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1.发明授权公开(公告)号：US08083528B2
公开(公告)日：2011-12-27
申请号：US12553610
申请日：2009-09-03
申请人： Makoto Sakairi , Nobutaka Itoh , Yoshiteru Ochi , Yoko Kobayashi
发明人： Makoto Sakairi , Nobutaka Itoh , Yoshiteru Ochi , Yoko Kobayashi
IPC分类号： H01R12/00
CPC分类号： H01R13/2435 , H01R12/714 , Y10T29/49121
摘要： A connector includes a contact pin in which a free end projecting from a supporting member comes into contact with an electrode of a first object and a second object, and a bending part is provided onto a base end such that the connector has an inclination against the first object and the second object. The rigidity of the bending parts is selectively set to be high by selectively increasing a thickness of the bending part.
摘要翻译： 连接器包括接触销，其中从支撑构件突出的自由端与第一物体和第二物体的电极接触，并且弯曲部设置在基端上，使得连接器具有相对于 第一个对象和第二个对象。 通过选择性地增加弯曲部的厚度，可以选择性地将弯曲部的刚性设定为高。
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2.发明申请ANALYSIS-MODEL-PRODUCING APPARATUS AND ANALYSIS-MODEL-PRODUCING METHOD 审中-公开分析 - 模型生产设备和分析 - 模型生产方法公开(公告)号：US20090324095A1
公开(公告)日：2009-12-31
申请号：US12555998
申请日：2009-09-09
申请人： Makoto Sakairi , Nobutaka Itoh , Yoshiteru Ochi , Yoko Kobayashi
发明人： Makoto Sakairi , Nobutaka Itoh , Yoshiteru Ochi , Yoko Kobayashi
IPC分类号： G06K9/46
CPC分类号： G06F17/50 , G06F17/5009 , G06F2217/16
摘要： An analysis-model-producing apparatus for producing an analysis model from a shape model, comprising means for specifying a deletion method for deleting, from geometric shape data constituting the shape model, geometric shape data that is unnecessary to production of an analysis model, and means for deleting unnecessary data, using the specified deletion method.
摘要翻译： 一种用于从形状模型生成分析模型的分析模型生成装置，包括用于指定从构成所述形状模型的几何形状数据中删除的删除方法的装置，用于生成分析模型不需要的几何形状数据，以及 使用指定的删除方法删除不必要的数据的方法。
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3.发明申请公开(公告)号：US20090325401A1
公开(公告)日：2009-12-31
申请号：US12553610
申请日：2009-09-03
申请人： Makoto Sakairi , Nobutaka Itoh , Yoshiteru Ochi , Yoko Kobayashi
发明人： Makoto Sakairi , Nobutaka Itoh , Yoshiteru Ochi , Yoko Kobayashi
CPC分类号： H01R13/2435 , H01R12/714 , Y10T29/49121
摘要： A connector includes a contact pin in which a free end projecting from a supporting member comes into contact with an electrode of a first object and a second object, and a bending part is provided onto a base end such that the connector has an inclination against the first object and the second object. The rigidity of the bending parts is selectively set to be high by selectively increasing a thickness of the bending part.
摘要翻译： 连接器包括接触销，其中从支撑构件突出的自由端与第一物体和第二物体的电极接触，并且弯曲部设置在基端上，使得连接器具有相对于 第一个对象和第二个对象。 通过选择性地增加弯曲部的厚度，可以选择性地将弯曲部的刚性设定为高。
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公开(公告)号：US20110085305A1
公开(公告)日：2011-04-14
申请号：US12887594
申请日：2010-09-22
申请人： Yoshiteru OCHI , Nobutaka Itoh , Makoto Sakairi
发明人： Yoshiteru OCHI , Nobutaka Itoh , Makoto Sakairi
CPC分类号： F16B39/01 , B21D53/20 , F16B5/0241 , Y10T29/49 , Y10T29/49863 , Y10T29/49865 , Y10T29/49869
摘要： An electronic device includes, a circuit board including a through hole, a member including a screw hole, a screw including a screw body having an outer diameter smaller than an inner diameter of the through hole and a screw head having an outer diameter larger than the inner diameter of the through hole, wherein the screw body penetrates through the through hole to engage with the screw hole and the screw head is disposed on an opposite side of the circuit board to the member, and a first washer provided between the screw head and the circuit board, the first washer including a first washer body and a plurality of first washer legs extending from the first washer body toward the circuit board, the first washer legs being in contact with the circuit board and having a characteristic of reducing stress on the circuit board upon being heated.
