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    Electronic package evaluation apparatus, electronic package optimizing apparatus, and computer-readable recording medium in which electronic package evaluation program is recorded
    1.
    发明授权
    Electronic package evaluation apparatus, electronic package optimizing apparatus, and computer-readable recording medium in which electronic package evaluation program is recorded 有权
    电子封装评估装置，电子封装优化装置和记录有电子封装评估程序的计算机可读记录介质

    公开(公告)号：US07725866B2

    公开(公告)日：2010-05-25

    申请号：US11855681

    申请日：2007-09-14

    Applicant: Yoko Kobayashi ,  Hidehisa Sakai ,  Yoshiteru Ochi

    Inventor： Yoko Kobayashi ,  Hidehisa Sakai ,  Yoshiteru Ochi

    IPC: G06F17/50

    CPC classification number: G06F17/5018 ,  G06F2217/40

    Abstract: When reliability evaluation of the whole electronic package is performed, the time required for simulation is decreased, while solder connection parts, in particular, are accurately analyzed. The whole analysis model creating unit creates a solder connection part model which has the same volume, height, and connection area as the volume, height, and connection area of the solder connection part. By means of dividing the solder connection model into multiple meshes, the first mesh data for use in electronic package analysis is created.

    Abstract translation: 当执行整个电子封装的可靠性评估时，模拟所需的时间减少，特别是焊接连接部分被精确地分析。 整个分析模型创建单元产生与焊料连接部分的体积，高度和连接面积相同的体积，高度和连接面积的焊料连接部分模型。 通过将焊接连接模型划分为多个网格，创建用于电子包装分析的第一个网格数据。

    ELECTRONIC PACKAGE EVALUATION APPARATUS, ELECTRONIC PACKAGE OPTIMIZING APPARATUS, AND COMPUTER-READABLE RECORDING MEDIUM IN WHICH ELECTRONIC PACKAGE EVALUATION PROGRAM IS RECORDED
    2.
    发明申请
    ELECTRONIC PACKAGE EVALUATION APPARATUS, ELECTRONIC PACKAGE OPTIMIZING APPARATUS, AND COMPUTER-READABLE RECORDING MEDIUM IN WHICH ELECTRONIC PACKAGE EVALUATION PROGRAM IS RECORDED 有权
    电子包装评估装置，电子包装优化装置和电子包装评估程序记录的计算机可读记录介质

    公开(公告)号：US20080127011A1

    公开(公告)日：2008-05-29

    申请号：US11855681

    申请日：2007-09-14

    Applicant: Yoko KOBAYASHI ,  Hidehisa Sakai ,  Yoshiteru Ochi

    Inventor： Yoko KOBAYASHI ,  Hidehisa Sakai ,  Yoshiteru Ochi

    IPC: G06F17/50 ,  G06F19/00

    CPC classification number: G06F17/5018 ,  G06F2217/40

    Abstract: When reliability evaluation of the whole electronic package is performed, the time required for simulation is decreased, while solder connection parts, in particular, are accurately analyzed. The whole analysis model creating unit creates a solder connection part model which has the same volume, height, and connection area as the volume, height, and connection area of the solder connection part. By means of dividing the solder connection model into multiple meshes, the first mesh data for use in electronic package analysis is created.

    Abstract translation: 当执行整个电子封装的可靠性评估时，模拟所需的时间减少，特别是焊接连接部分被精确地分析。 整个分析模型创建单元产生与焊料连接部分的体积，高度和连接面积相同的体积，高度和连接面积的焊料连接部分模型。 通过将焊接连接模型划分为多个网格，创建用于电子包装分析的第一个网格数据。

    Connector, electronic device, and method of manufacturing electronic device
    3.
    发明授权
    Connector, electronic device, and method of manufacturing electronic device 有权
    连接器，电子设备和制造电子设备的方法

    公开(公告)号：US08083528B2

    公开(公告)日：2011-12-27

    申请号：US12553610

    申请日：2009-09-03

    Applicant: Makoto Sakairi ,  Nobutaka Itoh ,  Yoshiteru Ochi ,  Yoko Kobayashi

    Inventor： Makoto Sakairi ,  Nobutaka Itoh ,  Yoshiteru Ochi ,  Yoko Kobayashi

    IPC: H01R12/00

    CPC classification number: H01R13/2435 ,  H01R12/714 ,  Y10T29/49121

    Abstract: A connector includes a contact pin in which a free end projecting from a supporting member comes into contact with an electrode of a first object and a second object, and a bending part is provided onto a base end such that the connector has an inclination against the first object and the second object. The rigidity of the bending parts is selectively set to be high by selectively increasing a thickness of the bending part.

