公开(公告)号：US20240321793A1

公开(公告)日：2024-09-26

申请号：US18125660

申请日：2023-03-23

Applicant: XILINX, INC.

Inventor： Yun WU ,  Henley LIU ,  Myongseob KIM ,  Chris LEE ,  Cheang Whang CHANG

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L24/05 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/06132 ,  H01L2224/06177 ,  H01L2224/06179 ,  H01L2224/16227 ,  H01L2924/381 ,  H01L2924/3841

Abstract: An integrated circuit (IC) die includes a body having a dielectric layer and a plurality of contact pads formed on the dielectric layer. The IC die also includes a passivation layer disposed on the dielectric layer. The passivation layer has a plurality of openings exposing the plurality of contact pads. A plurality of inner under-bump-metallurgy (“UBM”) structures are disposed on a first portion of the plurality of openings, and a plurality of outer UBM structures are disposed on a second portion of the plurality of openings. The plurality of inner UBM structures have uniform spacing in a direction parallel to an edge of the body. The plurality of outer UBM structures are positioned around the plurality of inner UBM structures, and each of the plurality of outer UBM structures having a longitudinal axis directed toward a central area of the IC die.