Abstract:
When reliability evaluation of the whole electronic package is performed, the time required for simulation is decreased, while solder connection parts, in particular, are accurately analyzed. The whole analysis model creating unit creates a solder connection part model which has the same volume, height, and connection area as the volume, height, and connection area of the solder connection part. By means of dividing the solder connection model into multiple meshes, the first mesh data for use in electronic package analysis is created.
Abstract:
A connector includes a contact pin in which a free end projecting from a supporting member comes into contact with an electrode of a first object and a second object, and a bending part is provided onto a base end such that the connector has an inclination against the first object and the second object. The rigidity of the bending parts is selectively set to be high by selectively increasing a thickness of the bending part.
Abstract:
A connector includes a contact pin in which a free end projecting from a supporting member comes into contact with an electrode of a first object and a second object, and a bending part is provided onto a base end such that the connector has an inclination against the first object and the second object. The rigidity of the bending parts is selectively set to be high by selectively increasing a thickness of the bending part.
Abstract:
An analysis-model-producing apparatus for producing an analysis model from a shape model, comprising means for specifying a deletion method for deleting, from geometric shape data constituting the shape model, geometric shape data that is unnecessary to production of an analysis model, and means for deleting unnecessary data, using the specified deletion method.
Abstract:
An apparatus for predicting a deformation of a board includes a board dividing unit that divides the board into a plurality of areas based on wiring information on the board; and a deformation predicting unit that grasps a wiring pattern of an area macroscopically, calculates an equivalent physical property value equivalent to a modulus of longitudinal elasticity and a coefficient of thermal expansion by a finite element method, and predicts the deformation of the board based on the equivalent physical property value calculated for each of the areas divided by the board dividing unit.
Abstract:
An apparatus for predicting a deformation of a board includes a board dividing unit that divides the board into a plurality of areas based on wiring information on the board; and a deformation predicting unit that grasps a wiring pattern of an area macroscopically, calculates an equivalent physical property value equivalent to a modulus of longitudinal elasticity and a coefficient of thermal expansion by a finite element method, and predicts the deformation of the board based on the equivalent physical property value calculated for each of the areas divided by the board dividing unit.
Abstract:
The present invention provides a method for manufacturing a fabric and an apparatus for manufacturing a fabric that enable weaving of weak fibers including monofilaments of noble metal such as 24-carat gold. The present invention provides a method for manufacturing a fabric using a power loom driven by driving means, comprising the steps of: (a) separating a warp into an upper part and a lower part to form a shed by means of rotation of said driving means; (b) accelerating a weft thread toward said shed by means of rotation of said driving means; (c) passing said weft thread through said shed by means of rotation of said driving means; (d) decelerating said weft thread passed through said shed by means of rotation of said driving means; (e) returning said warp to close said shed by means of rotation of said driving means; and (f) beating said weft thread inserted into said warp in said step (c) to draw up said weft thread into near side by means of rotation of said driving means; rotational speed of said driving means during said steps (b) and (d) being lower than rotational speed of said driving means during said step (c).
Abstract:
A reflow process evaluation device includes, a stress calculation part for calculating an average principal stress acting on a joint portion, wherein a principal stress occurs when a chip and a substrate are joined by solder with a reflow method and a rupture occurrence ratio computation part for computing an occurrence ratio at which the joint portion ruptures based on a relational expression between the occurrence ratio and the average principal stress acting on the joint portion and the average principal stress calculated by the stress calculation part.
Abstract:
A numerical analysis data creating method creates numerical analysis data that are obtained by analyzing an analyzing target. The method judges whether or not to create the numerical analysis data of the analyzing target using data that have been stored in a database part, searches the database part based on information related to the analyzing target and displaying a search result if the numerical analysis data of the analyzing target are to be created using the stored data, and creates and stores in the database part the numerical analysis data of the analyzing target by modifying usable data if necessary, when the usable data exist in the search result. The data that have been stored in the database part include numerical analysis data, analysis model data, material characteristic data and attribute data with respect to targets that have been analyzed.