APPARATUS FOR INSPECTING LIGHT EMITTING DIODE AND INSPECTING METHOD USING SAID APPARATUS
    1.
    发明申请
    APPARATUS FOR INSPECTING LIGHT EMITTING DIODE AND INSPECTING METHOD USING SAID APPARATUS 有权
    用于检测发光二极管的装置和使用设备的检查方法

    公开(公告)号:US20120249779A1

    公开(公告)日:2012-10-04

    申请号:US13412197

    申请日:2012-03-05

    IPC分类号: H04N7/18

    摘要: A light emitting diode (LED) inspection apparatus includes at least one LED including a phosphor applied on an emission surface, a first lighting unit to emit visible light to the LED, a second lighting unit to emit ultraviolet (UV) light to the LED, a photographing unit to generate at least one first image data by photographing the visible light reflected from the LED and to generate at least one second image data by photographing the UV light reflected from the LED, and a determination unit to determine a defect in appearance and emission characteristics of the LED using the at least one first image data and second image data.

    摘要翻译: 发光二极管(LED)检查装置包括至少一个LED,其包括施加在发射表面上的荧光体,向LED发射可见光的第一照明单元,向LED发射紫外线(UV)光的第二照明单元, 拍摄单元,通过拍摄从LED反射的可见光来生成至少一个第一图像数据,并且通过拍摄从LED反射的UV光来生成至少一个第二图像数据;以及确定单元,用于确定外观缺陷,以及 使用所述至少一个第一图像数据和第二图像数据的LED的发射特性。

    APPARATUS FOR MEASUREMENT OF THREE-DIMENSIONAL SHAPE
    2.
    发明申请
    APPARATUS FOR MEASUREMENT OF THREE-DIMENSIONAL SHAPE 有权
    三维形状测量装置

    公开(公告)号:US20140285815A1

    公开(公告)日:2014-09-25

    申请号:US14169324

    申请日:2014-01-31

    IPC分类号: G01B11/25

    CPC分类号: G01B11/2513 G01B11/254

    摘要: An apparatus for measurement of a three-dimensional (3D) shape includes a lens unit transmitting slit beams to a plurality of measurement objects, a light source unit irradiating the plurality of slit beams to the lens unit at different angles, an imaging unit obtaining images of the plurality of measurement objects formed by the slit beams irradiated on the plurality of measurement objects, and a calculation processing unit generating information regarding a 3D shape of the plurality of measurement objects from the images obtained by the imaging unit.

    摘要翻译: 一种用于测量三维(3D)形状的装置包括:透镜单元,其向多个测量对象发射狭缝光束;光源单元,以不同的角度将多个狭缝光束照射到所述透镜单元;成像单元,获得图像 所述多个测量对象由照射在所述多个测量对象上的所述狭缝光束形成;以及计算处理单元,从由所述成像单元获得的图像生成关于所述多个测量对象的3D形状的信息。

    APPARATUS AND METHOD FOR MANUFACTURING LED PACKAGE
    3.
    发明申请
    APPARATUS AND METHOD FOR MANUFACTURING LED PACKAGE 审中-公开
    用于制造LED封装的装置和方法

    公开(公告)号:US20120122250A1

    公开(公告)日:2012-05-17

    申请号:US13278887

    申请日:2011-10-21

    IPC分类号: H01L21/66 B21B15/00

    摘要: An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.

    摘要翻译: 一种用于制造发光二极管(LED)封装的装置,包括:加热单元,其将引线框架状态中的LED封装阵列加热,其中安装多个LED封装件以阵列设置在引线框架上; 测试单元,通过向由加热单元加热的LED封装阵列施加电压或电流来测试LED封装阵列中的每个LED封装的工作状态; 以及切割单元,根据测试单元的测试结果,仅切断被确定为功能产品的LED封装或从引线框确定为缺陷产品的LED封装以将其去除。