Method and device for wafer scale packaging of optical devices using a scribe and break process
    1.
    发明授权
    Method and device for wafer scale packaging of optical devices using a scribe and break process 有权
    使用划痕和断裂工艺的光学器件的晶片级封装的方法和装置

    公开(公告)号:US09006878B2

    公开(公告)日:2015-04-14

    申请号:US12891518

    申请日:2010-09-27

    IPC分类号: H01L33/48 B81C1/00 H01L23/00

    摘要: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.

    摘要翻译: 一种多层集成光电路装置。 该器件具有包括其上的至少一个集成电路芯片的第一衬底,其具有单元区域和外围区域。 优选地,外围区域具有接合焊盘区域,其具有一个或多个接合焊盘和围绕一个或多个接合焊盘的每一个的抗静电区域。 该装置具有第二基板,其上具有至少一个或多个偏转装置,其上连接到第一基板。 至少一个或多个接合焊盘暴露在第一衬底上。 该装置具有覆盖第二基板的透明构件,同时形成空腔区域以允许一个或多个偏转装置在空腔区域的一部分内移动以形成夹层结构,该夹层结构包括第一基板的至少一部分, 第二基板和透明部件的一部分。 一个或多个接合焊盘和抗静电区域被暴露,同时一个或多个偏转装置保持在空腔区域的部分内。

    Method and device for wafer scale packaging of optical devices using a scribe and break process
    2.
    发明授权
    Method and device for wafer scale packaging of optical devices using a scribe and break process 有权
    使用划痕和断裂工艺的光学器件的晶片级封装的方法和装置

    公开(公告)号:US07344956B2

    公开(公告)日:2008-03-18

    申请号:US11008483

    申请日:2004-12-08

    IPC分类号: H01L21/76

    摘要: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.

    摘要翻译: 一种多层集成光电路装置。 该器件具有包括其上的至少一个集成电路芯片的第一衬底,其具有单元区域和外围区域。 优选地,外围区域具有接合焊盘区域,其具有一个或多个接合焊盘和围绕一个或多个接合焊盘的每一个的抗静电区域。 该装置具有第二基板,其上具有至少一个或多个偏转装置,其上连接到第一基板。 至少一个或多个接合焊盘暴露在第一衬底上。 该装置具有覆盖第二基板的透明构件,同时形成空腔区域以允许一个或多个偏转装置在空腔区域的一部分内移动以形成夹层结构,该夹层结构包括第一基板的至少一部分, 第二基板和透明部件的一部分。 一个或多个接合焊盘和抗静电区域被暴露,同时一个或多个偏转装置保持在空腔区域的部分内。

    METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USING A SCRIBE AND BREAK PROCESS
    3.
    发明申请
    METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USING A SCRIBE AND BREAK PROCESS 有权
    使用筛选和断开过程的光学设备的波长定型包装的方法和装置

    公开(公告)号:US20080191221A1

    公开(公告)日:2008-08-14

    申请号:US12029899

    申请日:2008-02-12

    IPC分类号: H01L33/00

    摘要: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.

    摘要翻译: 一种多层集成光电路装置。 该器件具有包括其上的至少一个集成电路芯片的第一衬底,其具有单元区域和外围区域。 优选地,外围区域具有接合焊盘区域,其具有一个或多个接合焊盘和围绕一个或多个接合焊盘的每一个的抗静电区域。 该装置具有第二基板,其上具有至少一个或多个偏转装置,其上连接到第一基板。 至少一个或多个接合焊盘暴露在第一衬底上。 该装置具有覆盖第二基板的透明构件,同时形成空腔区域以允许一个或多个偏转装置在空腔区域的一部分内移动以形成夹层结构,该夹层结构包括第一基板的至少一部分, 第二基板和透明部件的一部分。 一个或多个接合焊盘和抗静电区域被暴露,同时一个或多个偏转装置保持在空腔区域的部分内。

    METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USING A SCRIBE AND BREAK PROCESS
    4.
    发明申请
    METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USING A SCRIBE AND BREAK PROCESS 有权
    使用筛选和断开过程的光学设备的波长定型包装的方法和装置

    公开(公告)号:US20110012166A1

    公开(公告)日:2011-01-20

    申请号:US12891518

    申请日:2010-09-27

    IPC分类号: H01L33/48

    摘要: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.

