

申请号：US13290900

申请日：2011-11-07

申请人： William J. Kalenian ,  Thomas A. Walsh ,  Dave Halley

发明人： William J. Kalenian ,  Thomas A. Walsh ,  Dave Halley

IPC分类号： B65H1/00 ,  G06F19/00

CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

摘要翻译： 本实施例提供了用于处理诸如晶片的物体的方法和系统，包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人，传送站和多个端部执行器。 处理模块与前端模块耦合，使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴，所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。

公开(公告)号：US20120046781A1

公开(公告)日：2012-02-23

申请号：US13290900

申请日：2011-11-07

申请人： William J. Kalenian ,  Thomas Walsh ,  Dave Halley

发明人： William J. Kalenian ,  Thomas Walsh ,  Dave Halley

IPC分类号： G06F19/00

CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

摘要翻译： 本实施例提供了用于处理诸如晶片的物体的方法和系统，包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人，传送站和多个端部执行器。 处理模块与前端模块耦合，使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴，所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。