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公开(公告)号：US20080185698A1
公开(公告)日：2008-08-07
申请号：US11942496
申请日：2007-11-19
申请人： Yen-Wen Tseng , Mei-Lin Hsieh , Chih-Hung Hsu , Kuang-Hsiung Chen
发明人： Yen-Wen Tseng , Mei-Lin Hsieh , Chih-Hung Hsu , Kuang-Hsiung Chen
IPC分类号： H01L23/495 , H01L23/48
CPC分类号： H01L23/49548 , H01L23/3107 , H01L23/49513 , H01L24/16 , H01L24/48 , H01L24/97 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package structure is disclosed. The structure comprises a die pad, a chip, leads, a recess, and an encapsulant. The chip is disposed on the die pad. The leads are disposed on a periphery of the die pad and electrically connected to the chip. The recess is formed on the top surface of at least one of the leads and extends to the outside surface thereof. The encapsulant is used for encapsulating the die pad, the chip, the leads, and the recess.
摘要翻译： 公开了半导体封装结构。 该结构包括管芯焊盘，芯片，引线，凹槽和密封剂。 芯片设置在芯片上。 引线设置在芯片焊盘的外围并与芯片电连接。 凹部形成在至少一个引线的顶表面上并延伸到其外表面。 密封剂用于封装管芯焊盘，芯片，引线和凹槽。
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公开(公告)号：US08304865B2
公开(公告)日：2012-11-06
申请号：US12859470
申请日：2010-08-19
申请人： Yueh-Chen Hsu , Mei-Lin Hsieh , Chih-Hung Hsu , Kuang-Hsiung Chen , Yi-Cheng Hsu
发明人： Yueh-Chen Hsu , Mei-Lin Hsieh , Chih-Hung Hsu , Kuang-Hsiung Chen , Yi-Cheng Hsu
IPC分类号： H01L23/495
CPC分类号： H01L23/49541 , H01L23/3107 , H01L23/49551 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A leadframe including a die pad, leads, an outer frame, connecting bars and grounding bars is provided. Each of the grounding bars is suspended between two connecting bars by being connected with branches of the two connecting bars, such that the grounding bars are spaced by the die pad. The leadframe and the chip package of the present invention can permit a great design variation.
摘要翻译： 提供了包括管芯焊盘，引线，外框架，连接条和接地条的引线框架。 每个接地棒通过与两个连接杆的分支连接而悬挂在两个连接杆之间，使得接地棒由管芯垫隔开。 本发明的引线框架和芯片封装可以允许很大的设计变化。
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公开(公告)号：US20110062567A1
公开(公告)日：2011-03-17
申请号：US12859470
申请日：2010-08-19
申请人： Yueh-Chen Hsu , Mei-Lin Hsieh , Chih-Hung Hsu , Kuang-Hsiung Chen , Yi-Cheng Hsu
发明人： Yueh-Chen Hsu , Mei-Lin Hsieh , Chih-Hung Hsu , Kuang-Hsiung Chen , Yi-Cheng Hsu
IPC分类号： H01L23/495
CPC分类号： H01L23/49541 , H01L23/3107 , H01L23/49551 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A leadframe including a die pad, leads, an outer frame, connecting bars and grounding bars is provided. Each of the grounding bars is suspended between two connecting bars by being connected with branches of the two connecting bars, such that the grounding bars are spaced by the die pad. The leadframe and the chip package of the present invention can permit a great design variation.
摘要翻译： 提供了包括管芯焊盘，引线，外框架，连接条和接地条的引线框架。 每个接地棒通过与两个连接杆的分支连接而悬挂在两个连接杆之间，使得接地棒由管芯垫隔开。 本发明的引线框架和芯片封装可以允许很大的设计变化。
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公开(公告)号：US20080230882A1
公开(公告)日：2008-09-25
申请号：US12051403
申请日：2008-03-19
申请人： Mei-Lin Hsieh , Chih-Hung Hsu , Kuang-Hsiung Chen
发明人： Mei-Lin Hsieh , Chih-Hung Hsu , Kuang-Hsiung Chen
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L21/565 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip package structure includes a die pad of which at least a notch is formed on at least one side and opposite to a mold gate. The die pad contributes to accelerating the injection of an encapsulating material, so as to exhaust the air in the mold in time, before the encapsulating material solidifies during the molding step, thereby overcoming or at least improving the problem of defects such as air bubbles in the encapsulation.
