公开(公告)号：US07667975B2

公开(公告)日：2010-02-23

申请号：US10580071

申请日：2004-12-15

申请人： Yasushi Kambara ,  Akira Motoyama ,  Masayuki Nakajima

发明人： Yasushi Kambara ,  Akira Motoyama ,  Masayuki Nakajima

IPC分类号： H05K7/00

CPC分类号： H01G4/228 ,  H01G2/06 ,  H01G4/18 ,  H05B41/2827 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/062 ,  H05K2201/10909 ,  H05K2203/304

摘要： A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6− (mm) or less, a cross-sectional area is 35 mm2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.

摘要翻译： 提供了一种用于灯装置的照明装置。 照明装置包括通过使用无铅流动焊料封装在电路板上的电路板和薄膜电容器。 每个薄膜电容器包括聚丙烯薄膜和导线，并且导线的材料的导热率低于铜的热导率，薄膜电容器的端子和内部材料是无引线的。 引线的直径为0.6-（mm）以下，截面积为35mm 2以下，焊接工序中的薄膜电容器的引线的末端的温度为130℃。 或更少。

公开(公告)号：US20070103879A1

公开(公告)日：2007-05-10

申请号：US10580071

申请日：2004-12-15

申请人： Yasushi Kambara ,  Akira Motoyama ,  Masayuki Nakajima

发明人： Yasushi Kambara ,  Akira Motoyama ,  Masayuki Nakajima

IPC分类号： H05K1/18

CPC分类号： H01G4/228 ,  H01G2/06 ,  H01G4/18 ,  H05B41/2827 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/062 ,  H05K2201/10909 ,  H05K2203/304

摘要： A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6- (mm) or less, a cross-sectional area is 35 mm 2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.

摘要翻译： 提供了一种用于灯装置的照明装置。 照明装置包括通过使用无铅流动焊料封装在电路板上的电路板和薄膜电容器。 每个薄膜电容器包括聚丙烯薄膜和导线，并且导线的材料的导热率低于铜的热导率，薄膜电容器的端子和内部材料是无引线的。 引线的直径为0.6-（mm）以下，横截面积为35mm以下，薄膜电容器的引线端子的温度为 焊接工艺为130℃以下。

公开(公告)号：US20120142817A1

公开(公告)日：2012-06-07

申请号：US12958460

申请日：2010-12-02

申请人： Shanti Swarup ,  Masayuki Nakajima ,  Umesh C. Desai ,  Tien-Chieh Chao ,  Charles M. Kania ,  Britt Minch

发明人： Shanti Swarup ,  Masayuki Nakajima ,  Umesh C. Desai ,  Tien-Chieh Chao ,  Charles M. Kania ,  Britt Minch

IPC分类号： C08L33/20 ,  C08L63/00

CPC分类号： C08G59/4021 ,  C08G59/4261 ,  C08G59/50 ,  C09J163/00

摘要： Curable, one-package, stable adhesive compositions are provided comprising: (a) a resin component comprising a polyepoxide, (b) a polyamine having at least two primary amine, secondary amine, and/or ketimine functional groups; and (c) a curing component comprising dicyandiamide and an accelerator. At least a portion of the polyepoxide in the resin component is reacted with carboxy-terminated butadiene acrylonitrile polymer. The accelerator comprises a reaction product comprising a renewable polyol, a diisocyanate, and a dialkyl monoamine containing alkyl groups with at least two carbon atoms each. The compositions are suitable for use as adhesive compositions over a wide temperature range.

摘要翻译： 提供了可固化的单包装稳定的粘合剂组合物，其包含：（a）包含聚环氧化物的树脂组分，（b）具有至少两个伯胺，仲胺和/或酮亚胺官能团的多胺; 和（c）包含双氰胺和促进剂的固化组分。 树脂组分中的至少一部分聚环氧化物与羧基封端的丁二烯丙烯腈聚合物反应。 促进剂包括包含可再生多元醇，二异氰酸酯和含有至少两个碳原子的烷基的二烷基单胺的反应产物。 该组合物适用于宽温度范围内的粘合剂组合物。

公开(公告)号：US20120129980A1

公开(公告)日：2012-05-24

申请号：US13315518

申请日：2011-12-09

申请人： Umesh C. Desai ,  Tien-Chieh Chao ,  Masayuki Nakajima ,  Kaliappa G. Ragunathan

发明人： Umesh C. Desai ,  Tien-Chieh Chao ,  Masayuki Nakajima ,  Kaliappa G. Ragunathan

IPC分类号： C09J163/00 ,  C09J1/00 ,  B82Y30/00

CPC分类号： B82Y30/00 ,  C08G59/182 ,  C08G59/4276 ,  C08G59/5006 ,  C08L63/00 ,  C08L2205/02 ,  C09J163/00 ,  C08L21/00

摘要： Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct.

