Abstract:
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon. There are spaces around the electrode structures and a layer of inorganic filler in the spaces. The thickness of the layer of inorganic filler is the same as the thickness of the electrode structures.
Abstract:
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon. There are spaces around the electrode structures and a layer of organic filler in the spaces. The thickness of the layer of organic filler is the same as the thickness of the electrode structures.
Abstract:
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a multiplicity of electrode structures; and a bank structure defining a multiplicity of pixel openings on the electrode structures. The bank structure has a height adjacent to the pixel opening, hA, and a height removed from the pixel opening, hR, and hA is significantly less than hR.
Abstract:
There is provided a process for forming an organic electronic device. The process includes the steps of providing a TFT substrate;forming a thick organic planarization layer over the substrate; forming on the planarization layer a multiplicity of thin first electrode structures having a first thickness, where the electrode structures have tapered edges with a taper angle of no greater than 75°; forming a buffer layer by liquid deposition of a composition including a buffer material in a first liquid medium, the buffer layer having a second thickness, wherein the second thickness is at least 20% greater than the first thickness; forming over the buffer layer a chemical containment pattern defining pixel openings; depositing into at least a portion of the pixel openings a composition including a first active material in a second liquid medium; and forming a second electrode.
Abstract:
There is provided a process for forming an organic electronic device wherein a TFT substrate having a non-planar surface has deposited over that substrate a planarization layer such that a substantially planar substrate, or planarized substrate, is formed. A multiplicity of thin first electrode structures having a first thickness and having tapered edges with a taper angle of no greater than 75° are formed over the planarized substrate. A multiplicity of active layers is formed over the planarized substrate. Then a buffer layer is formed by liquid deposition of a composition comprising a buffer material in a first liquid medium. The buffer layer has a second thickness which is at least 20% greater than the first thickness. A chemical containment pattern defining pixel openings is then formed over the buffer layer. A composition comprising a first active material in a second liquid medium is deposited into at least a portion of the pixel openings. Then a second electrode is formed.
Abstract:
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a multiplicity of electrode structures; and a bank structure defining a multiplicity of pixel openings on the electrode structures. The bank structure has a height adjacent to the pixel opening, hA, and a height removed from the pixel opening, hR, and hA is significantly less than hR.
Abstract:
There is provided a method of printing a regular array of rows of subpixels on a workpiece. The subpixels have c different colors and have a subpixel pitch s. A printing head has z nozzles arranged in a row with a spacing p, where z=n1(c) and p=(c−1)(s), the printhead being at a first position relative to the workpiece. There are c different printing inks, one for each of the c colors, and each of the printing inks is supplied to the nozzles in a regular alternating pattern. The method includes steps of printing a first set of z rows of subpixels with the printing head; moving the workpiece laterally relative to the printing head by a distance d1, where d1=z(s); printing a second set of z rows of subpixels with the printing head; repeating the printing steps n2 times for a total of n2+2 sets of z rows of subpixels. Variables include: c, an integer greater than 1; n1, an integer greater than 0, with the proviso that when c is an odd number, then n1 is an odd number; and n2, an integer greater than 0.
Abstract:
There is provided a process of forming a regular array of rows of subpixels on a workpiece. The subpixels having four different colors, and a subpixel pitch s. Of the four colors, q colors are formed by printing and r colors are formed by a non-printing method. The process includes the steps: (1) providing a printing head having z nozzles arranged in a row with a spacing between the nozzles of p, where z=4n1 and p=3s, the printhead being at a first position relative to the workpiece; (2) providing q different printing inks, one for each of the q printed colors; (3) supplying each of the printing inks to the nozzles in a regular alternating pattern; (4) printing a first set of z rows of subpixels with the printing head; (5) moving and printing in a first printing pattern by: (a) moving the workpiece laterally relative to the printing head by a distance d1, where d1=4n2s; (b) printing a set of z rows of subpixels with the printing head; (6) moving and printing in a second printing pattern by: (c) moving the workpiece laterally relative to the printing head by a distance d2, where d2=d1; (d) printing a set of z rows of subpixels with the printing head; (7) moving and printing in a third printing pattern by: (e) moving the workpiece laterally relative to the printing head by a distance d3, where d3=4n3s, such that d1+d2+d3=pz; and (f) printing a set of z rows of subpixels with the printing head; (8) repeating steps (5) through (7) multiple times in the same order; and (9) applying r colors by a non-printing method;where: n1 is an integer greater than 0; n2 is an integer greater than 0, such that the integer is not a multiple of three and n2≦n1; n3 is an integer such that 2n2+n3=3n1; q is an integer from 1-4; and r is an integer, such that q+r=4.
Abstract:
In the fabrication of a display, such as an OLED display, the OLED layer stack is deposited on an electrode on the substrate. The electrode may be the anode and may comprise indium tin oxide (ITO). Desirably, the deposited films are of uniform thickness over the entire active area of the electrode. If the films are not uniform, then areas that are thicker will not emit light, and areas that are too thin may emit light in a less than optimum efficient way (power loss) and/or result in leakage current leaks through the device in a way that does not generate photons. An active-matrix organic light emitting diode comprises a substrate with a larger well size or wider channel width compared to the emission area. This improves the effective aperture ratio, which improves pixel intensity homogeneity.
Abstract:
An apparatus and method for liquid-phase dispensing of layers onto a substrate of an electronic device. An absorbent material reduces or eliminates splatter of printing material on the substrate during continuous printing operations. The absorbent material can be regenerated by exposure of new surface area or vacuum drawing of printing material through the absorbent material.