摘要:
An apparatus for measurement of a three-dimensional (3D) shape includes a lens unit transmitting slit beams to a plurality of measurement objects, a light source unit irradiating the plurality of slit beams to the lens unit at different angles, an imaging unit obtaining images of the plurality of measurement objects formed by the slit beams irradiated on the plurality of measurement objects, and a calculation processing unit generating information regarding a 3D shape of the plurality of measurement objects from the images obtained by the imaging unit.
摘要:
A method for inspecting a light source module for defects includes preparing a board on which a light emitting device and a lens covering the light emitting device are installed. A current is applied to the light emitting device to turn on the light emitting device. The lens is imaged with the light emitting device turned on. A central symmetry denoting a symmetry of light emission distribution from the center of the lens is calculated based on the obtained image, and the calculated central symmetry is compared with a reference value to determine whether unsymmetrical light emission distribution has occurred. Various other methods and apparatuses for inspecting light source modules are additionally provided.
摘要:
A light emitting diode (LED) inspection apparatus includes at least one LED including a phosphor applied on an emission surface, a first lighting unit to emit visible light to the LED, a second lighting unit to emit ultraviolet (UV) light to the LED, a photographing unit to generate at least one first image data by photographing the visible light reflected from the LED and to generate at least one second image data by photographing the UV light reflected from the LED, and a determination unit to determine a defect in appearance and emission characteristics of the LED using the at least one first image data and second image data.
摘要:
An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.
摘要:
There is provided an LED testing apparatus. An LED testing apparatus according to an aspect of the invention may include: a first lighting unit generating first light and irradiating the first light onto an LED having an encapsulant including a fluorescent material excited by the first light to emit light having a longer wavelength than the first light; a second lighting unit generating second light having a longer wavelength than the first light to irradiate the second light onto the LED; an image acquisition unit receiving the light emitted from the fluorescent material and the second light reflected off the LED to acquire images of the LED; and an LED state determination unit determining whether the LED is acceptable or defective using the images of the LED acquired by the image acquisition unit.There is further provided an LED testing method using the LED testing apparatus.
摘要:
A are provided a light source module. The light source module including a light emitting device configured to emit light in a light emitting direction; and an optical device including a first surface disposed over the light emitting device and having a groove recessed in the light emitting direction in a central portion through which an optical axis of the optical device passes, and a second surface disposed opposite to the first surface and configured to refract light incident through the groove to be emitted to the outside. The optical device includes a plurality of ridges disposed on the second surface and periodically arranged in a direction from the optical axis to an edge of the optical device connected to the first surface.
摘要:
A side-view type light emitting device includes a package body, a lead frame, and a light emitting diode (LED). The package body has a first surface provided as a mount surface, a second surface disposed on a side opposite to the first surface, and lateral surfaces disposed between the first surface and the second surface. The package body includes a recessed portion disposed on a lateral surface corresponding to a light emitting surface of the lateral surfaces. The lead frame is disposed in the package body. The LED chip is mounted on a bottom surface of the recessed portion. Protrusion parts protruding toward the LED chip are disposed in regions adjacent to the LED chip of facing inner sidewalls of the recessed portion, respectively.
摘要:
There is provided a lens for a light emitter which includes: a bottom surface; an incident surface connected to the bottom surface at a central region of the bottom surface and disposed on or above a light source to allow light emitted from the light source to be made incident thereto and travel in an interior of the lens; and an output surface connected to the bottom surface at an edge of the bottom surface and configured to allow the light which has traveled in the interior of the lens to be emitted outwardly therefrom, wherein the central region of the bottom surface protrudes with respect to the other region of the bottom surface.