公开(公告)号：US08916420B2

公开(公告)日：2014-12-23

申请号：US13900494

申请日：2013-05-22

Applicant: Xintec Inc.

Inventor： Baw-Ching Perng ,  Chun-Lung Huang

IPC: H01L23/433 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/433 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2224/82 ,  H01L2924/00

Abstract: An embodiment provides a chip package including a substrate, a cavity extending downward from an upper surface of the substrate, a metal layer overlying the substrate and conformally covering a sidewall and a bottom portion of the cavity, a chip having an upper surface and located on the metal layer in the cavity, wherein the upper surface is not lower than an upper surface of the metal layer outside of the cavity, and the protective layer covering the chip.

Abstract translation: 一个实施例提供了一种芯片封装，其包括基板，从基板的上表面向下延伸的空腔，覆盖基板并保形地覆盖空腔的侧壁和底部的金属层，具有上表面并位于 所述空腔中的所述金属层，其中所述上表面不低于所述空腔外部的所述金属层的上表面，并且所述保护层覆盖所述芯片。