公开(公告)号：US09711425B2

公开(公告)日：2017-07-18

申请号：US15237287

申请日：2016-08-15

Applicant: XINTEC INC.

Inventor： Shu-Ming Chang ,  Po-Chang Huang ,  Tsang-Yu Liu ,  Yu-Lung Huang ,  Chi-Chang Liao

IPC: H01L23/31 ,  G06K9/00 ,  H01L23/48

CPC classification number: H01L23/3121 ,  G06K9/00013 ,  G06K9/0002 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/481 ,  H01L2224/11

Abstract: A sensing module is provided. The sensing module includes a sensing device. The sensing device includes a first substrate having a first surface and a second surface opposite thereto. The sensing device also includes a sensing region adjacent to the first surface and a conducting pad on the first surface. The sensing device further includes a redistribution layer on the second surface and electrically connected to the conducting pad. The sensing module also includes a second substrate and a cover plate bonded to the sensing device so that the sensing device is between the second substrate and the cover plate. The conducting pad is electrically connected to the second substrate through the redistribution layer. The sensing module further includes an encapsulating layer filled between the second substrate and the cover plate to surround the sensing device.