公开(公告)号：US06483159B1

公开(公告)日：2002-11-19

申请号：US09617426

申请日：2000-07-14

申请人： Yai-Fen Lin ,  Chia-Ta Hsieh ,  Hung-Cheng Sung ,  Juang-Ke Yeh ,  Di-Son Kuo

发明人： Yai-Fen Lin ,  Chia-Ta Hsieh ,  Hung-Cheng Sung ,  Juang-Ke Yeh ,  Di-Son Kuo

IPC分类号： H01L2976

CPC分类号： H01L29/66825 ,  H01L29/42324

摘要： A split gate EEPROM memory device formed on a doped silicon semi-conductor substrate starting with an initial oxide layer with an undoped first polysilicon layer formed thereon. A polysilicon oxide hard mask over the undoped first polysilicon layer for use in patterning the initial oxide layer and the undoped first polysilicon layer which are then etched to form a floating gate electrode stack from the undoped first polysilicon layer and the initial oxide layer on the substrate. Then form a tunnel oxide layer and a doped polysilicon and pattern them into control gate electrode stack, with the control gate electrode stack being located in a split-gate configuration with respect to the floating gate electrode stack.

摘要翻译： 一种分裂门EEPROM存储器件，形成在掺杂硅半导体衬底上，起始于其上形成有未掺杂的第一多晶硅层的初始氧化物层。 在未掺杂的第一多晶硅层上的多晶硅氧化物硬掩模，用于构图初始氧化物层和未掺杂的第一多晶硅层，然后将其从未掺杂的第一多晶硅层和衬底上的初始氧化物层进行蚀刻以形成浮置栅电极堆叠 。 然后形成隧道氧化物层和掺杂多晶硅并将它们图案化成控制栅极电极堆叠，其中控制栅极电极堆叠相对于浮动栅电极堆叠位于分离栅极配置中。

公开(公告)号：US6121088A

公开(公告)日：2000-09-19

申请号：US156054

申请日：1998-09-17

申请人： Yai-Fen Lin ,  Chia-Ta Hsieh ,  Hung-Cheng Sung ,  Juang-ke Yeh ,  Di-Son Kuo

发明人： Yai-Fen Lin ,  Chia-Ta Hsieh ,  Hung-Cheng Sung ,  Juang-ke Yeh ,  Di-Son Kuo

IPC分类号： H01L21/336 ,  H01L29/423 ,  H01L21/4763

CPC分类号： H01L29/66825 ,  H01L29/42324

摘要： Form a split gate EEPROM memory device on a doped silicon semiconductor substrate starting with an initial oxide layer and form an undoped first polysilicon layer thereon. Then form a polysilicon oxide hard mask over the undoped first polysilicon layer for use in patterning the initial oxide layer and the undoped first polysilicon layer which are then etched to form a floating gate electrode stack from the undoped first polysilicon layer and the initial oxide layer on the substrate. Then form a tunnel oxide layer and a doped polysilicon and pattern them into control gate electrode stack, with the control gate electrode stack being located in a split-gate configuration with respect to the floating gate electrode stack.

摘要翻译： 在掺杂硅半导体衬底上形成一个分裂栅极EEPROM存储器件，从初始氧化层开始并在其上形成未掺杂的第一多晶硅层。 然后在未掺杂的第一多晶硅层上形成多晶硅氧化物硬掩模，用于图案化初始氧化物层和未掺杂的第一多晶硅层，然后将其从未掺杂的第一多晶硅层和初始氧化物层上蚀刻形成浮栅电极堆叠 底物。 然后形成隧道氧化物层和掺杂多晶硅并将它们图案化成控制栅极电极堆叠，其中控制栅极电极堆叠相对于浮动栅电极堆叠位于分离栅极配置中。

公开(公告)号：US06753569B2

公开(公告)日：2004-06-22

申请号：US10029622

申请日：2001-12-31

申请人： Yai-Fen Lin ,  Chang Song Lin ,  Chia-Ta Hsieh ,  Hung-Cheng Sung ,  Juang-Ke Yeh

发明人： Yai-Fen Lin ,  Chang Song Lin ,  Chia-Ta Hsieh ,  Hung-Cheng Sung ,  Juang-Ke Yeh

IPC分类号： H01L2976

CPC分类号： H01L27/11521 ,  H01L21/28273 ,  H01L27/115 ,  H01L29/42324 ,  H01L29/66825

摘要： A method is provided for forming a split-gate flash memory cell having a shallow trench isolation without the intrusion of a “smiling” gap near the edge of the trench encompassing the first polysilicon layer. This is accomplished by forming two conformal layers lining the interior walls of the trench. An exceptionally thin nitride layer overlying the first conformal oxide layer provides the necessary protection during the oxidation of the first polysilicon layer so as to prevent the “smiling” effect normally encountered in fabricating ultra large scale integrated circuits.

