公开(公告)号：US20240357749A1

公开(公告)日：2024-10-24

申请号：US18232403

申请日：2023-08-10

Applicant: Yield Engineering Systems, Inc.

Inventor： Kenneth Sautter ,  Syndee Young ,  Charudatta Galande

IPC: H05K3/38 ,  H05K3/14 ,  H05K3/42

CPC classification number: H05K3/389 ,  H05K1/0353 ,  H05K3/146 ,  H05K3/382 ,  H05K3/386 ,  H05K3/42 ,  Y10T29/49155

Abstract: An electronic device having a substrate with a metal structure, a mono-layer coating of a selected silane composition on a surface of the metal structure, and an organic layer on the mono-layer coating, wherein the mono-layer coating improves the interfacial adhesion strength between the metal surface and the organic material.

公开(公告)号：US11818849B1

公开(公告)日：2023-11-14

申请号：US18137876

申请日：2023-04-21

Applicant: Yield Engineering Systems, Inc.

Inventor： Kenneth Sautter ,  Syndee Young ,  Charudatta Galande

IPC: H05K3/38 ,  H05K3/42 ,  H05K3/14

CPC classification number: H05K3/389 ,  H05K3/146 ,  H05K3/382 ,  H05K3/386 ,  H05K3/42 ,  Y10T29/49155

Abstract: A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate with a metal structure, depositing a mono-layer of a selected silane composition on a surface of the metal structure with a vapor of the selected silane composition, and coating the treated surface with an organic material.