摘要翻译： 本文公开了包含（a）第一组分的组合物，其包含（1）作为包含第一环氧化合物，多元醇和酸酐和/或二酸的反应物的反应产物的环氧加合物和（2）第二环氧树脂 复合; （b）具有核/壳结构和/或石墨烯碳颗粒的橡胶颗粒; 和（c）在环境温度或轻微条件下与第一组分发生化学反应的第二组分。 本文还公开了包含（a）环氧树脂封端的增韧剂的组合物; （b）热活化潜伏性固化剂; 和（c）具有核/壳结构和/或石墨烯碳颗粒的橡胶颗粒; （d）环氧/ CTBN加合物; 和/或（e）环氧/二聚酸加合物。

公开(公告)号：US20120128499A1

公开(公告)日：2012-05-24

申请号：US12949878

申请日：2010-11-19

申请人： Umesh C. Desai ,  Tien-Chieh Chao ,  Masayuki Nakajima ,  Kaliappa Ragunathan

发明人： Umesh C. Desai ,  Tien-Chieh Chao ,  Masayuki Nakajima ,  Kaliappa Ragunathan

IPC分类号： F03D11/00 ,  C09J11/04 ,  B32B37/14 ,  B32B37/02 ,  B32B37/12 ,  C09J163/00 ,  C09J113/00

CPC分类号： F03D1/065 ,  C08G59/182 ,  C08G59/186 ,  C08G59/226 ,  C08G59/50 ,  C09J163/00 ,  F05B2230/23 ,  Y02E10/721 ,  Y02P70/523

摘要： Disclosed herein are 2K structural adhesive compositions comprising (a) a first component comprising (i) an epoxy-adduct formed as a reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid; and (ii) a second epoxy compound; and (b) a second component that reacts with the first component. In one embodiment, the second component is an amine compound. These adhesives may be used to bond together substrate materials such as two half shells of wind turbine blades.

摘要翻译： 本文公开了2K种结构粘合剂组合物，其包含（a）第一组分，其包含（i）由包含第一环氧化合物，多元醇和酸酐和/或二酸的反应物的反应产物形成的环氧加合物; 和（ii）第二环氧化合物; 和（b）与第一组分反应的第二组分。 在一个实施方案中，第二组分是胺化合物。 这些粘合剂可用于将诸如风力涡轮机叶片的两个半壳的基底材料结合在一起。

公开(公告)号：US06657001B1

公开(公告)日：2003-12-02

申请号：US09629444

申请日：2000-07-31

申请人： Lawrence G. Anderson ,  Karen A. Barkac ,  Shawn A. DeSaw ,  Marvis E. Hartman ,  Deborah E. Hayes ,  Thomas R. Hockswender ,  Kymarie L. Kuster ,  Masayuki Nakajima ,  Kurt G. Olson ,  Richard J. Sadvary ,  Dennis A. Simpson ,  Shiryn Tyebjee ,  Truman F. Wilt

发明人： Lawrence G. Anderson ,  Karen A. Barkac ,  Shawn A. DeSaw ,  Marvis E. Hartman ,  Deborah E. Hayes ,  Thomas R. Hockswender ,  Kymarie L. Kuster ,  Masayuki Nakajima ,  Kurt G. Olson ,  Richard J. Sadvary ,  Dennis A. Simpson ,  Shiryn Tyebjee ,  Truman F. Wilt

IPC分类号： C08L8304

CPC分类号： B82Y30/00 ,  C08J3/20 ,  C08K3/01 ,  C08K3/22 ,  C08K3/36 ,  C08K2201/011 ,  C09D7/00 ,  C09D7/61 ,  C09D7/67 ,  C09D7/68 ,  C09D7/69 ,  C09D183/04 ,  C08L2666/14 ,  C08L2666/54 ,  C08L2666/04

摘要： Compositions are provided which contain (a) one or more polysiloxanes comprising at least one reactive functional group; a plurality of particles; and, optionally, one or more curing agents comprising at least one functional group that is reactive with any reactive functional group of polysiloxane (a). Additionally, a process for applying the multi-component composite coatings described above to a substrate and coated substrates are provided. A process for preparing the coating compositions also is provided. The multi-component composite coating compositions of the invention provide highly scratch resistant color-plus-clearcoatings capable of retaining scratch resistance after weathering.

