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公开(公告)号：US20090011680A1
公开(公告)日：2009-01-08
申请号：US12230317
申请日：2008-08-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
摘要翻译： 抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。
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公开(公告)号：US20070254557A1
公开(公告)日：2007-11-01
申请号：US11819453
申请日：2007-06-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
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公开(公告)号：US07438627B2
公开(公告)日：2008-10-21
申请号：US11819453
申请日：2007-06-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
摘要翻译： 抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。
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公开(公告)号：US08342907B2
公开(公告)日：2013-01-01
申请号：US12627333
申请日：2009-11-30
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
摘要翻译： 抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。
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公开(公告)号：US07645181B2
公开(公告)日：2010-01-12
申请号：US12230317
申请日：2008-08-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
摘要翻译： 抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。
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公开(公告)号：US07252575B2
公开(公告)日：2007-08-07
申请号：US10526933
申请日：2003-10-15
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
摘要翻译： 抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。 抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的 由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。 抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值 光谱数据生成器生成的光谱数据。
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公开(公告)号：US20060166606A1
公开(公告)日：2006-07-27
申请号：US10526933
申请日：2003-10-15
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
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公开(公告)号：US5442574A
公开(公告)日：1995-08-15
申请号：US28930
申请日：1993-03-08
申请人： Kazunari Shinya
发明人： Kazunari Shinya
CPC分类号： G06K9/00503
摘要： A method and apparatus for determining a base line of a measurement curve wherein after preparing a template having an arc upward convex, a CPU of the data processing system moves, without rotating, the template with the arc of the template always contacting the measurement curve and determines the base line as the envelope of the arc of the template. During moving of the template, the system may move the template horizontally under the measurement curve; calculate, at every horizontal point at a given horizontal position of the template, the vertical distance between the arc of the template and the arc of the measurement curve; detect the minimum of the vertical distance at the given horizontal position of the template; and move the template vertically at the given horizontal position by the minimum vertical distance. To determine the base line, the CPU initializes data of the base line by the smallest value and judges whether the arc of the template after moved is superior to the arc before moved at every point of the arc after moved. The data of the base line is updated at the points where the arc after moved is superior to the are before moved by the data of the arc after moved.
摘要翻译： 一种用于确定测量曲线的基线的方法和装置，其中在准备具有弧向上凸起的模板之后，数据处理系统的CPU不转动模板，而模板的弧始终与测量曲线接触，并且 将基线确定为模板弧的包络线。 在移动模板期间，系统可以在测量曲线下水平移动模板; 在模板的给定水平位置的每个水平点处计算模板的弧线与测量曲线的弧之间的垂直距离; 检测模板给定水平位置的垂直距离的最小值; 并在给定的水平位置垂直移动模板最小垂直距离。 要确定基线，CPU将基线的数据初始化为最小值，并判断移动后的模板的弧线是否在移动后的每个弧点移动之前优于弧。 基线的数据在移动后的弧高于移动后的弧的数据移动之前的位置更新。
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公开(公告)号：US07002693B2
公开(公告)日：2006-02-21
申请号：US10440198
申请日：2003-05-19
申请人： Kazunari Shinya
发明人： Kazunari Shinya
IPC分类号： G01B9/02
CPC分类号： G01B11/0625
摘要： A monochromatic light is cast on a thin layer, and the intensity of the reflected light which is an interference light of the lights reflected by the front surface and back surface of the layer. A spectrum (a measured spectrum) is obtained from the measured intensity by scanning the wavenumber of the monochromatic light. On the other hand, a constructed spectrum is created based on an assumed thickness using a predetermined function. Then an error between the measured spectrum and the constructed spectrum is calculated. The value of the error is plotted against the assumed thickness, and the point at which the error is minimum is detected. The assumed thickness at the error-minimum point is determined as the thickness of the layer.
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10.发明授权公开(公告)号：US07012699B2
公开(公告)日：2006-03-14
申请号：US10643870
申请日：2003-08-20
申请人： Kazunari Shinya , Takashi Nishimura
发明人： Kazunari Shinya , Takashi Nishimura
IPC分类号： G01B11/02
CPC分类号： G01B11/0675
摘要： The present invention provides a method of measuring the thickness of a thin film or thin layer by a spectroscopic measurement, which is applicable to the measurement of a multiple layered film whose layers have different refractive indices. According to the method, an interference light from the film is measured to create a measured spectrum. The waveform of the measured spectrum can be approximately represented by a linear sum of base spectrums. Accordingly, various constructed spectrums are created using base spectrums each having a cycle interval as a parameter. Then, the constructed spectrum that minimizes the square error against the measured spectrum is identified. The least square error is calculated for each of predetermined cycle intervals. A graph is drawn to represent the relation between the least square error and the cycle interval. The correspondence between the layers and the plural minimum points of the least square error appearing on the graph is determined. The thickness of each layer is calculated from the cycle interval at which the minimum point appears and the refractive index of the layer.
摘要翻译： 本发明提供了一种通过光谱测量来测量薄膜或薄层的厚度的方法，其可应用于层的折射率不同的多层膜的测量。 根据该方法，测量来自膜的干涉光以产生测量光谱。 所测量的光谱的波形可以近似地由基本光谱的线性和表示。 因此，使用各自具有周期间隔作为参数的基本频谱来创建各种构造的频谱。 然后，确定最小化相对于测量光谱的平方误差的构造频谱。 对于每个预定周期间隔计算最小二乘误差。 绘制一个图表来表示最小二乘误差和周期间隔之间的关系。 确定出现在图上的层与最小二乘错误的多个最小点之间的对应关系。 每个层的厚度由出现最小点的周期间隔和层的折射率计算。
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