公开(公告)号：US20140262440A1

公开(公告)日：2014-09-18

申请号：US13827048

申请日：2013-03-14

Applicant: Xilinx, Inc.

Inventor： Namhoon Kim ,  Joong-Ho Kim ,  Suresh Ramalingam ,  Paul Y. Wu ,  Woon-Seong Kwon ,  Dennis C.P. Leung

IPC: H05K1/02

CPC classification number: H05K1/02 ,  H01L23/49822 ,  H01L23/66 ,  H01L2224/16225

Abstract: A multi-layer core organic package substrate includes: a multi-layer core comprising at least two organic core layers, wherein two of the at least two organic core layers are separated by a core metal layer; a first plurality of build-up layers formed on top of the multi-core layer; and a second plurality of build-up layers formed below the multi-core layer.

Abstract translation: 多层核心有机封装基板包括：包含至少两个有机芯层的多层芯，其中所述至少两个有机芯层中的两个被芯金属层分隔开; 形成在所述多芯层的顶部上的第一多个堆积层; 以及形成在所述多芯层下方的第二多个积聚层。