公开(公告)号：US20020163783A1

公开(公告)日：2002-11-07

申请号：US10093377

申请日：2002-03-11

Applicant: YAZAKI CORPORATION

Inventor： Hiroyuki Ashiya ,  Yoshiyuki Tanaka ,  Yayoi Maki

IPC: H05K007/20

CPC classification number: B60R16/0239 ,  H05K3/301 ,  H05K3/306

Abstract: In a holding and heat dissipation structure for a heat generation part for dissipating heat generated from the heat generation part having lead portions protruded from the main body thereof are soldered at a main substrate, a terminal plate is disposed at a position opposing to the main substrate with a predetermined distance therebetween, and a part housing portion for holding the part is provided at the terminal plate. The part housing portion is concavely formed. Insertion holes for inserting the lead portions protruded from the main body are formed at the part housing portion and the main substrate, respectively. The lead portions are inserted into these insertion holes, and the lead portions and the land portions of the main substrate are fixed to each other by the soldering in a state that the main body is separated from the bottom surface of the part housing portion.

Abstract translation: 在用于散发由其主体突出的引线部分的发热部产生的热量的发热部件的保持和散热结构被焊接在主基板上，端子板设置在与主基板相对的位置 在其间具有预定距离，并且在端子板处设置用于保持该部分的部分收纳部分。 部件收纳部分是凹形的。 用于插入从主体突出的引线部分的插入孔分别形成在部件收容部分和主基板上。 引线部分插入到这些插入孔中，并且主体与引导部分和主基板的接合部分在主体与部件收纳部分的底面分离的状态下通过焊接彼此固定。

公开(公告)号：US20020124994A1

公开(公告)日：2002-09-12

申请号：US10091183

申请日：2002-03-06

Applicant: YAZAKI CORPORATION

Inventor： Yoshiyuki Tanaka ,  Hiroyuki Ashiya ,  Yayoi Maki

IPC: F28F007/00

CPC classification number: B60R16/0239 ,  H05K3/301 ,  H05K3/306

Abstract: In a structure for holding a terminal in which a soldering portion of the terminal is inserted into a connecting hole of a substrate, and a land portion on the substrate and the soldering portion of the terminal are held by soldering with the terminal set upright, a terminal plate for guiding the soldering portion of the terminal into the connecting hole of the substrate is disposed at a position opposing the substrate and spaced apart therefrom with a predetermined clearance, and a positioning hole for holding an intermediate portion of the terminal is provided in the terminal plate, while a retaining portion which is retained in the positioning hole of the terminal plate is provided in the intermediate portion of the terminal.

Abstract translation: 在将端子的焊接部插入基板的连接孔的端子的保持结构中，并且基板的接地部和端子的焊接部通过直立端子的焊接来保持， 将端子的焊接部引导到基板的连接孔的端子板配置在与基板相对的位置上并且以预定间隙与其间隔开的位置，并且在端子板的中间部分设置有用于保持端子的中间部分的定位孔 端子板的中间部分设置有保持在端子板的定位孔中的保持部。

公开(公告)号：US20030134528A1

公开(公告)日：2003-07-17

申请号：US10341468

申请日：2003-01-14

Applicant: YAZAKI CORPORATION

Inventor： Yoshiyuki Tanaka ,  Hiroyuki Ashiya ,  Yayoi Maki

IPC: H01R012/00

CPC classification number: B60R16/0238 ,  H01R9/2466 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/0979 ,  H05K2201/10424 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10856 ,  H05K2201/2036 ,  Y10S439/949

Abstract: The terminal mounting structure includes a board (21). The structure includes a terminal (26) mounted on the board. The terminal includes a first end (26a) removably connected to a connection component (16, 17, 18). The terminal includes a second end (26b) soldered to the board in a raised position. The terminal includes a bent portion (26d) at intermediate of the terminal and at respective angles relative to respective first and second ends. The structure includes a retaining member (30, 40) facing the board with a space therebetween, and retaining the bent portion.

Abstract translation: 端子安装结构包括板（21）。 该结构包括安装在板上的端子（26）。 端子包括可移除地连接到连接部件（16,17,18）的第一端（26a）。 端子包括在升高位置焊接到板的第二端（26b）。 端子包括在端子的中间并且相对于相应的第一和第二端成各个角度的弯曲部分（26d）。 该结构包括面对板的保持构件（30,40），并且保持弯曲部分。

公开(公告)号：US20020131239A1

公开(公告)日：2002-09-19

申请号：US10093405

申请日：2002-03-11

Applicant: YAZAKI CORPORATION

Inventor： Hiroyuki Ashiya ,  Yoshiyuki Tanaka ,  Yayoi Maki

IPC: H05K007/20

CPC classification number: B60R16/0239

Abstract: In a substrate-stacking structure, a substrate, having heat-generating parts mounted thereon, and a control substrate, having control parts mounted thereon, are held spaced a predetermined distance from each other. The substrate and the control substrate are held spaced the predetermined distance from each other through a holding plate, and a heat shielding plate is interposed between these substrates, and an air layer is formed between the heat shielding plate and the control substrate.

Abstract translation: 在基板堆叠结构中，安装有发热部件的基板和安装有其上的控制部件的控制基板彼此间隔开预定距离。 基板和控制基板通过保持板保持彼此隔开预定距离，并且在这些基板之间插入有热屏蔽板，并且在隔热板和控制基板之间形成空气层。