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公开(公告)号：US20190131764A1
公开(公告)日：2019-05-02
申请号：US16094462
申请日：2016-12-16
发明人： Yan Qin , Fanrong Gao
IPC分类号： H01S5/022 , H01S5/042 , H01S5/0683
摘要： A COB bonding laser diode interface mating device comprises a laser diode and a driver integrated circuit (2). The laser diode includes a light-emitting chip (11). The light-emitting chip (11) is a bare die directly bonded to a circuit board. The driver integrated circuit (2) is a driver chip that is a packaged chip. The light-emitting chip (11) and the driver chip are connected through a capacitor-resistor network (3). The capacitor-resistor network (3) allows the driver integrated circuit (2) to provide a bias current and a modulation current to the laser diode such that the laser diode is in an activated state. The capacitor-resistor network (3) realizes interface mating between the COB bonding laser diode and the driver integrated circuit (2), thereby solving a problem that the interface mating cannot be easily achieved, reducing costs, and improving production efficiency.
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公开(公告)号：US10193631B1
公开(公告)日：2019-01-29
申请号：US15850295
申请日：2017-12-21
发明人： Long Chen , Fanrong Gao , Jun Zhang , Xianghong Yu
IPC分类号： H04B10/43 , H04B10/03 , H04B10/079 , G06F13/42 , G06F3/06 , G06F12/1081
摘要： The present disclosure relates to an optical module having digital diagnostic monitoring functions and a circuit and method to control the optical module. In an embodiment, a control circuit for an optical module including an optical receiving unit and an optical transmitting unit may comprise a first memory for storing a plurality of configuration parameters at predefined locations within the first memory, a second memory for storing a plurality of variables at dynamically allocated locations of the second memory, the plurality of variables including variables corresponding to a current operation status of the optical module, and an analog-to-digital converter configured to receive an analog signal corresponding to the current operation status and convert the analog signal to a digital value to be stored as the variable corresponding to the current operation status in the dynamically allocated location of the second memory.
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公开(公告)号：US10094991B2
公开(公告)日：2018-10-09
申请号：US15576855
申请日：2015-09-10
发明人： Beili Song , Benqing Quan , Yi Jiang , Fanrong Gao
IPC分类号： G02B6/26 , G02B6/42 , G02B5/00 , H01R13/6583
摘要： The present invention provides a module structure, which is adapted for the optical-electric module field in the field of optical communication. The module structure comprises a torsional spring that is fixed to a bail; the torsional spring comprises a left torsional spring and a right torsional spring that are symmetrically provided on the bail; the left torsional spring comprises a first supporting rod, a first screw hole, a first connecting rod and a second screw hole that are sequentially connected; the second screw hole is nested outside a third rotation shaft of the bail, the first screw hole is nested outside the first rotation shaft after passing through the L-shaped-rod formed first connecting rod, and the direction of the first supporting rod is upwardly inclining and forms an angle of less than 90° with the plane where the bail is located. The module has good shielding effect.
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公开(公告)号：US10700488B2
公开(公告)日：2020-06-30
申请号：US16094462
申请日：2016-12-16
发明人： Yan Qin , Fanrong Gao
IPC分类号： H01S5/022 , H01S5/042 , H01S5/0683 , G02B6/42 , H01S5/183
摘要： A COB bonding laser diode interface mating device comprises a laser diode and a driver integrated circuit (2). The laser diode includes a light-emitting chip (11). The light-emitting chip (11) is a bare die directly bonded to a circuit board. The driver integrated circuit (2) is a driver chip that is a packaged chip. The light-emitting chip (11) and the driver chip are connected through a capacitor-resistor network (3). The capacitor-resistor network (3) allows the driver integrated circuit (2) to provide a bias current and a modulation current to the laser diode such that the laser diode is in an activated state. The capacitor-resistor network (3) realizes interface mating between the COB bonding laser diode and the driver integrated circuit (2), thereby solving a problem that the interface mating cannot be easily achieved, reducing costs, and improving production efficiency.
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公开(公告)号：US10175434B2
公开(公告)日：2019-01-08
申请号：US15719548
申请日：2015-12-29
发明人： Yaoxin Luo , Benqing Quan , Fanrong Gao
摘要： A coupling platform of SFP+COB module assembly for photoelectric communication, which comprises a lens clamping part, a PCB clamping part, a coupling adjustment part and a supporting part, wherein the lens clamping part comprises a clamping seat, a movable part, a cam, a connecting seat, a fiber optic patch cord limit plate and a fiber optic patch cord; the PCB clamping part comprises a PCB socket, a clamping jaw and a gas jaw The main body of the coupling adjustment part is a multi-shaft fine-tuning rack. and the supporting part comprises a cushion block and a platform bottom plate. The clamping seat, the movable part and the cam are combined, thereby enabling the cam to drive the movable part to slide up and down in a clamping groove of the clamping seat during rotation. When the movable part moves to an upper end, an LC light port of a plastic lens can be inserted into the clamping seat without obstruction. When the movable part moves to a lower end, the LC light port of the plastic lens is limited by a limiting gap of the movable part. When the cam rotates, the cam drives the movable part to slide to the upper end to replace the plastic lens with a new plastic lens. Accordingly, the present invention solves the technical problems of enabling the plastic lens to be easily positioned and bind a PCB, thereby achieving the beneficial effects of improving the quality and the efficiency and reducing the manufacture cost.
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