APPARATUS FOR MEASUREMENT OF THREE-DIMENSIONAL SHAPE
    1.
    发明申请
    APPARATUS FOR MEASUREMENT OF THREE-DIMENSIONAL SHAPE 有权
    三维形状测量装置

    公开(公告)号:US20140285815A1

    公开(公告)日:2014-09-25

    申请号:US14169324

    申请日:2014-01-31

    IPC分类号: G01B11/25

    CPC分类号: G01B11/2513 G01B11/254

    摘要: An apparatus for measurement of a three-dimensional (3D) shape includes a lens unit transmitting slit beams to a plurality of measurement objects, a light source unit irradiating the plurality of slit beams to the lens unit at different angles, an imaging unit obtaining images of the plurality of measurement objects formed by the slit beams irradiated on the plurality of measurement objects, and a calculation processing unit generating information regarding a 3D shape of the plurality of measurement objects from the images obtained by the imaging unit.

    摘要翻译: 一种用于测量三维(3D)形状的装置包括:透镜单元,其向多个测量对象发射狭缝光束;光源单元,以不同的角度将多个狭缝光束照射到所述透镜单元;成像单元,获得图像 所述多个测量对象由照射在所述多个测量对象上的所述狭缝光束形成;以及计算处理单元,从由所述成像单元获得的图像生成关于所述多个测量对象的3D形状的信息。

    METHOD OF INSPECTING A LIGHT SOURCE MODULE FOR DEFECTS, METHOD OF MANUFACTURING A LIGHT SOURCE MODULE, AND APPARATUS FOR INSPECTING A LIGHT SOURCE MODULE
    2.
    发明申请
    METHOD OF INSPECTING A LIGHT SOURCE MODULE FOR DEFECTS, METHOD OF MANUFACTURING A LIGHT SOURCE MODULE, AND APPARATUS FOR INSPECTING A LIGHT SOURCE MODULE 有权
    用于检测缺陷的光源模块的方法,制造光源模块的方法和用于检查光源模块的装置

    公开(公告)号:US20150355053A1

    公开(公告)日:2015-12-10

    申请号:US14581147

    申请日:2014-12-23

    IPC分类号: G01M11/02

    摘要: A method for inspecting a light source module for defects includes preparing a board on which a light emitting device and a lens covering the light emitting device are installed. A current is applied to the light emitting device to turn on the light emitting device. The lens is imaged with the light emitting device turned on. A central symmetry denoting a symmetry of light emission distribution from the center of the lens is calculated based on the obtained image, and the calculated central symmetry is compared with a reference value to determine whether unsymmetrical light emission distribution has occurred. Various other methods and apparatuses for inspecting light source modules are additionally provided.

    摘要翻译: 用于检查光源模块的缺陷的方法包括:准备安装有发光装置和覆盖发光装置的透镜的基板。 向发光器件施加电流以使发光器件导通。 透镜在开启发光器件时成像。 基于获得的图像计算表示来自透镜中心的发光分布的对称性的中心对称,并将计算出的中心对称性与参考值进行比较,以确定是否发生不对称发光分布。 另外提供用于检查光源模块的各种其它方法和装置。

    APPARATUS FOR INSPECTING LIGHT EMITTING DIODE AND INSPECTING METHOD USING SAID APPARATUS
    3.
    发明申请
    APPARATUS FOR INSPECTING LIGHT EMITTING DIODE AND INSPECTING METHOD USING SAID APPARATUS 有权
    用于检测发光二极管的装置和使用设备的检查方法

    公开(公告)号:US20120249779A1

    公开(公告)日:2012-10-04

    申请号:US13412197

    申请日:2012-03-05

    IPC分类号: H04N7/18

    摘要: A light emitting diode (LED) inspection apparatus includes at least one LED including a phosphor applied on an emission surface, a first lighting unit to emit visible light to the LED, a second lighting unit to emit ultraviolet (UV) light to the LED, a photographing unit to generate at least one first image data by photographing the visible light reflected from the LED and to generate at least one second image data by photographing the UV light reflected from the LED, and a determination unit to determine a defect in appearance and emission characteristics of the LED using the at least one first image data and second image data.

    摘要翻译: 发光二极管(LED)检查装置包括至少一个LED,其包括施加在发射表面上的荧光体,向LED发射可见光的第一照明单元,向LED发射紫外线(UV)光的第二照明单元, 拍摄单元,通过拍摄从LED反射的可见光来生成至少一个第一图像数据,并且通过拍摄从LED反射的UV光来生成至少一个第二图像数据;以及确定单元,用于确定外观缺陷,以及 使用所述至少一个第一图像数据和第二图像数据的LED的发射特性。

    APPARATUS AND METHOD FOR MANUFACTURING LED PACKAGE
    4.
    发明申请
    APPARATUS AND METHOD FOR MANUFACTURING LED PACKAGE 审中-公开
    用于制造LED封装的装置和方法

    公开(公告)号:US20120122250A1

    公开(公告)日:2012-05-17

    申请号:US13278887

    申请日:2011-10-21

    IPC分类号: H01L21/66 B21B15/00

    摘要: An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.

