公开(公告)号：US4900848A

公开(公告)日：1990-02-13

申请号：US174703

申请日：1988-03-29

申请人： Yasuhisa Saito ,  Katsuya Watanabe ,  Kohichi Okuno ,  Kunimasa Kamio ,  Akira Morii ,  Hiroshi Nakamura

发明人： Yasuhisa Saito ,  Katsuya Watanabe ,  Kohichi Okuno ,  Kunimasa Kamio ,  Akira Morii ,  Hiroshi Nakamura

IPC分类号： C07D301/27 ,  C08G59/32 ,  C08G59/40 ,  C08J5/24 ,  C08L63/00

CPC分类号： C08J5/24 ,  C08G59/3227 ,  C08G59/40 ,  C08L63/00 ,  C08J2363/00 ,  Y10T428/31511

摘要： A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25.degree. C., a resin composition containing said resin, and a fiber-reinforced composite material containing as matrix a cured product of said epoxy resin composition and a fiber as reinforcing material.

摘要翻译： 含有所述树脂的树脂组合物的低粘度环氧树脂即低粘度聚缩水甘油基衍生物，其芳环上具有至少一个烷基，其粘度为25泊或更低， 以及纤维增强复合材料，其包含作为基体的所述环氧树脂组合物的固化产物和纤维作为增强材料。

公开(公告)号：US4957995A

公开(公告)日：1990-09-18

申请号：US402663

申请日：1989-09-05

申请人： Yasuhisa Saito ,  Katsuya Watanabe ,  Kohichi Okuno ,  Kunimasa Kamio ,  Akira Morii

发明人： Yasuhisa Saito ,  Katsuya Watanabe ,  Kohichi Okuno ,  Kunimasa Kamio ,  Akira Morii

IPC分类号： C07D301/27 ,  C08G59/32 ,  C08G59/40 ,  C08J5/24 ,  C08L63/00

CPC分类号： C08J5/24 ,  C08G59/3227 ,  C08G59/40 ,  C08L63/00 ,  C08J2363/00 ,  Y10T428/31511

摘要： A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25.degree. C., a resin composition containing said resin, and a fiberreinforced composite material containing as matrix a cured product of said epoxy resin composition and a fiber as reinforcing material.

公开(公告)号：US4705833A

公开(公告)日：1987-11-10

申请号：US813272

申请日：1985-12-24

申请人： Yasuhisa Saito ,  Hisao Takagishi ,  Katsuya Watanabe ,  Kohichi Okuno ,  Junichi Kenmei ,  Kunimasa Kamio

发明人： Yasuhisa Saito ,  Hisao Takagishi ,  Katsuya Watanabe ,  Kohichi Okuno ,  Junichi Kenmei ,  Kunimasa Kamio

IPC分类号： C08G59/40 ,  C08G59/44 ,  C08G59/54

CPC分类号： C08G59/4042

摘要： A thermosettable heat-resistant resin composition containing (A) an amino group-terminated imide compound produced by imidating an aromatic diamine with an aromatic tetracarboxylic anhydride at a diamine:anhydride molar ratio of from 1.2:1 to 4:1, and (B) an epoxy resin having at least two epoxy groups, the molar ratio of the amino group of the imide compound to the epoxy group of the epoxy resin being 1:1.6 to 1:2.6.

摘要翻译： 一种可热固化的耐热树脂组合物，其含有（A）通过二胺：酐摩尔比为1.2:1至4:1的芳族二胺与芳族四羧酸酐进行酰亚胺化制备的氨基封端的酰亚胺化合物，和（B） 具有至少两个环氧基的环氧树脂，酰亚胺化合物的氨基与环氧树脂的环氧基的摩尔比为1:1.6至1:2.6。

公开(公告)号：US4855339A

公开(公告)日：1989-08-08

申请号：US298858

申请日：1989-01-19

申请人： Yasuhisa Saito ,  Hisao Takagishi ,  Hiroshi Nakamura ,  Kohichi Okuno ,  Yutaka Shiomi ,  Kunimasa Kamio

