Abstract:
An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac epoxy resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.
Abstract:
A device and method for preparing a device having a superoleophobic surface are disclosed. The method includes providing a substrate; coating a lift-off resist layer on the substrate; baking the lift-off resist layer; layering a photoresist layer on the lift-off resist layer; performing photolithography to create a textured pattern in the photoresist layer and the lift-off resist layer, and chemically modifying the textured pattern to create a superoleophobic surface.
Abstract:
The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bonding the plates together. The printhead assembly includes a second adhesive surrounding an outer edge of the first adhesive wherein the second adhesive has an oxygen migration rate lower than an oxygen migration rate of the first adhesive. An oxygen sensitive component is contained within the outer edge of the first adhesive.
Abstract:
A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.
Abstract:
A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.
Abstract:
Inkjet printheads containing a first plate, a second plate, and a cured adhesive composition disposed between and bonding the first plate and the second plate. The cured adhesive composition has a glass transition temperature of greater than about 115° C. and is stable when exposed to acrylate monomer. Also, inkjet printheads having a first plate, a second plate, and a cured thin film adhesive disposed between and bonding to both of the first plate and the second plate. The cured thin film adhesive contains a polyimide film disposed between a cured first adhesive layer and a cured second adhesive layer. Methods of preparing such inkjet printheads.
Abstract:
The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bonding the plates together. The printhead assembly includes a second adhesive surrounding an outer edge of the first adhesive wherein the second adhesive has an oxygen migration rate lower than an oxygen migration rate of the first adhesive. An oxygen sensitive component is contained within the outer edge of the first adhesive.
Abstract:
The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bonding the plates together. The printhead assembly includes a second adhesive surrounding an outer edge of the first adhesive wherein the second adhesive has an oxygen migration rate lower than an oxygen migration rate of the first adhesive. An oxygen sensitive component is contained within the outer edge of the first adhesive.
Abstract:
A three-dimensional object printing system comprises a ejectors configured to eject drops of material towards a platen, a heater, a sensor configured to sense temperature of the ejected material, a radiator configured to direct radiation to the ejected material, a cooler configured to cool the ejected material, and a controller operatively connected to the ejectors, heater, sensor radiator and cooler. The controller is configured to control the ejectors to form layers of material for a three-dimensional object on the surface of the platen with reference to image data of the three-dimensional object, to operate the heater to heat the surface of the platen, to compare a temperature signal received from the sensor to a predetermined threshold, to operate the radiator to radiate the object layers, and to operate the cooler to attenuate heat produced by the radiated material in response to the signal from sensor exceeding the predetermined threshold.
Abstract:
The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bonding the plates together. The printhead assembly includes a second adhesive surrounding an outer edge of the first adhesive wherein the second adhesive has an oxygen migration rate lower than an oxygen migration rate of the first adhesive. An oxygen sensitive component is contained within the outer edge of the first adhesive.