公开(公告)号：US20120312164A1

公开(公告)日：2012-12-13

申请号：US13578262

申请日：2011-02-24

申请人： Yasutaka Inubushi ,  Chikako Ikeda ,  Koichi Kanehira

发明人： Yasutaka Inubushi ,  Chikako Ikeda ,  Koichi Kanehira

IPC分类号： C07F3/06 ,  B01D53/053 ,  B01D53/04

CPC分类号： B01J20/226 ,  B01D53/02 ,  B01D2253/204 ,  B01D2257/102 ,  B01D2257/104 ,  B01D2257/108 ,  B01D2257/11 ,  B01D2257/302 ,  B01D2257/304 ,  B01D2257/404 ,  B01D2257/406 ,  B01D2257/50 ,  B01D2257/702 ,  B01J20/3085 ,  B01J20/3425 ,  B01J20/3483 ,  B01J20/3491 ,  C01B3/0015 ,  C07C7/12 ,  C07C51/41 ,  C07C51/412 ,  C07C65/21 ,  C07D213/22 ,  C07D213/53 ,  C07D401/14 ,  C07F3/003 ,  Y02E60/328 ,  Y10S95/90

摘要： This invention provides a metal complex having a gas adsorption capability, a gas storing capability, and a gas separation capability. The present invention attained the above object by a metal complex comprising: a dicarboxylic acid compound (I) represented by the following General Formula (I), wherein R1, R2, R3, and R4 are as defined in the specification; at least one metal ion selected from ions of a metal belonging to Group 2 and Groups 7 to 12 of the periodic table; and an organic ligand capable of bidentate binding to the metal ion, the organic ligand belonging to the D∞h point group, having a longitudinal length of not less than 8.0 Å and less than 16.0 Å, and having 2 to 7 heteroatoms.

摘要翻译： 本发明提供具有气体吸附能力，气体存储能力和气体分离能力的金属络合物。 本发明通过金属络合物达到上述目的，包括：由以下通式（I）表示的二羧酸化合物（I），其中R1，R2，R3和R4如说明书中所定义; 选自属于周期表第2族和第7至12族的金属的离子中的至少一种金属离子; 和能够二元结合金属离子的有机配体，属于D∞h点基团的有机配体，纵向长度不小于并且小于16.0埃，并且具有2至7个杂原子。

公开(公告)号：US08741030B2

公开(公告)日：2014-06-03

申请号：US13578262

申请日：2011-02-24

申请人： Yasutaka Inubushi ,  Chikako Ikeda ,  Koichi Kanehira

发明人： Yasutaka Inubushi ,  Chikako Ikeda ,  Koichi Kanehira

IPC分类号： C07D213/22 ,  B01J20/22 ,  C07C51/41 ,  C07C7/12 ,  C07D213/53 ,  B01D53/02

CPC分类号： B01J20/226 ,  B01D53/02 ,  B01D2253/204 ,  B01D2257/102 ,  B01D2257/104 ,  B01D2257/108 ,  B01D2257/11 ,  B01D2257/302 ,  B01D2257/304 ,  B01D2257/404 ,  B01D2257/406 ,  B01D2257/50 ,  B01D2257/702 ,  B01J20/3085 ,  B01J20/3425 ,  B01J20/3483 ,  B01J20/3491 ,  C01B3/0015 ,  C07C7/12 ,  C07C51/41 ,  C07C51/412 ,  C07C65/21 ,  C07D213/22 ,  C07D213/53 ,  C07D401/14 ,  C07F3/003 ,  Y02E60/328 ,  Y10S95/90

摘要： This invention provides a metal complex having a gas adsorption capability, a gas storing capability, and a gas separation capability. The present invention attained the above object by a metal complex comprising:a dicarboxylic acid compound (I) represented by the following General Formula (I), wherein R1, R2, R3, and R4 are as defined in the specification; at least one metal ion selected from ions of a metal belonging to Group 2 and Groups 7 to 12 of the periodic table; and an organic ligand capable of bidentate binding to the metal ion, the organic ligand belonging to the D∞h point group, having a longitudinal length of not less than 8.0 Å and less than 16.0 Å, and having 2 to 7 heteroatoms.