    摘要翻译: 一种多层集成光电路装置。 该器件具有包括其上的至少一个集成电路芯片的第一衬底,其具有单元区域和外围区域。 优选地,外围区域具有接合焊盘区域,其具有一个或多个接合焊盘和围绕一个或多个接合焊盘的每一个的抗静电区域。 该装置具有第二基板,其上具有至少一个或多个偏转装置,其上连接到第一基板。 至少一个或多个接合焊盘暴露在第一衬底上。 该装置具有覆盖第二基板的透明构件,同时形成空腔区域以允许一个或多个偏转装置在空腔区域的一部分内移动以形成夹层结构,该夹层结构包括第一基板的至少一部分, 第二基板和透明部件的一部分。 一个或多个接合焊盘和抗静电区域被暴露,同时一个或多个偏转装置保持在空腔区域的部分内。

    Method and device for wafer scale packaging of optical devices using a scribe and break process
    6.
    发明授权
    Method and device for wafer scale packaging of optical devices using a scribe and break process 有权
    使用划痕和断裂工艺的光学器件的晶片级封装的方法和装置

    公开(公告)号:US07825519B2

    公开(公告)日:2010-11-02

    申请号:US12029899

    申请日:2008-02-12

    IPC分类号: H01L23/48

    摘要: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.

    摘要翻译: 一种多层集成光电路装置。 该器件具有包括其上的至少一个集成电路芯片的第一衬底,其具有单元区域和外围区域。 优选地,外围区域具有接合焊盘区域,其具有一个或多个接合焊盘和围绕一个或多个接合焊盘的每一个的抗静电区域。 该装置具有第二基板,其上具有至少一个或多个偏转装置,其上连接到第一基板。 至少一个或多个接合焊盘暴露在第一衬底上。 该装置具有覆盖第二基板的透明构件,同时形成空腔区域以允许一个或多个偏转装置在空腔区域的一部分内移动以形成夹层结构,该夹层结构包括第一基板的至少一部分, 第二基板和透明部件的一部分。 一个或多个接合焊盘和抗静电区域被暴露,同时一个或多个偏转装置保持在空腔区域的部分内。

    METHOD AND SYSTEM FOR UTILIZING PEROVSKITE MATERIAL FOR CHARGE STORAGE AND AS A DIELECTRIC
    7.
    发明申请
    METHOD AND SYSTEM FOR UTILIZING PEROVSKITE MATERIAL FOR CHARGE STORAGE AND AS A DIELECTRIC 有权
    用于充电储存和作为电介质的PEROVSKITE材料的方法和系统

    公开(公告)号:US20130279236A1

    公开(公告)日:2013-10-24

    申请号:US13918537

    申请日:2013-06-14

    IPC分类号: G11C11/22 H01L29/51

    摘要: Memory devices and methods for providing the memory devices are provided. The memory devices utilize multiple metal oxide layers. The methods for providing the memory devices can include providing a transistor; producing a capacitor that includes metal layers and metal oxide layers; connecting the capacitor to a side of the transistor; and providing a wordline, bitline, and driveline through connection with the transistor or the capacitor.

