公开(公告)号：US20240274565A1

公开(公告)日：2024-08-15

申请号：US18168434

申请日：2023-02-13

Applicant: Winbond Electronics Corp.

Inventor： Yu-Cheng CHEN ,  Jin-Neng WU

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/49

CPC classification number: H01L24/19 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3192 ,  H01L23/49 ,  H01L24/20 ,  H01L24/95 ,  H01L23/3185 ,  H01L2224/19 ,  H01L2224/214 ,  H01L2224/95001

Abstract: A method for forming a die package structure, including disposing a plurality of dies on a carrier substrate, wherein the top surface of each die has a plurality of signal junctions. The method also includes forming a vertical wire on each of the signal junctions, forming a supporting dielectric layer on the carrier substrate, wherein the supporting dielectric layer covers the dies and exposes the top of the vertical wires, and forming a plurality of redistribution traces on the supporting dielectric layer, wherein the redistribution traces are electrically connected to each of the vertical wires. The method further includes forming a bump at the bonding site of each of the redistribution traces, and performing a cutting process to singulate the dies.