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公开(公告)号：US11990577B2
公开(公告)日：2024-05-21
申请号：US17465075
申请日：2021-09-02
Inventor： Shaohua Huang , Xiaoqiang Zeng , Jianfeng Yang , Canyuan Zhang
IPC: H01L33/62 , H01L25/075 , H01L25/16 , H01L33/64
CPC classification number: H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/647 , H01L2933/0066 , H01L2933/0075
Abstract: A light-emitting device includes a lead frame having a first surface on which a patterned conductive layer is provided, and a light-emitting element. The light-emitting element includes an insulating substrate formed on the first surface, a plurality of light-emitting units formed on the insulating substrate, at least one first electrode, at least one second electrode and at least a pair of bonding wires. The first and second electrodes are respectively placed in electrical connection with a first one and a second one of the light-emitting units, and are disposed outward of the light-emitting units. Each of the pair of bonding wires is disposed to electrically connect a respective one of the first and second electrodes to the patterned conductive layer.
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公开(公告)号：US11309297B2
公开(公告)日：2022-04-19
申请号：US16995551
申请日：2020-08-17
Inventor： Xiaoqiang Zeng , Shaohua Huang , Jianfeng Yang , Canyuan Zhang
Abstract: A light-emitting diode (LED) chip includes a semiconductor epitaxial structure, an insulating substrate, a first metal layer, and a second metal layer. The semiconductor epitaxial structure includes a first semiconductor epitaxial layer, a second semiconductor epitaxial layer, and a light-emitting layer interposed between the first semiconductor epitaxial layer and the second semiconductor epitaxial layer. The insulating substrate has two opposite surfaces, and the first and second metal layers are respectively disposed on the two surfaces of the insulating substrate. An LED device and an LED lamp including the LED chip are also disclosed.
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