公开(公告)号：US07667975B2

公开(公告)日：2010-02-23

申请号：US10580071

申请日：2004-12-15

申请人： Yasushi Kambara ,  Akira Motoyama ,  Masayuki Nakajima

发明人： Yasushi Kambara ,  Akira Motoyama ,  Masayuki Nakajima

IPC分类号： H05K7/00

CPC分类号： H01G4/228 ,  H01G2/06 ,  H01G4/18 ,  H05B41/2827 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/062 ,  H05K2201/10909 ,  H05K2203/304

摘要： A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6− (mm) or less, a cross-sectional area is 35 mm2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.

摘要翻译： 提供了一种用于灯装置的照明装置。 照明装置包括通过使用无铅流动焊料封装在电路板上的电路板和薄膜电容器。 每个薄膜电容器包括聚丙烯薄膜和导线，并且导线的材料的导热率低于铜的热导率，薄膜电容器的端子和内部材料是无引线的。 引线的直径为0.6-（mm）以下，截面积为35mm 2以下，焊接工序中的薄膜电容器的引线的末端的温度为130℃。 或更少。

公开(公告)号：US20070103879A1

公开(公告)日：2007-05-10

申请号：US10580071

申请日：2004-12-15

申请人： Yasushi Kambara ,  Akira Motoyama ,  Masayuki Nakajima

发明人： Yasushi Kambara ,  Akira Motoyama ,  Masayuki Nakajima

IPC分类号： H05K1/18

CPC分类号： H01G4/228 ,  H01G2/06 ,  H01G4/18 ,  H05B41/2827 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/062 ,  H05K2201/10909 ,  H05K2203/304

摘要： A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6- (mm) or less, a cross-sectional area is 35 mm 2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.

摘要翻译： 提供了一种用于灯装置的照明装置。 照明装置包括通过使用无铅流动焊料封装在电路板上的电路板和薄膜电容器。 每个薄膜电容器包括聚丙烯薄膜和导线，并且导线的材料的导热率低于铜的热导率，薄膜电容器的端子和内部材料是无引线的。 引线的直径为0.6-（mm）以下，横截面积为35mm以下，薄膜电容器的引线端子的温度为 焊接工艺为130℃以下。