公开(公告)号：US20070269986A1

公开(公告)日：2007-11-22

申请号：US11829798

申请日：2007-07-27

申请人： William Kalenian ,  Tom Walsh ,  Dave Halley

发明人： William Kalenian ,  Tom Walsh ,  Dave Halley

IPC分类号： H01L21/302

CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

摘要翻译： 本实施例提供了用于处理诸如晶片的物体的方法和系统，包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人，传送站和多个端部执行器。 处理模块与前端模块耦合，使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴，所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。

公开(公告)号：US20060035563A1

公开(公告)日：2006-02-16

申请号：US11173992

申请日：2005-07-01

申请人： William Kalenian ,  Tom Walsh ,  Dave Halley

发明人： William Kalenian ,  Tom Walsh ,  Dave Halley

IPC分类号： B24B51/00

CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

公开(公告)号：US20070105491A1

公开(公告)日：2007-05-10

申请号：US11619088

申请日：2007-01-02

申请人： Thomas Walsh ,  William Kalenian

发明人： Thomas Walsh ,  William Kalenian

IPC分类号： B24B47/02

CPC分类号： B24B37/30

摘要： A pivoting wafer carrier having a minimum of internal friction and a smooth, continuous pivoting motion. The pivot mechanism includes a lower ring mounted on a pressure plate, an upper ring mounted on a housing upper plate and ball transfer units disposed on the lower ring. Corresponding bearing wedges depend downwardly from the upper ring. As the pressure plate tilts during the polishing process, the load balls of the ball transfer units roll against the corresponding wedges, thus producing a smooth, continuous pivoting motion. A universal joint may be provided to the carrier to effect the rotation of the carrier and to aid the smooth, continuous pivoting motion of the wafer carrier.

摘要翻译： 具有最小内摩擦和平滑，连续的枢转运动的枢转晶片载体。 枢转机构包括安装在压板上的下环，安装在壳体上板上的上环和设置在下环上的球传递单元。 相应的轴承楔块从上环向下取向。 当在抛光过程中压板倾斜时，球传送装置的载荷球相对于相应的楔形物滚动，从而产生平滑，连续的旋转运动。 可以向载体提供万向接头以实现载体的旋转并且有助于晶片载体的平滑，连续的枢转运动。

公开(公告)号：US20060205322A1

公开(公告)日：2006-09-14

申请号：US11430637

申请日：2006-05-08

申请人： William Kalenian ,  Thomas Walsh

发明人： William Kalenian ,  Thomas Walsh

IPC分类号： B24B51/00

CPC分类号： B24B49/16 ,  B24B37/042

摘要： The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in the inflatable seal or the inflatable membrane, depending on the wafer carrier configuration, to determine a unique calibration in real time for the particular wafer carrier that is being tested and used during the polishing process.

摘要翻译： 下面描述的方法和装置允许CMP工具的用户使用机构，称重传感器，控制计算机和力方程来快速校准主轴力，晶片力和保持力。 控制计算机可以根据晶片载体配置测试充气密封件或可充气膜中的各种压力，以确定在抛光过程中正被测试和使用的特定晶片载体的实时唯一校准。

公开(公告)号：US07040955B1

公开(公告)日：2006-05-09

申请号：US11046502

申请日：2005-01-28

申请人： William Kalenian ,  Thomas A. Walsh

发明人： William Kalenian ,  Thomas A. Walsh

IPC分类号： B24B1/00

CPC分类号： B24B49/16 ,  B24B37/042

摘要： The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in the inflatable seal or the inflatable membrane, depending on the wafer carrier configuration, to determine a unique calibration in real time for the particular wafer carrier that is being tested and used during the polishing process.