公开(公告)号：US20230376248A1

公开(公告)日：2023-11-23

申请号：US18226193

申请日：2023-07-25

Applicant: XILINX, INC.

Inventor： Ygal ARBEL ,  Ian A. SWARBRICK ,  Sagheer AHMAD

IPC: G06F3/06 ,  G06F13/40 ,  G06F1/28 ,  G06F1/3287

CPC classification number: G06F3/0659 ,  G06F3/0604 ,  G06F3/0634 ,  G06F13/4022 ,  G06F1/28 ,  G06F3/0679 ,  G06F1/3287 ,  G06F2213/0038

Abstract: Examples of the present disclosure generally relate to integrated circuits, such as a system-on-chip (SoC), that include a memory subsystem. In some examples, an integrated circuit includes a first master circuit in a first power domain on a chip; a second master circuit in a second power domain on the chip; and a first memory controller in a third power domain on the chip. The first master circuit and the second master circuit each are configured to access memory via the first memory controller. The first power domain and the second power domain each are separate and independent from the third power domain.