公开(公告)号：US20240217808A1

公开(公告)日：2024-07-04

申请号：US18609571

申请日：2024-03-19

Applicant: Winbond Electronics Corp.

Inventor： Jin-Neng WU

IPC: B81B3/00 ,  B81C3/00

CPC classification number: B81B3/0018 ,  B81C3/001 ,  B81B2201/0214 ,  B81B2201/03 ,  B81B2203/033 ,  B81B2207/09

Abstract: A method for manufacturing package structure is provided, including: providing a substrate having recesses; forming first MEMS chips on the substrate, each with a through-substrate via, and a first sensor or microactuator on the lower surface, located in one of the recesses; forming first intermediate chips on the substrate, each respectively on one of the first MEMS chips, having a through-substrate via, and including a signal conversion unit, a logic operation unit, control unit, or a combination thereof; forming second MEMS chips on the first intermediate chips, each with a through-substrate via, having a second sensor or microactuator on its upper surface, wherein the package structure includes at least one of the first sensor and the second sensor; and forming first capping plates on the second MEMS chips, each providing a receiving space for the second sensor or microactuator on the upper surface of each second MEMS chip.

公开(公告)号：US20240274565A1

公开(公告)日：2024-08-15

申请号：US18168434

申请日：2023-02-13

Applicant: Winbond Electronics Corp.

Inventor： Yu-Cheng CHEN ,  Jin-Neng WU

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/49

CPC classification number: H01L24/19 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3192 ,  H01L23/49 ,  H01L24/20 ,  H01L24/95 ,  H01L23/3185 ,  H01L2224/19 ,  H01L2224/214 ,  H01L2224/95001

Abstract: A method for forming a die package structure, including disposing a plurality of dies on a carrier substrate, wherein the top surface of each die has a plurality of signal junctions. The method also includes forming a vertical wire on each of the signal junctions, forming a supporting dielectric layer on the carrier substrate, wherein the supporting dielectric layer covers the dies and exposes the top of the vertical wires, and forming a plurality of redistribution traces on the supporting dielectric layer, wherein the redistribution traces are electrically connected to each of the vertical wires. The method further includes forming a bump at the bonding site of each of the redistribution traces, and performing a cutting process to singulate the dies.

公开(公告)号：US20220185655A1

公开(公告)日：2022-06-16

申请号：US17550607

申请日：2021-12-14

Applicant: Winbond Electronics Corp.

Inventor： Jin-Neng WU

IPC: B81B3/00 ,  B81C3/00

Abstract: A package structure and its manufacturing method are provided. The package structure includes a substrate with a recess, and a first MEMS chip, a first intermediate chip, a second MEMS chip and a first capping plate sequentially formed on the substrate. The lower surface of the first MEMS chip has a first sensor or a microactuator. The upper surface of the second MEMS chip has a second sensor or a microactuator. The first intermediate chip has a through-substrate via, and includes a signal conversion unit, a logic operation unit, a control unit, or a combination thereof. The package structure includes at least one of the first sensor and the second sensor.