摘要翻译： 提供了包含（a）一种或多种包含至少一个反应性官能团的聚硅氧烷的组合物; 多个颗粒; 和任选的一种或多种固化剂，其包含与聚硅氧烷（a）的任何反应性官能团反应的至少一个官能团。 另外，提供了将上述多组分复合涂层施加到基底和涂覆的基底上的方法。 还提供了制备涂料组合物的方法。 本发明的多组分复合涂料组合物提供了耐风化后能够保持耐刮擦性的高耐划伤性的彩色 - 透明涂层。

公开(公告)号：US5457174A

公开(公告)日：1995-10-10

申请号：US278136

申请日：1994-07-21

申请人： Katsushige Hayashi ,  Mitsuhiko Masumoto ,  Masayuki Nakajima ,  Takuya Hasaki ,  Masahiko Ishikawa ,  Atsushi Hirashima

发明人： Katsushige Hayashi ,  Mitsuhiko Masumoto ,  Masayuki Nakajima ,  Takuya Hasaki ,  Masahiko Ishikawa ,  Atsushi Hirashima

IPC分类号： C08G64/30 ,  C08G64/00

CPC分类号： C08G64/307

摘要： A process for preparing a polycarbonate which comprises performing a transesterification and a polycondensation reaction with a diarylcarbonate and dihydroxyaryl compound, in a reaction apparatus composed of stainless steel comprising at least 12% by weight of Ni, and at least 22% by weight of Cr, and having Fe as the remaining main component. A polycarbonate which has a good color, is stable to hydrolysis and resistant to heat-yellowing is the resulting product.

摘要翻译： 一种制备聚碳酸酯的方法，包括在由包含至少12重量％的Ni和至少22重量％的Cr的不锈钢构成的反应装置中进行与二芳基碳酸酯和二羟基芳基化合物的酯交换和缩聚反应， 并且具有Fe作为剩余的主要成分。 具有良好颜色的聚碳酸酯，对于水解稳定并且耐黄变是产生的产物。

公开(公告)号：US5236656A

公开(公告)日：1993-08-17

申请号：US761514

申请日：1991-09-18

申请人： Masayuki Nakajima

发明人： Masayuki Nakajima

IPC分类号： B29B11/08 ,  B29B11/14 ,  B29C49/06 ,  B29C49/70 ,  B29L23/18

CPC分类号： B29C49/061 ,  B29C49/70 ,  B29L2031/703

摘要： A method of injection blow molding a synthetic resin bellows product having root portions and crest portions, each of which has the axially sectional form of a circular arc, and incline portions therebetween, for example, a plastic bellows product such as a constant-velocity joint boot, a steering boot or the like. The method is capable of molding a product having a thickness uniform throughout, and particularly, root portions having little dimensional variations. The method involves firstly molding the parison root portions or the root portions plus their adjacent areas into substantially the same shape as those of a final product by injection molding during molding of a parison, and then blow molding only the crest portions and the incline portions to obtain the shape of the final product.

公开(公告)号：US4910249A

公开(公告)日：1990-03-20

申请号：US187788

申请日：1988-05-02

申请人： Charles M. Kania ,  Gregory J. McCollum ,  Masayuki Nakajima

发明人： Charles M. Kania ,  Gregory J. McCollum ,  Masayuki Nakajima

IPC分类号： C08L25/18 ,  C08F26/00 ,  C08F26/02 ,  C08F212/14 ,  C08F220/10 ,  C08F220/34 ,  C08F226/02 ,  C08L25/00 ,  C08L33/04 ,  C08L33/08 ,  C08L39/00 ,  C09C3/10 ,  C09D17/00 ,  C09D133/04 ,  C09D133/08

CPC分类号： C08F212/14 ,  C08F220/34 ,  C09D17/002

摘要： An acrylic copolymer reaction product of a primary amine group-containing copolymerizable vinyl monomer and an ethylenically unsaturated copolymerizable monomer is disclosed. Further, pigment dispersions, including the copolymer reaction product, pigment, and a liquid carrier, are disclosed.

公开(公告)号：US4702796A

公开(公告)日：1987-10-27

申请号：US931583

申请日：1986-11-14

申请人： Masayuki Nakajima ,  Shinichi Sato ,  Akira Tokui ,  Akira Kawai ,  Masao Nagatomo ,  Hiroji Ozaki

发明人： Masayuki Nakajima ,  Shinichi Sato ,  Akira Tokui ,  Akira Kawai ,  Masao Nagatomo ,  Hiroji Ozaki

IPC分类号： H01L21/74 ,  H01L21/8242 ,  H01L23/556 ,  H01L21/04 ,  B44C1/22 ,  H01L21/22 ,  H01L21/306

CPC分类号： H01L27/10844 ,  H01L21/74 ,  H01L23/556 ,  H01L2224/16245 ,  H01L2224/48247 ,  Y10S438/965

摘要： The present invention is a method for fabricating a semiconductor device, wherein impurity is selectively diffused to surround a region (7) of a second conductivity type as a bit line formed on a semiconductor substrate (1), thereby forming an impurity diffused region (9) of a first conductivity type having high density and, by extending the impurity diffused region (9) in the element separating step to form a high density region of the first conductivity type having high density.

摘要翻译： 本发明是一种制造半导体器件的方法，其中杂质被选择性扩散以包围形成在半导体衬底（1）上的位线的第二导电类型的区域（7），从而形成杂质扩散区域（9 ），并且通过在元件分离步骤中扩展杂质扩散区域（9）以形成具有高密度的第一导电类型的高密度区域。