摘要翻译： 本发明提供具有气体吸附能力，气体存储能力和气体分离能力的金属络合物。 本发明通过金属络合物达到上述目的，包括：由以下通式（I）表示的二羧酸化合物（I），其中R1，R2，R3和R4如说明书中所定义; 选自属于周期表第2族和第7至12族的金属的离子中的至少一种金属离子; 和能够二元结合金属离子的有机配体，属于D∞h点基团的有机配体，纵向长度不小于并且小于16.0埃，并且具有2至7个杂原子。

公开(公告)号：US20140190436A1

公开(公告)日：2014-07-10

申请号：US14238662

申请日：2012-08-08

申请人： Yasutaka Inubushi ,  Chikako Ikeda ,  Takashi Hori

发明人： Yasutaka Inubushi ,  Chikako Ikeda ,  Takashi Hori

IPC分类号： B01J20/30 ,  B01D53/047 ,  B01D53/04 ,  B01J20/22

CPC分类号： B01D53/0462 ,  B01D53/02 ,  B01D53/047 ,  B01D2253/204 ,  B01D2256/18 ,  B01D2257/102 ,  B01D2257/104 ,  B01D2257/304 ,  B01D2257/406 ,  B01D2257/502 ,  B01D2257/504 ,  B01D2257/702 ,  B01D2257/80 ,  B01J20/223 ,  B01J20/226 ,  B01J20/3085 ,  B01J20/3425 ,  B01J20/3483 ,  B01J20/3491 ,  C01B3/56 ,  C01B2203/042 ,  C01B2203/043 ,  C01B2203/0475 ,  C07C63/28 ,  C07C65/21 ,  C07F3/003 ,  Y02C10/08 ,  Y02P20/152 ,  Y02P20/51 ,  Y02P30/30

摘要： The problem of providing a metal complex having excellent gas adsorption performance, gas storage performance, and gas separation performance is solved by a metal complex comprising a dicarboxylic acid compound (I) including 20 to 99 mole % of a dicarboxylic acid compound (I-1) selected from terephthalic acid derivatives having an electron-donating group in the 2nd position such as 2-methoxyterephthalic acid, 2-methylterephthalic acid, and terephthalic acid, and 80 to 1 mole % of a dicarboxylic acid compound (I-2) selected from terephthalic acid derivatives having an electron-withdrawing group in the 2nd position such as 2-nitroterephthalic acid, 2-fluoroterephthalic acid, 2-chloroterephthalic acid, 2-bromoterephthalic acid, and 2-iodoterephthalic acid; at least one kind of metal ion selected from metal ions belonging to Group 2 and Groups 7 to 12 of the periodic table; and an organic ligand capable of bidentate binding to the metal ion.

摘要翻译： 提供具有优异的气体吸附性能，气体储存性能和气体分离性能的金属络合物的问题是通过包含二羧酸化合物（I）的二元羧酸化合物（I）的二元羧酸化合物（I-1） ），选自2-甲氧基对苯二甲酸，2-甲基对苯二甲酸和对苯二甲酸等第二位的具有给电子基团的对苯二甲酸衍生物，和选自80〜1摩尔％的二羧酸化合物（I-2） 2-取代对苯二甲酸，2-氟对苯二甲酸，2-氯对苯二甲酸，2-溴对苯二甲酸，2-碘对苯二甲酸等第二位具有吸电子基团的对苯二甲酸衍生物; 选自属于周期表第2族和第7至12族的金属离子中的至少一种金属离子; 和能够双齿结合金属离子的有机配体。

公开(公告)号：US09662606B2

公开(公告)日：2017-05-30

申请号：US14238662

申请日：2012-08-08

申请人： Yasutaka Inubushi ,  Chikako Ikeda ,  Takashi Hori

发明人： Yasutaka Inubushi ,  Chikako Ikeda ,  Takashi Hori

IPC分类号： B01D53/04 ,  B01D53/02 ,  C07C63/28 ,  B01J20/22 ,  B01J20/30 ,  B01J20/34 ,  B01D53/047 ,  C01B3/56 ,  C07C65/21 ,  C07F3/00

CPC分类号： B01D53/0462 ,  B01D53/02 ,  B01D53/047 ,  B01D2253/204 ,  B01D2256/18 ,  B01D2257/102 ,  B01D2257/104 ,  B01D2257/304 ,  B01D2257/406 ,  B01D2257/502 ,  B01D2257/504 ,  B01D2257/702 ,  B01D2257/80 ,  B01J20/223 ,  B01J20/226 ,  B01J20/3085 ,  B01J20/3425 ,  B01J20/3483 ,  B01J20/3491 ,  C01B3/56 ,  C01B2203/042 ,  C01B2203/043 ,  C01B2203/0475 ,  C07C63/28 ,  C07C65/21 ,  C07F3/003 ,  Y02C10/08 ,  Y02P20/152 ,  Y02P20/51 ,  Y02P30/30

摘要： The problem of providing a metal complex having excellent gas adsorption performance, gas storage performance, and gas separation performance is solved by a metal complex comprising a dicarboxylic acid compound (I) including 20 to 99 mole % of a dicarboxylic acid compound (I-1) selected from terephthalic acid derivatives having an electron-donating group in the 2nd position such as 2-methoxyterephthalic acid, 2-methylterephthalic acid, and terephthalic acid, and 80 to 1 mole % of a dicarboxylic acid compound (I-2) selected from terephthalic acid derivatives having an electron-withdrawing group in the 2nd position such as 2-nitroterephthalic acid, 2-fluoroterephthalic acid, 2-chloroterephthalic acid, 2-bromoterephthalic acid, and 2-iodoterephthalic acid; at least one kind of metal ion selected from metal ions belonging to Group 2 and Groups 7 to 12 of the periodic table; and an organic ligand capable of bidentate binding to the metal ion.

