Abstract:
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon; a bank structure defining pixel areas over the electrode structures; and a thin layer of insulative inorganic material between the electrode structures and the bank structures. The bank structure is removed from and not in contact with the electrode structures by a distance of at least 0.1 microns.
Abstract:
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon; and a bank structure defining pixel areas over the electrode structures. The bank structure is removed from and not in contact with the electrode structures by a distance of at least 0.1 microns.
Abstract:
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a multiplicity of electrode structures; and a bank structure defining a multiplicity of pixel openings on the electrode structures. The bank structure has a height adjacent to the pixel opening, hA, and a height removed from the pixel opening, hR, and hA is significantly less than hR.
Abstract:
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a thick organic planarization layer; a multiplicity of electrode structures; and a thin insulative inorganic bank structure defining a multiplicity of pixel openings on the electrode structures.