发明人： Yasuhisa Saito ,  Hisao Takagishi ,  Hiroshi Nakamura ,  Kohichi Okuno ,  Yutaka Shiomi ,  Kunimasa Kamio

IPC分类号： C08G59/40 ,  C08G59/50 ,  C08G59/56 ,  C08G64/06 ,  C08G65/34 ,  C08L63/00

CPC分类号： C08G65/34 ,  C08G59/4007 ,  C08G59/504 ,  C08G59/56 ,  C08G64/06 ,  C08L63/00

摘要： An epoxy resin composition comprising (A) an epoxy resin having three or more epoxy groups per a molecule and (B) a reactive oligomer having in its molecule an aromatic residue connected thereto by --O-- or --S-- linkage and having at the terminal of the molecule a phonolic hydroxyl group.

摘要翻译： 一种环氧树脂组合物，其包含（A）每分子具有三个或更多个环氧基的环氧树脂和（B）在其分子中具有通过-O-或-S-键连接并在末端具有芳香残基的反应性低聚物 的分子是一个声音羟基。

公开(公告)号：US4871832A

公开(公告)日：1989-10-03

申请号：US146684

申请日：1988-01-21

申请人： Yasuhisa Saito ,  Shuichi Kanagawa ,  Katsuya Watanabe ,  Kunimasa Kamio

发明人： Yasuhisa Saito ,  Shuichi Kanagawa ,  Katsuya Watanabe ,  Kunimasa Kamio

IPC分类号： C07D403/04 ,  C08G59/40 ,  C08G59/50 ,  C08G59/62 ,  C08G73/10

CPC分类号： C07D403/04 ,  C08G59/4042 ,  C08G59/5053 ,  C08G59/62 ,  C08G73/10 ,  C08G73/1067

摘要： The invention provides an imide compound represented by the general formula (I), ##STR1## wherein X represents a hydroxyl or amino group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or a C.sub.1 -C.sub.10 alkyl group, R.sub.2 represents a hydrogen atom, a C.sub.1 -C.sub.20 alkyl or alkoxy group or a hydroxyl group, and n represents a number of from 0 to 6, and also provides an epoxy resin composition containing the imide compound (B) and epoxy resins (A) as essential components.

摘要翻译： 本发明提供由通式（I）表示的酰亚胺化合物，其中X表示羟基或氨基，Ar 1和Ar 2独立地表示芳族残基，R 1表示氢原子或C 1 -C 10烷基，R 2表示氢原子，C 1〜C 20烷基或烷氧基或羟基，n表示0〜6的数，并且还提供含有酰亚胺化合物（B）和 环氧树脂（A）为必须成分。

公开(公告)号：US4960860A

公开(公告)日：1990-10-02

申请号：US359722

申请日：1989-05-31

申请人： Yasuhisa Saito ,  Kunimasa Kamio ,  Mitsuhiro Shibata ,  Katsuya Watanabe ,  Yutaka Shiomi ,  Youichi Ueda

发明人： Yasuhisa Saito ,  Kunimasa Kamio ,  Mitsuhiro Shibata ,  Katsuya Watanabe ,  Yutaka Shiomi ,  Youichi Ueda

IPC分类号： C07D487/08 ,  C08G59/40 ,  C09J163/00

CPC分类号： C07D487/08 ,  C08G59/4042 ,  C09J163/00

摘要： The present invention provides an improved epoxy resin composition comprising an epoxy resin and a novel imide compound represented by the formula ##STR1## wherein X represents an --NH.sub.2 group and/or --OH group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sub.2 represent a hydrogen atom, an alkyl or alkoxy group having from 1 to 20 carbon atoms or hydroxyl group, and each of m and n represents a number of from 0 to 30.

