公开(公告)号：US20200152546A1

公开(公告)日：2020-05-14

申请号：US16186178

申请日：2018-11-09

Applicant: Xilinx, Inc.

Inventor： Gamal Refai-Ahmed ,  Ho Hyung Lee ,  Hui-Wen Lin ,  Henley Liu ,  Suresh Ramalingam

IPC: H01L23/40 ,  H01L23/48 ,  H01L23/00 ,  H01L23/427

Abstract: Examples described herein provide for an electronic device apparatus with multiple thermally conductive paths for heat dissipation. In an example, an electronic device apparatus includes a package comprising a die attached to a package substrate. The electronic device apparatus further includes a ring stiffener disposed around the die and on the package substrate, a heat sink disposed on the package, and a wedge disposed between the heat sink and the ring stiffener.

公开(公告)号：US10720377B2

公开(公告)日：2020-07-21

申请号：US16186178

申请日：2018-11-09

Applicant: Xilinx, Inc.

Inventor： Gamal Refai-Ahmed ,  Ho Hyung Lee ,  Hui-Wen Lin ,  Henley Liu ,  Suresh Ramalingam

IPC: H01L29/40 ,  H01L23/40 ,  H01L23/48 ,  H01L23/00 ,  H01L23/427

Abstract: Examples described herein provide for an electronic device apparatus with multiple thermally conductive paths for heat dissipation. In an example, an electronic device apparatus includes a package comprising a die attached to a package substrate. The electronic device apparatus further includes a ring stiffener disposed around the die and on the package substrate, a heat sink disposed on the package, and a wedge disposed between the heat sink and the ring stiffener.