Conductive plating apparatus, plating system and plating method for conductive film

    公开(公告)号:US11821100B2

    公开(公告)日:2023-11-21

    申请号:US17891164

    申请日:2022-08-19

    IPC分类号: C25D7/06 C25D17/00

    摘要: Provided are a conductive plating apparatus, a plating system and a plating method for a conductive film. The conductive plating apparatus is configured to electrically connect the conductive film with a power supply. A first conductive structure includes a first conductive roller and a first press roller. A second conductive structure includes a second conductive roller and a second press roller. The first and second conductive structures are configured to allow the conductive film to sequentially pass between the first conductive roller and the first press roller and between the second the conductive roller and the second press roller. The first and second press rollers are configured to be brought into contact with and apply pressures to two opposite surfaces of the conductive film, respectively, and to be equipotential. The second press roller and the first conductive roller are configured to be equipotential.

    Fixing structure, battery box, and battery pack

    公开(公告)号:US11749864B2

    公开(公告)日:2023-09-05

    申请号:US17918781

    申请日:2021-07-23

    IPC分类号: H01M50/262 H01M50/249

    摘要: A fixing structure (300) for a battery pack is provided. The battery pack includes a box body (100). The fixing structure (300) is disposed on an outer surface of the box body (100) and includes a first connecting body (301), a second connecting body (302), and a transition body (303). The first connecting body (301) has one end connected with the box body (100). The second connecting body (302) has one end connected with the box body (100). The second connecting body (302) is spaced apart from the first connecting body (301). The transition body (303) has two ends connected with one end of the first connecting body (301) away from the box body (100) and one end of the second connecting body (302) away from the box body (100) respectively.

    Coating device, and coating method for non-uniform thickness current collector

    公开(公告)号:US11777071B2

    公开(公告)日:2023-10-03

    申请号:US17882698

    申请日:2022-08-08

    IPC分类号: H01M4/04

    CPC分类号: H01M4/0404 H01M4/0411

    摘要: Provided are a coating device and a coating method for a non-uniform thickness current collector. The coating device includes a thickness sensor, an offset correction controller, and an offset correction mechanism. The thickness sensor is configured to detect an abrupt thickness change point on the non-uniform thickness current collector and output an abrupt change point signal. The offset correction controller is configured to receive the abrupt change point signal, compare the received abrupt change point signal with a predetermined abrupt thickness change point signal, determine whether the non-uniform thickness current collector is offset and what an offset direction is, and transmit an offset correction signal. The offset correction mechanism is configured to receive the offset correction signal and perform an offset correction action in a direction opposite to the offset direction. This coating device uses the coating method and can accurately coat the coating areas.