摘要翻译： 提供了一种用于形成具有浅沟槽隔离的分离栅极闪存单元的方法，而不会在包围第一多晶硅层的沟槽的边缘附近侵入“微笑”间隙。 这通过在沟槽的内壁上形成两个共形层来实现。 覆盖第一保形氧化物层的非常薄的氮化物层在第一多晶硅层的氧化期间提供必要的保护，以防止在制造超大规模集成电路时通常遇到的“微笑”效应。

公开(公告)号：US06358796B1

公开(公告)日：2002-03-19

申请号：US09292360

申请日：1999-04-15

申请人： Yai-Fen Lin ,  Chang-Song Lin ,  Chia-Ta Hsieh ,  Hung-Cheng Sung ,  Juang-Ke Yeh

发明人： Yai-Fen Lin ,  Chang-Song Lin ,  Chia-Ta Hsieh ,  Hung-Cheng Sung ,  Juang-Ke Yeh

IPC分类号： H01L21336

CPC分类号： H01L27/11521 ,  H01L21/28273 ,  H01L27/115 ,  H01L29/42324 ,  H01L29/66825

摘要： A method is provided for forming a split-gate flash memory cell having a shallow trench isolation without the intrusion of a “smiling” gap near the edge of the trench encompassing the first polysilicon layer. This is accomplished by forming two conformal layers lining the interior walls of the trench. An exceptionally thin nitride layer overlying the first conformal oxide layer provides the necessary protection during the oxidation of the first polysilicon layer so as to prevent the “smiling” effect normally encountered in fabricating ultra large scale integrated circuits.

公开(公告)号：US07417278B2

公开(公告)日：2008-08-26

申请号：US11122726

申请日：2005-05-05

申请人： Chia-Ta Hsieh ,  Yai-Fen Lin ,  Di-Son Kuo ,  Hung-Cheng Sung ,  Jack Yeh

发明人： Chia-Ta Hsieh ,  Yai-Fen Lin ,  Di-Son Kuo ,  Hung-Cheng Sung ,  Jack Yeh

IPC分类号： H01L29/788

CPC分类号： H01L27/11521 ,  H01L27/115 ,  H01L29/42324 ,  H01L29/66825 ,  H01L29/7885

摘要： A split-gate flash memory cell having a three-dimensional source capable of three-dimensional coupling with the floating gate of the cell, as well as a method of forming the same are provided. This is accomplished by first forming an isolation trench, lining it with a conformal oxide, then filling with an isolation oxide and then etching the latter to form a three-dimensional coupling region in the upper portion of the trench. A floating gate is next formed by first filling the three-dimensional region of the trench with polysilicon and etching it. The control gate is formed over the floating gate with an intervening inter-poly oxide. The floating gate forms legs extending into the three-dimensional coupling region of the trench thereby providing a three-dimensional coupling with the source which also assumes a three-dimensional region. The leg or the side-wall of the floating gate forming the third dimension provides the extra area through which coupling between the source and the floating gate is increased. In this manner, a higher coupling ratio is achieved without an increase in the cell size while at the same time alleviating the punchthrough and junction break-down of source region by sharing gate voltage along the side-wall.

摘要翻译： 提供具有能够与电池的浮动栅极三维耦合的三维源的分裂栅极闪存单元及其形成方法。 这是通过首先形成隔离沟槽，用共形氧化物衬里，然后用隔离氧化物填充，然后对其进行蚀刻，以在沟槽的上部形成三维耦合区域。 接下来通过用多晶硅填充沟槽的三维区域并对其进行蚀刻来形成浮栅。 控制栅极通过中间多晶硅氧化物形成在浮动栅上。 浮栅形成延伸到沟槽的三维耦合区域中的支腿，从而提供与源也呈三维区域的三维耦合。 形成第三维的浮动栅的腿或侧壁提供了增加源极和浮动栅极之间的耦合的额外区域。 以这种方式，在不增加电池尺寸的同时实现更高的耦合比，同时通过沿着侧壁共享栅极电压来减轻源极区域的穿通和结断流。