    Abstract translation: 连接器包括接触销，其中从支撑构件突出的自由端与第一物体和第二物体的电极接触，并且弯曲部设置在基端上，使得连接器具有相对于 第一个对象和第二个对象。 通过选择性地增加弯曲部的厚度，可以选择性地将弯曲部的刚性设定为高。

    ANALYSIS-MODEL-PRODUCING APPARATUS AND ANALYSIS-MODEL-PRODUCING METHOD
    4.
    发明申请
    ANALYSIS-MODEL-PRODUCING APPARATUS AND ANALYSIS-MODEL-PRODUCING METHOD 审中-公开
    分析 - 模型生产设备和分析 - 模型生产方法

    公开(公告)号：US20090324095A1

    公开(公告)日：2009-12-31

    申请号：US12555998

    申请日：2009-09-09

    Applicant: Makoto Sakairi ,  Nobutaka Itoh ,  Yoshiteru Ochi ,  Yoko Kobayashi

    Inventor： Makoto Sakairi ,  Nobutaka Itoh ,  Yoshiteru Ochi ,  Yoko Kobayashi

    IPC: G06K9/46

    CPC classification number: G06F17/50 ,  G06F17/5009 ,  G06F2217/16

    Abstract: An analysis-model-producing apparatus for producing an analysis model from a shape model, comprising means for specifying a deletion method for deleting, from geometric shape data constituting the shape model, geometric shape data that is unnecessary to production of an analysis model, and means for deleting unnecessary data, using the specified deletion method.

    Abstract translation: 一种用于从形状模型生成分析模型的分析模型生成装置，包括用于指定从构成所述形状模型的几何形状数据中删除的删除方法的装置，用于生成分析模型不需要的几何形状数据，以及 使用指定的删除方法删除不必要的数据的方法。

    CONNECTOR, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
    5.
    发明申请
    CONNECTOR, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE 有权
    电子设备的连接器和制造电子设备的方法

    公开(公告)号：US20090325401A1

    公开(公告)日：2009-12-31

    申请号：US12553610

    申请日：2009-09-03

    Applicant: Makoto Sakairi ,  Nobutaka Itoh ,  Yoshiteru Ochi ,  Yoko Kobayashi

    Inventor： Makoto Sakairi ,  Nobutaka Itoh ,  Yoshiteru Ochi ,  Yoko Kobayashi

    IPC: H01R12/00 ,  H01R43/00

    CPC classification number: H01R13/2435 ,  H01R12/714 ,  Y10T29/49121

    Abstract: A connector includes a contact pin in which a free end projecting from a supporting member comes into contact with an electrode of a first object and a second object, and a bending part is provided onto a base end such that the connector has an inclination against the first object and the second object. The rigidity of the bending parts is selectively set to be high by selectively increasing a thickness of the bending part.

    Abstract translation: 连接器包括接触销，其中从支撑构件突出的自由端与第一物体和第二物体的电极接触，并且弯曲部设置在基端上，使得连接器具有相对于 第一个对象和第二个对象。 通过选择性地增加弯曲部的厚度，可以选择性地将弯曲部的刚性设定为高。

    Bonding model generation apparatus and bonding model generation method
    7.
    发明授权
    Bonding model generation apparatus and bonding model generation method 有权
    绑定模型生成装置和绑定模型生成方法

    公开(公告)号：US08744810B2

    公开(公告)日：2014-06-03

    申请号：US13024307

    申请日：2011-02-09

    Applicant: Nobutaka Itoh ,  Makoto Sakairi ,  Mami Nakadate ,  Yoshiteru Ochi ,  Akiyoshi Saitou

    Inventor： Nobutaka Itoh ,  Makoto Sakairi ,  Mami Nakadate ,  Yoshiteru Ochi ,  Akiyoshi Saitou

    IPC: G06F17/50

    CPC classification number: G06F17/5068 ,  G06F17/50 ,  G06F17/5018

    Abstract: A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.