摘要翻译： 芯片封装结构包括在至少一个侧面上形成至少一个凹口并与模具门相对的芯片焊盘。 芯片垫有助于加速封装材料的注入，以便在模制步骤期间封装材料固化之前及时排出模具中的空气，从而克服或至少改善诸如气泡之类的缺陷的问题 封装。
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5.发明授权公开(公告)号：US08592962B2
公开(公告)日：2013-11-26
申请号：US13219981
申请日：2011-08-29
IPC分类号： H01L23/495
CPC分类号： H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49558 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A Quad Flat No Leads (QFN) package includes a lead frame, a chip, an encapsulant, and a protective layer. The lead frame includes a plurality of leads. Each of the leads has a lower surface that is divided into a contact area and a non-contact area. The chip is configured on and electrically connected to the lead frame. The encapsulant encapsulates the chip and the leads and fills spaces between the leads. The contact areas and the non-contact areas of the leads are exposed by the encapsulant. The protective layer covers the non-contact areas of the leads.
摘要翻译： Quad Flat No Leads（QFN）封装包括引线框架，芯片，密封剂和保护层。 引线框架包括多个引线。 每个引线具有被分成接触区域和非接触区域的下表面。 芯片配置在引线框架上并电连接到引线框架。 密封剂封装芯片和引线并填充引线之间的空间。 引线的接触区域和非接触区域被密封剂暴露出来。 保护层覆盖引线的非接触区域。
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6.发明申请公开(公告)号：US20120104584A1
公开(公告)日：2012-05-03
申请号：US13219981
申请日：2011-08-29
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49558 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A Quad Flat No Leads (QFN) package includes a lead frame, a chip, an encapsulant, and a protective layer. The lead frame includes a plurality of leads. Each of the leads has a lower surface that is divided into a contact area and a non-contact area. The chip is configured on and electrically connected to the lead frame. The encapsulant encapsulates the chip and the leads and fills spaces between the leads. The contact areas and the non-contact areas of the leads are exposed by the encapsulant. The protective layer covers the non-contact areas of the leads.
摘要翻译： Quad Flat No Leads（QFN）封装包括引线框架，芯片，密封剂和保护层。 引线框架包括多个引线。 每个引线具有被分成接触区域和非接触区域的下表面。 芯片配置在引线框架上并电连接到引线框架。 密封剂封装芯片和引线并填充引线之间的空间。 引线的接触区域和非接触区域被密封剂暴露出来。 保护层覆盖引线的非接触区域。
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公开(公告)号：US08214139B2
公开(公告)日：2012-07-03
申请号：US12146035
申请日：2008-06-25
IPC分类号： G01C21/16
摘要： Techniques are described for position source selection. In an implementation, an electronic device provides a variety of functionality including at least functionality to determine position. The electronic device may be further configured to select between a plurality of position sources to determine position based upon a variety of selection criteria. In an implementation, a last known position may be stored when position is being determined through the plurality of position sources. The last known position may be used as an alternative to determining position via the position sources when one or more of the position sources are unavailable. In another implementation, the last known position may be employed to automatically select one of the plurality of position sources to be used by the electronic device for determining position.
摘要翻译： 描述了用于位置源选择的技术。 在实现中，电子设备提供多种功能，包括至少功能来确定位置。 电子设备还可以被配置为在多个位置源之间进行选择，以基于各种选择标准来确定位置。 在实现中，当通过多个位置源确定位置时，可以存储最后一个已知位置。 当一个或多个位置源不可用时，最后一个已知位置可以用作通过位置源来确定位置的替代。 在另一实施方式中，可以采用最后一个已知位置来自动选择要被电子设备用于确定位置的多个位置源之一。
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公开(公告)号：US20090192709A1
公开(公告)日：2009-07-30
申请号：US12146035
申请日：2008-06-25
摘要： Techniques are described for position source selection. In an implementation, an electronic device provides a variety of functionality including at least functionality to determine position. The electronic device may be further configured to select between a plurality of position sources to determine position based upon a variety of selection criteria. In an implementation, a last known position may be stored when position is being determined through the plurality of position sources. The last known position may be used as an alternative to determining position via the position sources when one or more of the position sources are unavailable. In another implementation, the last known position may be employed to automatically select one of the plurality of position sources to be used by the electronic device for determining position.
摘要翻译： 描述了用于位置源选择的技术。 在实现中，电子设备提供多种功能，包括至少功能来确定位置。 电子设备还可以被配置为在多个位置源之间进行选择，以基于各种选择标准来确定位置。 在实现中，当通过多个位置源确定位置时，可以存储最后一个已知位置。 当一个或多个位置源不可用时，最后一个已知位置可以用作通过位置源来确定位置的替代。 在另一实施方案中，可以采用最后一个已知位置来自动选择要被电子设备用于确定位置的多个位置源之一。
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