BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES
    1.
    发明申请
    BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES 审中-公开
    解决方案处理电子设备的背板结构

    公开(公告)号:US20090098680A1

    公开(公告)日:2009-04-16

    申请号:US12250788

    申请日:2008-10-14

    Abstract: There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon; a bank structure defining pixel areas over the electrode structures; and a thin layer of insulative inorganic material between the electrode structures and the bank structures. The bank structure is removed from and not in contact with the electrode structures by a distance of at least 0.1 microns.

    Abstract translation: 提供了一种用于有机电子设备的背板。 该背板具有其上具有多个电极结构的TFT基板; 定义电极结构上的像素区域的堤坝结构; 以及在电极结构和堤岸结构之间的绝缘无机材料层。 堤结构从电极结构移除并不与电极结构接触至少0.1微米的距离。

    BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES
    2.
    发明申请
    BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES 审中-公开
    解决方案处理电子设备的背板结构

    公开(公告)号:US20090096365A1

    公开(公告)日:2009-04-16

    申请号:US12250775

    申请日:2008-10-14

    CPC classification number: H01L27/3246 H01L51/56

    Abstract: There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon; and a bank structure defining pixel areas over the electrode structures. The bank structure is removed from and not in contact with the electrode structures by a distance of at least 0.1 microns.

    Abstract translation: 提供了一种用于有机电子设备的背板。 该背板具有其上具有多个电极结构的TFT基板; 以及限定电极结构上的像素区域的堤结构。 堤结构从电极结构移除并不与电极结构接触至少0.1微米的距离。

    BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES
    3.
    发明申请
    BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES 审中-公开
    解决方案处理电子设备的背板结构

    公开(公告)号:US20090078941A1

    公开(公告)日:2009-03-26

    申请号:US12237487

    申请日:2008-09-25

    CPC classification number: H01L27/3246 H01L51/56

    Abstract: There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a multiplicity of electrode structures; and a bank structure defining a multiplicity of pixel openings on the electrode structures. The bank structure has a height adjacent to the pixel opening, hA, and a height removed from the pixel opening, hR, and hA is significantly less than hR.

    Abstract translation: 提供了一种用于有机电子设备的背板。 背板具有TFT基板; 多个电极结构; 以及在电极结构上限定多个像素开口的堤结构。 银行结构具有与像素开口相邻的高度hA,并且从像素开口移除的高度hR和hA显着小于hR。

    BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES
    4.
    发明申请
    BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES 审中-公开
    解决方案处理电子设备的背板结构

    公开(公告)号:US20090079341A1

    公开(公告)日:2009-03-26

    申请号:US12237496

    申请日:2008-09-25

    Inventor: YAW-MING A. TSAI

    CPC classification number: H01L27/3246 H01L27/3258

    Abstract: There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a thick organic planarization layer; a multiplicity of electrode structures; and a thin insulative inorganic bank structure defining a multiplicity of pixel openings on the electrode structures.

    Abstract translation: 提供了一种用于有机电子设备的背板。 背板具有TFT基板; 厚的有机平面化层; 多个电极结构; 以及在电极结构上限定多个像素开口的薄绝缘无机堤结构。

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