    Abstract translation: 接合表面提取单元参照接合信息，从第一部分模型的数据和对应于接合的顶面的第二接合面的数据中提取与接合模型的底面对应的第一接合面的数据 模型从第二部分模型的数据。 第一部分模型是包括在电路板中的焊盘的模型。 第二部分模型是包括在部件中的电极的模型。 电极通过接合材料与焊盘接合。 接合模型生成单元生成在第一接合面和第二接合面的轮廓之间建立连接的侧面，并且基于由侧面，第一接合面和第二接合面形成的形状获得接合模型的数据 第二结合面。

    Electronic device, washer and method for manufacturing washer
    8.
    发明授权
    Electronic device, washer and method for manufacturing washer 失效
    电子设备，洗衣机和洗衣机制造方法

    公开(公告)号：US08378220B2

    公开(公告)日：2013-02-19

    申请号：US12887594

    申请日：2010-09-22

    Applicant: Yoshiteru Ochi ,  Nobutaka Itoh ,  Makoto Sakairi

    Inventor： Yoshiteru Ochi ,  Nobutaka Itoh ,  Makoto Sakairi

    IPC: H05K7/14 ,  H05K7/12 ,  H05K7/02 ,  H01R4/70 ,  B23P11/02 ,  B23P17/04 ,  F16B43/00 ,  B21D53/20

    CPC classification number: F16B39/01 ,  B21D53/20 ,  F16B5/0241 ,  Y10T29/49 ,  Y10T29/49863 ,  Y10T29/49865 ,  Y10T29/49869

    Abstract: An electronic device includes, a circuit board including a through hole, a member including a screw hole, a screw including a screw body having an outer diameter smaller than an inner diameter of the through hole and a screw head having an outer diameter larger than the inner diameter of the through hole, wherein the screw body penetrates through the through hole to engage with the screw hole and the screw head is disposed on an opposite side of the circuit board to the member, and a first washer provided between the screw head and the circuit board, the first washer including a first washer body and a plurality of first washer legs extending from the first washer body toward the circuit board, the first washer legs being in contact with the circuit board and having a characteristic of reducing stress on the circuit board upon being heated.

    Abstract translation: 一种电子设备包括：电路板，包括通孔，包括螺孔的构件，包括外径小于通孔内径的螺钉本体的螺钉和外径大于通孔的螺钉头; 所述通孔的内径，其中所述螺丝体穿过所述通孔以与所述螺纹孔接合，并且所述螺钉头设置在所述电路板的与所述构件相对的一侧上，并且所述螺钉头设置在所述螺钉头和 所述电路板，所述第一垫圈包括第一垫圈体和从所述第一垫圈主体朝向所述电路板延伸的多个第一垫圈腿，所述第一垫圈腿与所述电路板接触，并且具有减小 电路板加热时。

    BONDING MODEL GENERATION APPARATUS AND BONDING MODEL GENERATION METHOD
    9.
    发明申请
    BONDING MODEL GENERATION APPARATUS AND BONDING MODEL GENERATION METHOD 有权
    连接模型生成装置和联接模型生成方法

    公开(公告)号：US20110208485A1

    公开(公告)日：2011-08-25

    申请号：US13024307

    申请日：2011-02-09

    Applicant: Nobutaka ITOH ,  Makoto Sakairi ,  Mami Nakadate ,  Yoshiteru Ochi ,  Akiyoshi Saitou

    Inventor： Nobutaka ITOH ,  Makoto Sakairi ,  Mami Nakadate ,  Yoshiteru Ochi ,  Akiyoshi Saitou

    IPC: G06F17/50

    CPC classification number: G06F17/5068 ,  G06F17/50 ,  G06F17/5018

    Abstract: A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.

    Abstract translation: 接合表面提取单元参照接合信息，从第一部分模型的数据和对应于接合的顶面的第二接合面的数据中提取与接合模型的底面对应的第一接合面的数据 模型从第二部分模型的数据。 第一部分模型是包括在电路板中的焊盘的模型。 第二部分模型是包括在部件中的电极的模型。 电极通过接合材料与焊盘接合。 接合模型生成单元生成在第一接合面和第二接合面的轮廓之间建立连接的侧面，并且基于由侧面，第一接合面和第二接合面形成的形状获得接合模型的数据 第二结合面。

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