公开(公告)号：US07160791B2

公开(公告)日：2007-01-09

申请号：US10931149

申请日：2004-08-30

申请人： Xiao Charles Yang

发明人： Xiao Charles Yang

IPC分类号： H01L21/00

CPC分类号： H01L21/30608 ,  G02B26/0833

摘要： A method for forming a standoff structure for packaging devices, e.g., optical devices, integrated circuit devices. The method includes providing a substrate, e.g., silicon wafer. The substrate includes a first surface region, a second surface region, and a thickness defined between the first surface region and the second surface region. The method includes protecting selected portions of the first surface region using a masking layer while leaving a plurality of unprotected regions. Preferably, each of the unprotected regions is to be associated with an opening through the thickness of the substrate. The method causes removal of the plurality of unprotected regions to form a plurality of openings through the thickness of the substrate to provide a resulting patterned substrate. Each of the openings is bordered by a portion of the selected portions of the first surface region. Preferably, etching techniques, such as wet etch or dry etching, can be used, depending upon the embodiment. The method removes the masking layer via ashing or stripping. In a specific embodiment, the method further includes bonding a handle substrate to the patterned substrate. Preferably, the handle substrate is optically transparent. Each of the openings is bordered by a portion of the handle substrate to form a recessed region.

摘要翻译： 一种用于形成包装装置（例如光学装置，集成电路装置）的支架结构的方法。 该方法包括提供衬底，例如硅晶片。 基板包括第一表面区域，第二表面区域和限定在第一表面区域和第二表面区域之间的厚度。 该方法包括使用掩模层保护第一表面区域的选定部分，同时留下多个未保护区域。 优选地，每个未保护区域与通过基底的厚度的开口相关联。 该方法导致多个未保护区域的移除以形成穿过基底的厚度的多个开口，以提供所得到的图案化衬底。 每个开口由第一表面区域的所选部分的一部分界定。 优选地，根据实施例，可以使用蚀刻技术，例如湿蚀刻或干蚀刻。 该方法通过灰化或剥离除去掩蔽层。 在具体实施例中，该方法还包括将处理衬底接合到图案化衬底。 优选地，手柄基板是光学透明的。 每个开口由手柄基板的一部分界定以形成凹陷区域。

公开(公告)号：US07449284B2

公开(公告)日：2008-11-11

申请号：US10843909

申请日：2004-05-11

申请人： Xiao Charles Yang

发明人： Xiao Charles Yang

IPC分类号： G03F7/00

CPC分类号： B81C1/00484 ,  B81C2203/036 ,  B81C2203/051

摘要： A method for fabricating mechanical structures from bonding substrates. The method includes providing a bonded substrate structure, which includes a first substrate having a first thickness of silicon material and a first face. The bonded substrate also includes a second substrate having a second thickness and a second face. At least the first substrate or at least the second substrate (or both) has an alignment mark comprising a front-size zero mark within a portion of either the first thickness or the second thickness. The method includes applying a layer of photomasking material overlying a first backside surface of the first substrate. The method includes illuminating electromagnetic radiation using a coherent light source through the layer of photoresist material and through a portion of the first thickness. The method includes detecting an indication of the alignment mark using a signal associated with a portion of the electromagnetic radiation from a second backside of the second substrate. The method also includes exposing a portion of the layer of photomasking material once a pattern a portion of a reticle structure has been aligned using the alignment mark.

摘要翻译： 一种从接合基板制造机械结构的方法。 该方法包括提供键合衬底结构，其包括具有第一厚度的硅材料和第一面的第一衬底。 键合衬底还包括具有第二厚度和第二面的第二衬底。 至少第一基板或至少第二基板（或两者）具有在第一厚度或第二厚度的一部分内包括前尺寸零标记的对准标记。 该方法包括施加覆盖在第一衬底的第一背面上的光掩模材料层。 该方法包括使用相干光源穿过光致抗蚀剂材料层并通过第一厚度的一部分来照射电磁辐射。 该方法包括使用与来自第二基板的第二背面的电磁辐射的一部分相关联的信号来检测对准标记的指示。 该方法还包括使用对准标记将掩模版结构的一部分的图案一旦曝光一部分光掩模材料层。

公开(公告)号：US20080191221A1

公开(公告)日：2008-08-14

申请号：US12029899

申请日：2008-02-12

申请人： Xiao Charles Yang ,  Dongmin Chen ,  Philip Chen

发明人： Xiao Charles Yang ,  Dongmin Chen ,  Philip Chen

IPC分类号： H01L33/00

CPC分类号： B81C1/00873 ,  B81B2201/047 ,  H01L24/05 ,  H01L33/483 ,  H01L2224/04042 ,  H01L2224/48463 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00

摘要： A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.

摘要翻译： 一种多层集成光电路装置。 该器件具有包括其上的至少一个集成电路芯片的第一衬底，其具有单元区域和外围区域。 优选地，外围区域具有接合焊盘区域，其具有一个或多个接合焊盘和围绕一个或多个接合焊盘的每一个的抗静电区域。 该装置具有第二基板，其上具有至少一个或多个偏转装置，其上连接到第一基板。 至少一个或多个接合焊盘暴露在第一衬底上。 该装置具有覆盖第二基板的透明构件，同时形成空腔区域以允许一个或多个偏转装置在空腔区域的一部分内移动以形成夹层结构，该夹层结构包括第一基板的至少一部分， 第二基板和透明部件的一部分。 一个或多个接合焊盘和抗静电区域被暴露，同时一个或多个偏转装置保持在空腔区域的部分内。