    摘要翻译: 提供了用于提供存储器件的存储器件和方法。 存储器件利用多个金属氧化物层。 用于提供存储器件的方法可以包括提供晶体管; 制造包括金属层和金属氧化物层的电容器; 将电容器连接到晶体管的一侧; 并通过与晶体管或电容器的连接来提供字线,位线和传动系。

    MEMS mirror system for laser printing applications
    8.
    发明授权
    MEMS mirror system for laser printing applications 有权
    用于激光打印应用的MEMS镜系统

    公开(公告)号:US08361331B2

    公开(公告)日:2013-01-29

    申请号:US13009964

    申请日:2011-01-20

    IPC分类号: B29D11/00 H01L21/302

    摘要: A MEMS mirror for a laser printing application includes providing a CMOS substrate including a pair of electrodes, and providing a reflecting mirror moveable over the substrate and the electrodes. Voltages applied to the electrodes create an electrostatic force causing an end of the mirror to be attracted to the substrate. A precise position of the mirror can be detected and controlled by sensing a change in capacitance between the mirror ends and the underlying electrodes.

    摘要翻译: 用于激光打印应用的MEMS镜包括提供包括一对电极的CMOS衬底,以及提供可移动到衬底和电极上的反射镜。 施加到电极的电压产生静电力,导致反射镜的一端被吸引到基板。 可以通过感测镜端和底层电极之间的电容变化来检测和控制反射镜的精确位置。

    MEMS mirror system for laser printing applications
    9.
    发明授权
    MEMS mirror system for laser printing applications 有权
    用于激光打印应用的MEMS镜系统

    公开(公告)号:US07898561B2

    公开(公告)日:2011-03-01

    申请号:US12019822

    申请日:2008-01-25

    IPC分类号: B41J2/47

    摘要: A MEMS mirror for a laser printing application includes providing a CMOS substrate including a pair of electrodes, and providing a reflecting mirror moveable over the substrate and the electrodes. Voltages applied to the electrodes create an electrostatic force causing an end of the mirror to be attracted to the substrate. A precise position of the mirror can be detected and controlled by sensing a change in capacitance between the mirror ends and the underlying electrodes.

    摘要翻译: 用于激光打印应用的MEMS镜包括提供包括一对电极的CMOS衬底,以及提供可移动到衬底和电极上的反射镜。 施加到电极的电压产生静电力,导致反射镜的一端被吸引到基板。 可以通过感测镜端和底层电极之间的电容变化来检测和控制反射镜的精确位置。

    Method and structure for forming an integrated spatial light modulator
    10.
    发明授权
    Method and structure for forming an integrated spatial light modulator 有权
    形成集成空间光调制器的方法和结构

    公开(公告)号:US07670880B2

    公开(公告)日:2010-03-02

    申请号:US11670362

    申请日:2007-02-01

    IPC分类号: H01L21/00

    CPC分类号: G02B26/0841

    摘要: A method of fabricating an integrated spatial light modulator. The method includes providing a first substrate including a bonding surface and processing a device substrate to form at least an electrode layer. The method also includes depositing a first portion of a multi-layer standoff layer on the electrode layer, depositing a second portion of the multi-layer standoff layer on the first portion of the multi-layer standoff layer, and forming electrically insulating standoff structures from the multi-layer standoff layer. The method further includes joining the bonding surface of the first substrate to the standoff structures on the device substrate, thinning the first substrate, patterning the first substrate to form a mask, and forming a plurality of moveable structures from the first substrate. The moveable structures are aligned with at least one of the plurality of electrodes and adapted to rotate with respect to the standoff structures.

    摘要翻译: 一种制造集成空间光调制器的方法。 该方法包括提供包括接合表面的第一基底和处理器件基底以形成至少一个电极层。 该方法还包括在电极层上沉积多层间隔层的第一部分,在多层间隔层的第一部分上沉积多层间隔层的第二部分,并且形成电绝缘的支架结构 多层间隔层。 该方法还包括将第一衬底的接合表面连接到器件衬底上的间隔结构,使第一衬底变薄,图案化第一衬底以形成掩模,以及从第一衬底形成多个可移动结构。 可移动结构与多个电极中的至少一个对准,并适于相对于间隔结构旋转。