公开(公告)号：US10447231B2

公开(公告)日：2019-10-15

申请号：US15808227

申请日：2017-11-09

Applicant: Yokogawa Electric Corporation

Inventor： Takeshi Mishima ,  Hiroshi Suzuki

IPC: H03H9/02 ,  H03H9/24 ,  H03H9/10 ,  B81B7/00 ,  B81C1/00

Abstract: A vibration transducer includes a silicon substrate, a first oxide film formed on the silicon substrate, an activation layer formed on the first oxide film, a second oxide film formed on the activation layer, a polysilicon layer formed on the second oxide film, and a substrate contact part. A vibrator, a vibrator electrode electrically conducted with the vibrator, a fixed electrode close to the vibrator and a vacuum chamber configured to surround the vibrator are formed in the activation layer. The polysilicon layer forms a shell. The substrate contact part is configured to electrically conduct the polysilicon layer and the silicon substrate, and is formed to continuously surround the vacuum chamber in a region, in which the vibrator, the vibrator electrode and the fixed electrode of the activation layer are not formed, of the activation layer.

公开(公告)号：US09865797B2

公开(公告)日：2018-01-09

申请号：US14446602

申请日：2014-07-30

Applicant: YOKOGAWA ELECTRIC CORPORATION

Inventor： Takashi Yoshida ,  Takeshi Mishima ,  Shigeto Iwai ,  Yuusaku Yoshida

IPC: H01L41/083 ,  H01L41/331 ,  H03H3/007 ,  H03H9/10

CPC classification number: H01L41/083 ,  H01L41/331 ,  H03H3/0072 ,  H03H9/1057 ,  Y10T29/42

Abstract: A resonant transducer includes a silicon single crystal substrate, a silicon single crystal resonator disposed over the silicon single crystal substrate, a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate, an exciting module configured to excite the resonator, a vibration detecting module configured to detect vibration of the resonator, a first layer disposed over the chamber, the first layer having a through-hole over the resonator, a second layer disposed over the first layer, the second layer covering a gap being positioned above the through-hole and being communicated with the through-hole, and a third layer covering the first layer and the second layer, and the third layer sealing the gap.