公开(公告)号：US06613987B2

公开(公告)日：2003-09-02

申请号：US09539864

申请日：2000-03-31

申请人： Yasuaki Seki ,  Takashi Ito ,  Shuji Mochizuki ,  Kiyonori Furuta ,  Toshihiko Hatajima

发明人： Yasuaki Seki ,  Takashi Ito ,  Shuji Mochizuki ,  Kiyonori Furuta ,  Toshihiko Hatajima

IPC分类号： H05K100

CPC分类号： H05K3/4644 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/095 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Herein is disclosed an insulating resin composition for a multilayer printed-wiring board, comprising two or more kinds of resins which are different in etching rate by plasma treatment and which are not compatible with each other, so that the surface of the resulting insulating layer can be made uneven by the plasma treatment, whereby the bonding strength of the conductor layer to the said resulting insulating layer can be ensured, and heat resistance and electrically insulating properties required can be satisfied.

摘要翻译： 本发明公开了一种用于多层印刷电路板的绝缘树脂组合物，其包含两种或更多种不同于等离子体处理的蚀刻速率并且彼此不相容的树脂，使得所得绝缘层的表面可以 通过等离子体处理使其不均匀，从而可以确保导体层与所得绝缘层的接合强度，并且可以满足所需的耐热性和电绝缘性能。

公开(公告)号：US06710260B1

公开(公告)日：2004-03-23

申请号：US09537083

申请日：2000-03-29

申请人： Yasuaki Seki ,  Takashi Ito ,  Shuji Mochizuki

发明人： Yasuaki Seki ,  Takashi Ito ,  Shuji Mochizuki

IPC分类号： H05K100

CPC分类号： H05K3/381 ,  H05K3/388 ,  H05K3/4644

摘要： In a manufacturing method of a printed circuit board comprising a process of forming a circuit pattern on the surface of the base substrate (13) of which surface is at least composed of an insulative material, a process of forming the insulative layer (15) composed of mixed composites of more than two kinds of organic resins having a different etching rate by a dry etching process on the surface of the base substrate (13) including the circuit pattern, a process of perforating the hole (17) on the insulative layer (15) by a laser beam, a process of roughing the surface of the insulative layer (15) by a dry etching process, a process of forming the conductive film (19) for a foundation of an electroplating process by a vacuum film forming method and a process of forming the conductive layer (20) on the conductive film (19) by an electroplating process so as to connect the conductive layer (20) with the circuit pattern (14) electrically. Accordingly, a printed circuit board having an extremely small anchor profile and a fine pattern can be manufactured in fewer manufacturing processes by utilizing the dry etching process and a spattering film forming process.

摘要翻译： 在一种印刷电路板的制造方法中，包括在基底（13）的表面至少由绝缘材料构成的表面上形成电路图案的工艺，形成绝缘层（15）的工艺形成 在包括电路图案的基底基板（13）的表面上通过干法蚀刻工艺对具有不同蚀刻速率的两种以上有机树脂的混合复合材料进行穿孔（17）在绝缘层（ 15），通过干蚀刻工艺粗化绝缘层（15）的表面的工艺，通过真空成膜方法形成用于电镀工艺的基础的导电膜（19）的工艺，以及 通过电镀工艺在导电膜（19）上形成导电层（20）以将导电层（20）与电路图案（14）电连接的工艺。 因此，通过利用干式蚀刻工艺和溅射成膜工艺，可以在较少的制造工艺中制造具有极小锚固轮廓和精细图案的印刷电路板。

公开(公告)号：US06284308B1

公开(公告)日：2001-09-04

申请号：US09461039

申请日：1999-12-15

申请人： Yasuaki Seki ,  Shigenori Shiratori ,  Kenji Suzuki

发明人： Yasuaki Seki ,  Shigenori Shiratori ,  Kenji Suzuki

IPC分类号： B05D512

摘要： In a manufacturing method of a printed circuit board comprising a process of coating insulative thermosetting resin on a surface of a printed circuit board having a blind hole and a process of filling up the insulative thermosetting resin in the blind hole, the printed circuit board coated with the insulative thermosetting resin is kept in a low pressure atmosphere of 1.3 to 666 hPa, and then the insulative thermosetting resin is hardened, so that the insulative thermosetting resin is filled up in the blind hole appropriately.