公开(公告)号：US20150162245A1

公开(公告)日：2015-06-11

申请号：US14596185

申请日：2015-01-13

Applicant: XINTEC INC.

Inventor： Bing-Siang CHEN ,  Chien-Hui CHEN ,  Shu-Ming CHANG ,  Tsang-Yu LIU ,  Yen-Shih HO

IPC: H01L21/78 ,  H01L25/00

CPC classification number: H01L21/78 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06582 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00

Abstract: An embodiment of the invention provides a chip package which includes: a first chip; a second chip disposed on the first chip, wherein a side surface of the second chip is a chemically-etched surface; and a bonding bulk disposed between the first chip and the second chip such that the first chip and the second chip are bonded with each other.

Abstract translation: 本发明的实施例提供一种芯片封装，其包括：第一芯片; 设置在所述第一芯片上的第二芯片，其中所述第二芯片的侧表面是化学蚀刻表面; 以及设置在所述第一芯片和所述第二芯片之间的结合体，使得所述第一芯片和所述第二芯片彼此结合。