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    Heat radiating device and electronic equipment mounted on vehicle
    1.
    发明申请
    Heat radiating device and electronic equipment mounted on vehicle 审中-公开
    散热装置和车载电子设备

    公开(公告)号：US20060215369A1

    公开(公告)日：2006-09-28

    申请号：US11388063

    申请日：2006-03-23

    申请人： Yasushi Ohashi ,  Takushi Maeda

    发明人： Yasushi Ohashi ,  Takushi Maeda

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20445 ,  H01L23/42 ,  H01L23/433 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20436 ,  H01L2924/00

    摘要： In a heat radiating device and electronic equipment mounted on a vehicle, grid-shaped grooves 16 are formed on a lower face of a fan casing 7 which functions as a heat sink, and an annular ditch 15 is formed a round a region in which the grid-shaped grooves 16 are formed. Heat-conductive grease 14 interposed between IC chip 5 and a lower face of the fan casing 7 is prevented by the grid-shaped grooves 16 from slipping out. Even when a quantity of the coated heat-conductive grease 14 is excessively large in the beginning and forced out from a region in which the grid-shaped grooves 16 are formed, the heat-conductive grease 14, which has forced out in this way, is stored in an annular ditch 15 and not forced outside. In a cooling device in which heat of an object to be cooled is transmitted to a heat sink via the heat-conductive grease and radiated outside, the heat-conductive grease is prevented from being forced out from between the object to be cooled and the heat sink.

    摘要翻译： 在安装在车辆上的散热装置和电子设备中，在用作散热器的风扇壳体7的下表面上形成有格子状的槽16，并且环形沟15形成在其中 形成有格子状的槽16。 插入在IC芯片5和风扇壳体7的下表面之间的导热油脂14被网格形槽16滑出而被防止。 即使一开始涂布的导热性润滑脂14的数量过大，从形成有格栅状槽16的区域被强制出来，也以这种方式被强制排出的导热性润滑脂14， 存储在环形沟槽15中，而不是被迫在外面。 在冷却装置中，待冷却物体的热量经由导热油脂传递到散热片并辐射到外部，防止导热性油脂从被冷却物体与热量之间被强制排出 水槽。

    Semiconductor strain sensor and manufacturing method thereof
    2.
    发明授权
    Semiconductor strain sensor and manufacturing method thereof 失效
    半导体应变传感器及其制造方法

    公开(公告)号：US5150616A

    公开(公告)日：1992-09-29

    申请号：US575526

    申请日：1990-08-31

    申请人： Munenari Kondo ,  Masahito Imai ,  Ryoichi Narita ,  Takushi Maeda

    发明人： Munenari Kondo ,  Masahito Imai ,  Ryoichi Narita ,  Takushi Maeda

    IPC分类号： G01P15/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/09

    CPC分类号： G01P15/08 ,  G01P1/023

    摘要： A semiconductor strain sensor having a stem with a lead hole in which a lead terminal is installed and electrically coupled to an external circuit. A sensor chip having piezo-resistors to a bride circuit is joined with a front surface of the stem. A shell is joined with the front surface of the stem by projection welding after the back surface of the stem is flattened to within a predetermined limit. A space formed by the shell and stem is filled with a damping liquid. The stem is integrally coupled to the sensor chip through an adhesive, and spacers are added to the adhesive to keep the thickness of the adhesive to a predetermined value. This arrangement can effectively prevent propagation of the welding strain of the stem from adversely affecting the sensor chip.

    摘要翻译： 一种半导体应变传感器，其具有带引线孔的杆，引线端子安装在该引线端子中并电耦合到外部电路。 具有新娘电路的压电阻的传感器芯片与杆的前表面相连接。 在杆的后表面平坦化到预定极限之后，壳体通过凸起焊接与杆的前表面接合。 由壳体和杆形成的空间填充有阻尼液体。 杆通过粘合剂一体地联接到传感器芯片，并且将间隔物添加到粘合剂中以将粘合剂的厚度保持在预定值。 这种布置可以有效地防止杆的焊接应变的传播不利地影响传感器芯片。