公开(公告)号：US08242036B2

公开(公告)日：2012-08-14

申请号：US12065049

申请日：2006-09-01

申请人： Chikako Ikeda

发明人： Chikako Ikeda

IPC分类号： B32B27/32 ,  B32B27/12

CPC分类号： C09J123/14 ,  C08L23/10 ,  C08L23/142 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2666/02 ,  Y10T428/31692 ,  Y10T428/31797 ,  Y10T428/31909 ,  Y10T442/3886 ,  Y10T442/678

摘要： An adhesive resin composition excellent in adhesiveness and heat resistance thereof, film-forming properties, and film quality and a laminate having an adhesive resin layer made of this adhesive resin composition are provided.The Composition is an adhesive resin composition comprising 10-99.5% by weight resin ingredient (A), 0.5-30% by weight another resin ingredient (unsaturated-carboxylic-acid-modified polypropylene), and 0-89.5% by weight still another resin ingredient (olefin resin).Resin ingredient (A): a product of successive propylene polymerization comprising 10-60% by weight (propylene homopolymer) component and 40-90% by weight (propylene/ethylene copolymer) component. The contents of room-temperature-xylene solubles derived from (a2), room-temperature-xylene insolubles derived from (a2), and room-temperature-xylene solubles derived from the same are 1-20% by weight, lower than 20% by weight, and 10-60% by weight, respectively, based on resin ingredient (A). The room-temperature-xylene solubles derived from (a2) have a content of α-olefins excluding propylene of 20% by weight or higher.

摘要翻译： 提供粘合性和耐热性优异，成膜性和膜质量的粘合剂树脂组合物和具有由该粘合剂树脂组合物制成的粘合树脂层的层压体。 该组合物是一种粘合剂树脂组合物，其包含10-99.5重量％的树脂成分（A），0.5-30重量％的其它树脂成分（不饱和羧酸改性聚丙烯）和0-89.5重量％的另一种树脂 成分（烯烃树脂）。 树脂成分（A）：包含10-60重量％（丙烯均聚物）组分和40-90重量％（丙烯/乙烯共聚物）组分的连续丙烯聚合产物。 从（a2）得到的室温二甲苯可溶物的含量，来自（a2）的室温二甲苯不溶物以及来自（a2）的室温二甲苯不溶物的含量为1-20重量％，低于20重量％ ，和基于树脂成分（A）的10〜60重量％。 由（a2）得到的室温二甲苯可溶物的除丙烯以外的α-烯烃的含量为20重量％以上。

公开(公告)号：USD500285S1

公开(公告)日：2004-12-28

申请号：US29196086

申请日：2003-12-23

申请人： Chikako Ikeda

设计人： Chikako Ikeda

公开(公告)号：US20090104830A1

公开(公告)日：2009-04-23

申请号：US12065049

申请日：2006-09-01

申请人： Chikako Ikeda

发明人： Chikako Ikeda

IPC分类号： B32B27/08 ,  C08L33/02 ,  C08L23/14 ,  B32B15/08 ,  B32B27/12

CPC分类号： C09J123/14 ,  C08L23/10 ,  C08L23/142 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2666/02 ,  Y10T428/31692 ,  Y10T428/31797 ,  Y10T428/31909 ,  Y10T442/3886 ,  Y10T442/678

摘要： An adhesive resin composition excellent in adhesiveness and heat resistance thereof, film-forming properties, and film quality and a laminate having an adhesive resin layer made of this adhesive resin composition are provided.The composition is an adhesive resin composition comprising 10-99.5% by weight resin ingredient (A), 0.5-30% by weight another resin ingredient (unsaturated-carboxylic-acid-modified polypropylene), and 0-89.5% by weight still another resin ingredient (olefin resin).Resin ingredient (A): a product of successive propylene polymerization comprising 10-60% by weight (propylene homopolymer) component and 40-90% by weight (propylene/ethylene copolymer) component. The contents of room-temperature-xylene solubles derived from (a2), room-temperature-xylene insolubles derived from (a2), and room-temperature-xylene solubles derived from the same are 1-20% by weight, lower than 20% by weight, and 10-60% by weight, respectively, based on resin ingredient (A). The room-temperature-xylene solubles derived from (a2) have a content of α-olefins excluding propylene of 20% by weight or higher.