    摘要翻译: 一种用于制造发光二极管(LED)封装的装置,包括:加热单元,其将引线框架状态中的LED封装阵列加热,其中安装多个LED封装件以阵列设置在引线框架上; 测试单元,通过向由加热单元加热的LED封装阵列施加电压或电流来测试LED封装阵列中的每个LED封装的工作状态; 以及切割单元,根据测试单元的测试结果,仅切断被确定为功能产品的LED封装或从引线框确定为缺陷产品的LED封装以将其去除。

    LED TESTING APPARATUS AND TESTING METHOD THEREOF
    5.
    发明申请
    LED TESTING APPARATUS AND TESTING METHOD THEREOF 有权
    LED测试装置及其测试方法

    公开(公告)号:US20100246936A1

    公开(公告)日:2010-09-30

    申请号:US12630448

    申请日:2009-12-03

    IPC分类号: G06K9/00

    摘要: There is provided an LED testing apparatus. An LED testing apparatus according to an aspect of the invention may include: a first lighting unit generating first light and irradiating the first light onto an LED having an encapsulant including a fluorescent material excited by the first light to emit light having a longer wavelength than the first light; a second lighting unit generating second light having a longer wavelength than the first light to irradiate the second light onto the LED; an image acquisition unit receiving the light emitted from the fluorescent material and the second light reflected off the LED to acquire images of the LED; and an LED state determination unit determining whether the LED is acceptable or defective using the images of the LED acquired by the image acquisition unit.There is further provided an LED testing method using the LED testing apparatus.

    摘要翻译: 提供了LED测试装置。 根据本发明的一个LED测试装置可以包括:第一照明单元,其产生第一光并将第一光照射到具有包含由第一光激发的荧光材料的密封剂的LED上,以发射具有比第 第一光; 第二照明单元产生具有比第一光更长的波长的第二光,以将第二光照射到LED上; 接收从荧光材料发射的光和从LED反射的第二光的图像获取单元,以获取LED的图像; 以及LED状态确定单元,使用由图像获取单元获取的LED的图像确定LED是否可接受或有缺陷。 还提供了使用LED测试装置的LED测试方法。

    LIGHT SOURCE MODULE, LIGHTING DEVICE, AND LIGHTING SYSTEM
    6.
    发明申请
    LIGHT SOURCE MODULE, LIGHTING DEVICE, AND LIGHTING SYSTEM 有权
    光源模块,照明设备和照明系统

    公开(公告)号:US20150354786A1

    公开(公告)日:2015-12-10

    申请号:US14602554

    申请日:2015-01-22

    摘要: A are provided a light source module. The light source module including a light emitting device configured to emit light in a light emitting direction; and an optical device including a first surface disposed over the light emitting device and having a groove recessed in the light emitting direction in a central portion through which an optical axis of the optical device passes, and a second surface disposed opposite to the first surface and configured to refract light incident through the groove to be emitted to the outside. The optical device includes a plurality of ridges disposed on the second surface and periodically arranged in a direction from the optical axis to an edge of the optical device connected to the first surface.

    摘要翻译: A设置有光源模块。 所述光源模块包括配置为在发光方向发光的发光器件; 以及光学装置,其包括设置在所述发光装置上的第一表面,并且在所述光学装置的光轴穿过的中心部分具有沿所述发光方向凹陷的凹槽,以及与所述第一表面相对设置的第二表面, 被配置为折射通过所述凹槽入射的光以发射到外部。 光学装置包括设置在第二表面上并且沿着从光轴到连接到第一表面的光学装置的边缘的方向周期性地布置的多个脊。

    SIDE-VIEW TYPE LIGHT EMITTING DEVICE AND LINE LIGHT SOURCE TYPE LIGHT EMITTING DEVICE
    7.
    发明申请
    SIDE-VIEW TYPE LIGHT EMITTING DEVICE AND LINE LIGHT SOURCE TYPE LIGHT EMITTING DEVICE 有权
    侧视类型发光装置和线光源类型发光装置

    公开(公告)号:US20100123159A1

    公开(公告)日:2010-05-20

    申请号:US12479436

    申请日:2009-06-05

    IPC分类号: H01L33/00

    摘要: A side-view type light emitting device includes a package body, a lead frame, and a light emitting diode (LED). The package body has a first surface provided as a mount surface, a second surface disposed on a side opposite to the first surface, and lateral surfaces disposed between the first surface and the second surface. The package body includes a recessed portion disposed on a lateral surface corresponding to a light emitting surface of the lateral surfaces. The lead frame is disposed in the package body. The LED chip is mounted on a bottom surface of the recessed portion. Protrusion parts protruding toward the LED chip are disposed in regions adjacent to the LED chip of facing inner sidewalls of the recessed portion, respectively.

    摘要翻译: 一种侧视型发光器件包括封装体,引线框和发光二极管(LED)。 包装体具有设置为安装表面的第一表面,设置在与第一表面相对的一侧的第二表面和设置在第一表面和第二表面之间的侧表面。 包装体包括设置在与侧表面的发光表面相对应的侧表面上的凹部。 引线框架设置在封装主体中。 LED芯片安装在凹部的底面上。 分别朝向LED芯片突出的突出部分分别设置在与凹部的相对的内侧壁的LED芯片相邻的区域中。