公开(公告)号：US06573555B1

公开(公告)日：2003-06-03

申请号：US09587464

申请日：2000-06-05

申请人： Yai-Fen Lin ,  Di-Son Kuo ,  Hung-Cheng Sung ,  Chia-Ta Hsieh

发明人： Yai-Fen Lin ,  Di-Son Kuo ,  Hung-Cheng Sung ,  Chia-Ta Hsieh

IPC分类号： H01L29788

CPC分类号： H01L29/42324 ,  H01L21/28273

摘要： A split gate P-channel flash memory cell and method of forming a split gate P-channel flash memory cell which avoids of high erasing voltage, reverse tunneling during programming, drain disturb and over erase problems, and permits shrinking the cell dimensions. The control gate has a concave top surface which intersects with the sidewalls to form a sharp edge. The cell is programmed by charging the floating gate with electrons by means of hot electron injection from the channel into the floating gate. The cell is erased by discharging the excess electrons from the floating gate into the control gate using Fowler-Nordheim tunneling. The sharp edge at the intersection of the concave top surface and the sidewalls of the floating gate produces a high electric field between the control gate and the floating gate to accomplish the Fowler-Nordheim tunneling with only moderate voltage differences between the floating gate and control gate. The P-channel flash memory cell has a higher impact ionization rage for creating hot electrons so that the distance between the source and drain junctions and the length of the floating gate can be kept small thereby permitting the dimensions of the flash memory cell to be shrunk.

摘要翻译： 分裂门P沟道快闪存储单元以及形成分离栅极P沟道闪存单元的方法，其避免高擦除电压，编程期间的反向隧穿，漏极干扰和过度擦除问题，并且允许缩小单元尺寸。 控制门具有与侧壁相交以形成锋利边缘的凹顶表面。 通过从通道进入浮动栅极的热电子注入，用电子对浮动栅极充电来对单元进行编程。 使用Fowler-Nordheim隧道将多余的电子从浮动栅极放电到控制栅中来消除电池。 在凹顶表面和浮动栅极的相交处的尖锐边缘在控制栅极和浮动栅极之间产生高电场，以在浮动栅极和控制栅极之间仅具有适度的电压差来实现Fowler-Nordheim隧道 。 P沟道闪速存储单元对于产生热电子具有较高的冲击电离强度，使得源极和漏极结之间的距离和浮置栅极的长度可以保持较小，从而允许闪存单元的尺寸缩小 。

公开(公告)号：US06538277B2

公开(公告)日：2003-03-25

申请号：US09920601

申请日：2001-08-02

申请人： Hung-Cheng Sung ,  Di-Son Kuo ,  Chuang-Ke Yeh ,  Chia-Ta Hsieh ,  Yai-Fen Lin ,  Wen-Ting Chu

发明人： Hung-Cheng Sung ,  Di-Son Kuo ,  Chuang-Ke Yeh ,  Chia-Ta Hsieh ,  Yai-Fen Lin ,  Wen-Ting Chu

IPC分类号： H01L29788

CPC分类号： H01L27/11521 ,  H01L21/28273 ,  H01L21/76895 ,  H01L21/76897 ,  H01L27/115 ,  H01L29/42324 ,  H01L29/66825

摘要： A novel method of forming a first polysilicon gate tip (poly-tip) for enhanced F-N tunneling in split-gate flash memory cells is disclosed. The poly-tip is formed in the absence of using a thick polysilicon layer as the floating gate. This is made possible by forming an oxide layer over the poly-gate and oxidizing the sidewalls of the polygate. Because the starting thickness of polysilicon of the floating gate is relatively thin, the resulting gate beak, or poly-tip, is also necessarily thin and sharp. This method, therefore, circumvents the problem of oxide thinning encountered in scaling down devices of the ultra large scale integration technology and the fast programmability and erasure performance of EEPROMs is improved.

摘要翻译： 公开了一种形成分裂栅闪存单元中用于增强的F-N隧穿的第一多晶硅栅尖（多尖端）的新方法。 在不使用厚多晶硅层作为浮动栅极的情况下形成多尖端。 这可以通过在多晶硅上形成氧化层并氧化多晶硅的侧壁来实现。 由于浮栅的多晶硅的起始厚度相对较薄，所以形成的栅极尖或多尖端也必然是薄且尖锐的。 因此，该方法避免了超大规模集成技术的缩小设备中遇到的氧化物薄化问题，提高了EEPROM的快速可编程性和擦除性能。

公开(公告)号：US06534821B2

公开(公告)日：2003-03-18

申请号：US09927071

申请日：2001-08-10

申请人： Chia-Ta Hsieh ,  Yai-Fen Lin ,  Hung-Cheng Sung ,  Chuang-ke Yeh ,  Wen-Ting Chu ,  Di-Son Kuo

发明人： Chia-Ta Hsieh ,  Yai-Fen Lin ,  Hung-Cheng Sung ,  Chuang-ke Yeh ,  Wen-Ting Chu ,  Di-Son Kuo

IPC分类号： H01L29788

CPC分类号： H01L27/11521 ,  H01L27/115

摘要： A method is disclosed for forming a split-gate flash memory cell having a protruding source in place of the conventional flat source. The vertically protruding source structure has a top portion and a bottom portion. The bottom portion is polysilicon while the top portion is poly-oxide. The vertical wall of the protruding structure over the source is used to form vertical floating gate and spacer control gate with an intervening inter-gate oxide. Because the coupling between the source and the floating gate is now provided through the vertical wall, the coupling area is much larger than with conventional flat source. Furthermore, there is no longer the problem of voltage punch-through between the source and the drain. The vertical floating gate is also made thin so that the resulting thin and sharp poly-tip enhances further the erasing and programming speed of the flash memory cell. The vertical orientation of the source structure and the floating gate and the self-alignment of the spacer control gate to the floating gate together makes it possible to reduce the memory cell substantially.

