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公开(公告)号：US20200286747A1
公开(公告)日：2020-09-10
申请号：US16808251
申请日：2020-03-03
IPC分类号： H01L21/50
摘要： A component source wafer comprises printable components having adhesive disposed on a backside of the printable components. A wafer substrate comprises a sacrificial layer having recessed portions and anchors. A component is disposed entirely over each recessed portion. A tether physically connects each component to at least one of the anchors. A layer of adhesive is disposed on a side of the component adjacent to the recessed portion. Each component is suspended over the wafer substrate and the recessed portion defines a gap separating the component from the wafer substrate.
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公开(公告)号：US11482979B2
公开(公告)日：2022-10-25
申请号：US16207774
申请日：2018-12-03
发明人： António José Marques Trindade , Raja Fazan Gul , Robert R. Rotzoll , Alexandre Chikhaoui , David Gomez , Ronald S. Cok
摘要： A method of making a micro-module structure comprises providing a substrate, the substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.
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公开(公告)号：US11528808B2
公开(公告)日：2022-12-13
申请号：US16207665
申请日：2018-12-03
发明人： David Gomez , Christopher Andrew Bower , Raja Fazan Gul , António José Marques Trindade , Ronald S. Cok
IPC分类号： H05K3/30 , B41F16/00 , B65G47/90 , H03H3/08 , H01L41/29 , H03H3/02 , H05K3/40 , H01L41/313 , H01L21/67
摘要： A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
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公开(公告)号：US10790173B2
公开(公告)日：2020-09-29
申请号：US16207690
申请日：2018-12-03
发明人： David Gomez , Christopher Andrew Bower , Raja Fazan Gul , António José Marques Trindade , Ronald S. Cok
IPC分类号： H01L41/047 , H01L41/053 , H01L33/62 , H01L21/67 , H01L23/498 , H01L23/00 , H01L23/538 , H01L23/053 , H01L23/10 , H01L41/25 , H01L21/683 , H01L23/13 , H03H9/05 , H03H3/02 , H03H3/08 , H01L41/113
摘要： A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.
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公开(公告)号：US20210259114A1
公开(公告)日：2021-08-19
申请号：US17245986
申请日：2021-04-30
发明人： David Gomez , Christopher Andrew Bower , Raja Fazan Gul , António José Marques Trindade , Ronald S. Cok
摘要： A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
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