摘要翻译： 提供粘合性和耐热性优异，成膜性和膜质量的粘合剂树脂组合物和具有由该粘合剂树脂组合物制成的粘合树脂层的层压体。 该组合物是包含10-99.5重量％的树脂成分（A），0.5-30重量％的其它树脂成分（不饱和羧酸改性聚丙烯）和0-89.5重量％的其它树脂 成分（烯烃树脂）。 树脂成分（A）：包含10-60重量％（丙烯均聚物）组分和40-90重量％（丙烯/乙烯共聚物）组分的连续丙烯聚合产物。 从（a2）得到的室温二甲苯可溶物的含量，来自（a2）的室温二甲苯不溶物的含量以及由其衍生的室温二甲苯可溶物的含量为1-20重量％，低于20重量％ ，和基于树脂成分（A）的10〜60重量％。 来源于（a2）的室温二甲苯可溶物的含量除丙烯以外的α-烯烃的含量为20重量％以上。

公开(公告)号：USD516015S1

公开(公告)日：2006-02-28

申请号：US29216878

申请日：2004-11-10

申请人： Chikako Ikeda

设计人： Chikako Ikeda

公开(公告)号：US5591792A

公开(公告)日：1997-01-07

申请号：US370871

申请日：1995-01-10

申请人： Masafumi Hattori ,  Chikako Ikeda ,  Satoru Sugimoto ,  Tatsuoki Saito ,  Hitoshi Yamada ,  Etsushi Akashige

发明人： Masafumi Hattori ,  Chikako Ikeda ,  Satoru Sugimoto ,  Tatsuoki Saito ,  Hitoshi Yamada ,  Etsushi Akashige

IPC分类号： C08L23/04 ,  C08L23/00 ,  C08L23/26 ,  C08L51/06 ,  C08L53/00 ,  C08L53/02 ,  C08L101/00 ,  C09J123/04 ,  C09J123/26 ,  C09J153/02 ,  C08L93/04

CPC分类号： C09J123/26 ,  C09J123/04 ,  C09J153/02

摘要： The invention relates to an adhesive resin composition comprising an ethylene polymer having a melting point of 70 to 132.degree. C., a density of 0.88 to 0.94% g/cm.sup.3 and a melt flow rate (MFR) of 0.05 to 50 g/10 min. and/or a modified product thereof with an unsaturated carboxylic acid or its derivative (component A); a tackifier (component B); and a block copolymer containing at least one polymer block mainly composed of a vinyl aromatic hydrocarbon and at least one polymer block mainly composed of a conjugated diene or a hydrogenated product thereof (component C). This composition is useful as an adhesives showing excellent adhesion over a wide temperature range as well as processability by film molding, sheet molding, blow molding, etc. It is available for laminates comprising various kinds of resins such as polyolefins, styrenic resins, polyesters, acrylic resins and polyamides.

摘要翻译： 本发明涉及一种粘合剂树脂组合物，其包含熔点为70至132℃，密度为0.88至0.94％g / cm 3，熔体流动速率（MFR）为0.05至50g / 10min的乙烯聚合物 。 和/或其与不饱和羧酸或其衍生物（组分A）的改性产物; 增粘剂（组分B）; 和含有至少一个主要由乙烯基芳烃组成的聚合物嵌段和至少一个主要由共轭二烯或其氢化产物组成的聚合物嵌段（组分C）的嵌段共聚物。 该组合物可用作在宽温度范围内显示优异粘合性的粘合剂以及通过膜成型，片状成型，吹塑成型等的加工性。它可用于包括各种树脂如聚烯烃，苯乙烯树脂，聚酯， 丙烯酸树脂和聚酰胺。

公开(公告)号：US08207072B2

公开(公告)日：2012-06-26

申请号：US12065049

申请日：2006-09-01

申请人： Chikako Ikeda

发明人： Chikako Ikeda

IPC分类号： B32B27/32 ,  B32B27/12

摘要： An adhesive resin composition excellent in adhesiveness and heat resistance thereof, film-forming properties, and film quality and a laminate having an adhesive resin layer made of this adhesive resin composition are provided.The Composition is an adhesive resin composition comprising 10-99.5% by weight resin ingredient (A), 0.5-30% by weight another resin ingredient (unsaturated-carboxylic-acid-modified polypropylene), and 0-89.5% by weight still another resin ingredient (olefin resin).Resin ingredient (A): a product of successive propylene polymerization comprising 10-60% by weight (propylene homopolymer) component and 40-90% by weight (propylene/ethylene copolymer) component. The contents of room-temperature-xylene solubles derived from (a2), room-temperature-xylene insolubles derived from (a2), and room-temperature-xylene solubles derived from the same are 1-20% by weight, lower than 20% by weight, and 10-60% by weight, respectively, based on resin ingredient (A). The room-temperature-xylene solubles derived from (a2) have a content of α-olefins excluding propylene of 20% by weight or higher.