公开(公告)号：US4794148A

公开(公告)日：1988-12-27

申请号：US144426

申请日：1988-01-15

申请人： Hiroshi Nakamura ,  Shigenao Hata ,  Kunimasa Kamio ,  Yasuhisa Saito

发明人： Hiroshi Nakamura ,  Shigenao Hata ,  Kunimasa Kamio ,  Yasuhisa Saito

IPC分类号： C08J5/04 ,  C07D403/04 ,  C07D487/08 ,  C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08G59/50 ,  C08G59/62 ,  C08J5/24 ,  C08K7/02 ,  C08L63/00 ,  C08F283/10

CPC分类号： C07D403/04 ,  C07D487/08 ,  C08G59/4042 ,  C08G59/5046 ,  C08G59/62 ,  C08L63/00

摘要： A fiber-reinforced composite material superior in mechanical strength, heat resistance and hot water resistance is provided herein. This composite material is composed of a matrix of a cured product of a resin composition containing as essential components an epoxy resin (A) and an imide compound (B) represented by the following general formula (I), ##STR1## wherein X represents --NH.sub.2 group and/or --OH group, Ar represents an aromatic residue, R.sub.1 represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sub.2 represents a hydrogen atom, an alkyl or alkoxy group having from 1 to 20 carbon atoms or a hydroxyl group, and each of m and n cannot be 0 at the same time, and a fiber (C) as a reinforcing material.

公开(公告)号：US4913697A

公开(公告)日：1990-04-03

申请号：US281458

申请日：1988-12-08

申请人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

发明人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

IPC分类号： C07D251/34 ,  C08F222/40 ,  C08G73/06 ,  C08G73/12

CPC分类号： C08G73/0644 ,  C07D251/34 ,  C08F222/40 ,  C08G73/12

摘要： A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said traizine compound, and an inorganic filler as essential components; and said s-triazine compound.

公开(公告)号：US4808717A

公开(公告)日：1989-02-28

申请号：US45431

申请日：1987-05-04

申请人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

发明人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

IPC分类号： C07D251/34 ,  C08F222/40 ,  C08G73/06 ,  C08G73/12

CPC分类号： C08G73/0644 ,  C07D251/34 ,  C08F222/40 ,  C08G73/12

摘要： A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said triazine compound, and an inorganic filler as essential components; and said s-triazine compound.

摘要翻译： 一种热固性树脂组合物，其包含（i）分子中具有至少两个马来酰亚胺基团的聚马来酰亚胺化合物和（ii）在分子中具有至少两个烯基芳氧基的s-三嗪化合物; 用于包含所述聚马来酰亚胺化合物，所述三嗪化合物和无机填料作为必要组分的密封剂的树脂组合物; 和所述s-三嗪化合物。

公开(公告)号：US5329047A

公开(公告)日：1994-07-12

申请号：US806328

申请日：1991-12-13

申请人： Shigeki Naitoh ,  Yasuhisa Saito ,  Yasuhiro Hirano ,  Kazuo Takebe ,  Kunimasa Kamio ,  Youichi Ueda

发明人： Shigeki Naitoh ,  Yasuhisa Saito ,  Yasuhiro Hirano ,  Kazuo Takebe ,  Kunimasa Kamio ,  Youichi Ueda

IPC分类号： B32B15/08 ,  C08G73/12 ,  H05K1/03 ,  C07C217/90

CPC分类号： C08G73/121 ,  B32B15/08 ,  H05K1/0346

摘要： A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: ##STR1## wherein Ar is a divalent aromatic residue, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.

摘要翻译： 提供了一种用于覆铜层压板的热固性树脂组合物，其包含（A）由下式表示的芳族二胺化合物：其中Ar为二价芳族残基，R1，R2，R3和R4各自为 烯丙基或氢原子，但其中至少一个为烯丙基，（B）分子中具有2个以上马来酰亚胺基的聚马来酰亚胺化合物。