公开(公告)号：US20170186797A1

公开(公告)日：2017-06-29

申请号：US15393006

申请日：2016-12-28

Applicant: XINTEC INC.

Inventor： Shun-Wen LONG ,  Guo-Jyun CHIOU ,  Meng-Han KUO ,  Ming-Chieh HUANG ,  Hsi-Chien LIN ,  Chin-Kang CHEN ,  Yi-Pin CHEN

IPC: H01L27/146

CPC classification number: H01L27/14629 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14698 ,  H01L2224/11

Abstract: A chip package includes a chip, an insulating layer and a conductive layer. The chip includes a substrate, an epitaxy layer, a device region and a conductive pad. The epitaxy layer is disposed on the substrate, and the device region and the conductive pad are disposed on the epitaxy layer. The conductive pad is at a side of the device region and connected to the device region. The conductive pad protrudes out of a side surface of the epitaxy layer. The insulating layer is disposed below the substrate and extended to cover the side surface of the epitaxy layer. The conductive layer is disposed below the insulating layer and extended to contact the conductive pad. The conductive layer and the side surface of the epitaxy layer are separated by a first distance.

公开(公告)号：US20170088417A1

公开(公告)日：2017-03-30

申请号：US15275693

申请日：2016-09-26

Applicant: XINTEC INC.

Inventor： Yu-Chen LAI ,  Meng-Han KUO ,  Ming-Chieh HUANG ,  Hsi-Chien LIN

IPC: B81C1/00 ,  B81B7/00 ,  H01L27/146

CPC classification number: H01L27/146 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00238 ,  B81C2203/0792

Abstract: An electronic device includes an image sensor that has a device layer and a MEMS device that is located on the image sensor and includes a MEMS element, a cap element, and a cover layer. The MEMS element having plural hollow regions is located on the device layer, such that a first cavity is formed between the MEMS element and the image sensor. The cap element having an opening is located on a surface of the MEMS element facing away from the device layer, such that a second cavity is formed between the cap element and the MEMS element and communicates with the opening. The first cavity communicates with the second cavity through the hollow regions. The cover layer is located on a surface of the cap element facing away from the MEMS element and is located in the opening of the cap element.