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1.REDUCTION OF ARC-TRACKING IN CHIP ON FLEXIBLE CIRCUIT SUBSTRATES 审中-公开
Title translation: 在柔性电路基板上减少芯片中的电弧跟踪公开(公告)号:US20130333208A1
公开(公告)日:2013-12-19
申请号:US13973273
申请日:2013-08-22
Applicant: Xerox Corporation
Inventor: Mirza Sabanovic , David P. Platt , Chad David Freitag , Joseph Andrew Broderick
CPC classification number: B41J2/1623 , B41J2/145 , B41J2/1626 , B41J2/1628 , B41J2/17593 , B41J2/415 , H05K1/0256 , H05K1/189 , H05K3/0026 , H05K3/0029 , H05K3/0032 , H05K3/10 , H05K2201/0154 , H05K2201/09063 , Y10T29/49124 , Y10T29/49155 , Y10T29/49401
Abstract: A method of manufacturing a flexible circuit, including forming a first set of traces, forming a second set of traces, and cutting a gap between the first and second set of traces.
Abstract translation: 一种制造柔性电路的方法,包括形成第一组迹线,形成第二组迹线,以及切割第一和第二组迹线之间的间隙。
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公开(公告)号:US09358789B2
公开(公告)日:2016-06-07
申请号:US13973273
申请日:2013-08-22
Applicant: Xerox Corporation
Inventor: Mirza Sabanovic , David P. Platt , Chad David Freitag , Joseph Andrew Broderick
CPC classification number: B41J2/1623 , B41J2/145 , B41J2/1626 , B41J2/1628 , B41J2/17593 , B41J2/415 , H05K1/0256 , H05K1/189 , H05K3/0026 , H05K3/0029 , H05K3/0032 , H05K3/10 , H05K2201/0154 , H05K2201/09063 , Y10T29/49124 , Y10T29/49155 , Y10T29/49401
Abstract: A method of manufacturing a flexible circuit, including forming a first set of traces, forming a second set of traces, and cutting a gap between the first and second set of traces.
Abstract translation: 一种制造柔性电路的方法,包括形成第一组迹线,形成第二组迹线,以及切割第一和第二组迹线之间的间隙。
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