公开(公告)号：US20140319028A1

公开(公告)日：2014-10-30

申请号：US14259927

申请日：2014-04-23

申请人： Yasuyuki ENDOU ,  Masaki TAMURA ,  Masahiro NAKA ,  Toshiyuki YAMAGATA ,  Hiroyuki SHIBATA

发明人： Yasuyuki ENDOU ,  Masaki TAMURA ,  Masahiro NAKA ,  Toshiyuki YAMAGATA ,  Hiroyuki SHIBATA

IPC分类号： B07C5/36

CPC分类号： B07C5/368 ,  B65C9/1865 ,  B65C9/40 ,  B65C2009/404

摘要： The invention relates to a label separating apparatus in which, of labels formed in rows and columns on a continuous substrate being transported along a line of transport, labels found good and labels found defective upon determination of their quality are transported separately. The invention seeks to ensure that all of a plurality of defective labels possibly extant in any one of the rows can concurrently be transferred without fail selectively onto a different line of transport.The apparatus includes a primary conveyer in which a continuous substrate 21A is transported having labels 22A-22D, which are spaced apart from each other by a given distance and arranged in rows and columns, formed thereon and peelably adhered thereto. The primary conveyer includes a transport turn-back member 12A for permitting labels 22A-22D for each row concurrently to peel off the continuous substrate 21. In the apparatus, a label peeled off by the transport turn-back member 12A and found defective is subjected to an air blast by an air-blasting member 15A, 15B, 15C, 15D and is thereby oriented in transport towards a conveyer for defective labels 14 and adhered to on the conveyer for defective labels 14 while it is held by a label holding member 16 formed with an air draining vent 16C.

摘要翻译： 本发明涉及一种标签分离装置，其中沿连续基板上的行和列形成的标签沿着运输线传送，标签发现良好，并且在确定其质量时发现有缺陷的标签分开运输。 本发明寻求确保可能存在于任何行中的多个有缺陷的标签的所有可以并发地被选择性地传送到不同的传输线上。 该设备包括一个主输送机，其中连续的基板21A被输送具有标签22A-22D，它们彼此间隔开一定距离并以行和列的形式布置在其上并且可剥离地粘附在其上。 一次输送机包括一个允许每一行允许标签22A-22D同时从连续基片21上剥离的输送折回元件12A。在该装置中，由传送回卷元件12A剥离而发现有缺陷的标签 通过喷气构件15A，15B，15C，15D进行鼓风，从而朝向用于缺陷标签14的输送机传送，并且在由标签保持构件16保持的情况下粘附到用于缺陷标签14的输送机上 形成有排气口16C。

公开(公告)号：US20100308421A1

公开(公告)日：2010-12-09

申请号：US12767071

申请日：2010-04-26

申请人： Akira MUTO ,  Yuichi MACHIDA ,  Nobuya KOIKE ,  Atsushi FUJIKI ,  Masaki TAMURA

发明人： Akira MUTO ,  Yuichi MACHIDA ,  Nobuya KOIKE ,  Atsushi FUJIKI ,  Masaki TAMURA

IPC分类号： H01L27/088 ,  H01L23/52 ,  H01L23/28

CPC分类号： H01L25/074 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73253 ,  H01L2924/13091

摘要： The size of a semiconductor device is reduced. A semiconductor chip in which a power MOSFET is placed above a semiconductor chip in which another power MOSFET is formed and they are sealed with an encapsulation resin portion. The semiconductor chips are so arranged that the upper semiconductor chip does not overlap with the area positioned directly above a gate pad electrode of the lower semiconductor chip. The semiconductor chips are identical in size and the respective source pad electrodes and gate pad electrodes of the lower semiconductor chip and the upper semiconductor chip are identical in shape and arrangement. The lower semiconductor chip and the upper semiconductor chip are arranged with their respective centers displaced from each other.

摘要翻译： 半导体器件的尺寸减小。 一种半导体芯片，其中功率MOSFET被放置在其上形成另一功率MOSFET的半导体芯片之上，并且它们被密封树脂​​部分密封。 半导体芯片被布置成使得上半导体芯片不与位于下半导体芯片的栅极焊盘电极正下方的区域重叠。 半导体芯片的尺寸相同，并且下半导体芯片和上半导体芯片的各个源极焊盘电极和栅极焊盘电极的形状和布置相同。 下半导体芯片和上半导体芯片被布置成它们各自的中心彼此偏离。