公开(公告)号：US06465841B1

公开(公告)日：2002-10-15

申请号：US09709589

申请日：2000-11-13

申请人： Chia-Ta Hsieh ,  Yai-Fen Lin ,  Hung-Cheng Sung ,  Jack Yeh ,  Di-Son Kuo

发明人： Chia-Ta Hsieh ,  Yai-Fen Lin ,  Hung-Cheng Sung ,  Jack Yeh ,  Di-Son Kuo

IPC分类号： H01L29788

CPC分类号： H01L21/28273 ,  H01L29/42324

摘要： A method is disclosed to form a split-gate flash memory cell having nitride spacers formed on a pad oxide and prior the forming of an inter-poly oxide layer thereover. In this manner, any damage that would normally occur to the inter-poly oxide during the etching of the nitride spacers subsequent to the forming of the inter-poly oxide is avoided. Consequently, the variation in the thickness of the inter-poly oxide due to the unpredictable damage to the underlying spacers is also avoided by reversing the order in which the spacers and the inter-poly oxide are formed, including the forming of the pad oxide first. As a result, variation in the erase speed of the inter-gate flash memory cell is prevented, both for cells fabricated on the same wafer as well as on different wafers on same or different production lines.

摘要翻译： 公开了一种形成具有形成在衬垫氧化物上的氮化物间隔物并且之前形成多晶氧化物层的分裂栅极快闪存储器单元的方法。 以这种方式，避免了在形成多晶硅氧化物之前在氮化物间隔物的蚀刻期间多晶氧化物通常会发生的任何损伤。 因此，通过反转形成间隔物和多晶氧化物的顺序，包括首先形成衬垫氧化物，也可以避免由于对下面的间隔物的不可预测的损伤而导致的多晶氧化物厚度的变化 。 结果，对于在同一晶片上以及相同或不同生产线上的不同晶片上制造的单元，都能够防止栅极间闪存单元的擦除速度的变化。

公开(公告)号：US06380583B1

公开(公告)日：2002-04-30

申请号：US09679512

申请日：2000-10-06

申请人： Chia-Ta Hsieh ,  Yai-Fen Lin ,  Di-Son Kuo ,  Hung-Cheng Sung ,  Jack Yeh

发明人： Chia-Ta Hsieh ,  Yai-Fen Lin ,  Di-Son Kuo ,  Hung-Cheng Sung ,  Jack Yeh

IPC分类号： H01L2976

CPC分类号： H01L27/11521 ,  H01L27/115 ,  H01L29/42324 ,  H01L29/66825 ,  H01L29/7885

摘要： A split-gate flash memory cell having a three-dimensional source capable of three-dimensional coupling with the floating gate of the cell, as well as a method of forming the same are provided. This is accomplished by first forming an isolation trench, lining it with a conformal oxide, then filling with an isolation oxide and then etching the latter to form a three-dimensional coupling region in the upper portion of the trench. A floating gate is next formed by first filling the three-dimensional region of the trench with polysilicon and etching it. The control gate is formed over the floating gate with an intervening inter-poly oxide. The floating gate forms legs extending into the three-dimensional coupling region of the trench thereby providing a three-dimensional coupling with the source which also assumes a three-dimensional region. The leg or the side-wall of the floating gate forming the third dimension provides the extra area through which coupling between the source and the floating gate is increased. In this manner, a higher coupling ratio is achieved without an increase in the cell size while at the same time alleviating the punchthrough and junction break-down of source region by sharing gate voltage along the side-wall.

摘要翻译： 提供具有能够与电池的浮动栅极三维耦合的三维源的分裂栅极闪存单元及其形成方法。 这是通过首先形成隔离沟槽，用共形氧化物衬里，然后用隔离氧化物填充，然后对其进行蚀刻，以在沟槽的上部形成三维耦合区域。 接下来通过用多晶硅填充沟槽的三维区域并对其进行蚀刻来形成浮栅。 控制栅极通过中间多晶硅氧化物形成在浮动栅上。 浮栅形成延伸到沟槽的三维耦合区域中的支腿，从而提供与源也呈三维区域的三维耦合。 形成第三维的浮动栅的腿或侧壁提供了增加源极和浮动栅极之间的耦合的额外区域。 以这种方式，在不增加电池尺寸的同时实现更高的耦合比，同时通过沿着侧壁共享栅极电压来减轻源极区域的穿通和结断流。