摘要翻译： 一种电子设备包括：电路板，包括通孔，包括螺孔的构件，包括外径小于通孔内径的螺钉本体的螺钉和外径大于通孔的螺钉头; 所述通孔的内径，其中所述螺丝体穿过所述通孔以与所述螺纹孔接合，并且所述螺钉头设置在所述电路板的与所述构件相对的一侧上，并且所述螺钉头设置在所述螺钉头和 所述电路板，所述第一垫圈包括第一垫圈体和从所述第一垫圈主体朝向所述电路板延伸的多个第一垫圈腿，所述第一垫圈腿与所述电路板接触，并且具有减小 电路板加热时。
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公开(公告)号：US20110208485A1
公开(公告)日：2011-08-25
申请号：US13024307
申请日：2011-02-09
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , G06F17/50 , G06F17/5018
摘要： A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.
摘要翻译： 接合表面提取单元参照接合信息，从第一部分模型的数据和对应于接合的顶面的第二接合面的数据中提取与接合模型的底面对应的第一接合面的数据 模型从第二部分模型的数据。 第一部分模型是包括在电路板中的焊盘的模型。 第二部分模型是包括在部件中的电极的模型。 电极通过接合材料与焊盘接合。 接合模型生成单元生成在第一接合面和第二接合面的轮廓之间建立连接的侧面，并且基于由侧面，第一接合面和第二接合面形成的形状获得接合模型的数据 第二结合面。
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公开(公告)号：US08744810B2
公开(公告)日：2014-06-03
申请号：US13024307
申请日：2011-02-09
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , G06F17/50 , G06F17/5018
摘要： A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.
摘要翻译： 接合表面提取单元参照接合信息，从第一部分模型的数据和对应于接合的顶面的第二接合面的数据中提取与接合模型的底面对应的第一接合面的数据 模型从第二部分模型的数据。 第一部分模型是包括在电路板中的焊盘的模型。 第二部分模型是包括在部件中的电极的模型。 电极通过接合材料与焊盘接合。 接合模型生成单元生成在第一接合面和第二接合面的轮廓之间建立连接的侧面，并且基于由侧面，第一接合面和第二接合面形成的形状获得接合模型的数据 第二结合面。
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公开(公告)号：US08378220B2
公开(公告)日：2013-02-19
申请号：US12887594
申请日：2010-09-22
申请人： Yoshiteru Ochi , Nobutaka Itoh , Makoto Sakairi
发明人： Yoshiteru Ochi , Nobutaka Itoh , Makoto Sakairi
CPC分类号： F16B39/01 , B21D53/20 , F16B5/0241 , Y10T29/49 , Y10T29/49863 , Y10T29/49865 , Y10T29/49869
摘要： An electronic device includes, a circuit board including a through hole, a member including a screw hole, a screw including a screw body having an outer diameter smaller than an inner diameter of the through hole and a screw head having an outer diameter larger than the inner diameter of the through hole, wherein the screw body penetrates through the through hole to engage with the screw hole and the screw head is disposed on an opposite side of the circuit board to the member, and a first washer provided between the screw head and the circuit board, the first washer including a first washer body and a plurality of first washer legs extending from the first washer body toward the circuit board, the first washer legs being in contact with the circuit board and having a characteristic of reducing stress on the circuit board upon being heated.
摘要翻译： 一种电子设备包括：电路板，包括通孔，包括螺孔的构件，包括外径小于通孔内径的螺钉本体的螺钉和外径大于通孔的螺钉头; 所述通孔的内径，其中所述螺丝体穿过所述通孔以与所述螺纹孔接合，并且所述螺钉头设置在所述电路板的与所述构件相对的一侧上，并且所述螺钉头设置在所述螺钉头和 所述电路板，所述第一垫圈包括第一垫圈体和从所述第一垫圈主体朝向所述电路板延伸的多个第一垫圈腿，所述第一垫圈腿与所述电路板接触，并且具有减小 电路板加热时。
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公开(公告)号：US20100289500A1
公开(公告)日：2010-11-18
申请号：US12769122
申请日：2010-04-28
申请人： Nobutaka Itoh , Makoto Sakairi , Mami Nakadate
发明人： Nobutaka Itoh , Makoto Sakairi , Mami Nakadate
CPC分类号： H01L23/49838 , H01L22/34 , H01L23/36 , H01L23/4006 , H01L23/49811 , H01L23/49816 , H01L2224/13 , H01L2924/14 , H01L2924/15311 , H01L2924/19043 , H05K1/0268 , H05K1/111 , H05K3/3436 , H05K2201/09663 , H05K2201/10734 , H05K2203/162 , Y02P70/611
摘要： A substrate includes a first plate member; a plurality of first electrodes provided on the major surface of the first plate member, the first electrodes including at least one electrode for circuit connection and at least one monitor electrode separate from the electrode for circuit connection; a second plate member; a plurality of second electrodes provided on the major surface of the second plate member; a plurality of solder members provided between the first electrodes and the second electrodes for electrical connection therebetween, repeatedly; and a detector for detecting an electrical disconnection between at least one of the monitor electrode and the second electrode.
摘要翻译： 基板包括第一板构件; 设置在所述第一板构件的主表面上的多个第一电极，所述第一电极包括用于电路连接的至少一个电极和与用于电路连接的电极分开的至少一个监视电极; 第二板构件; 设置在所述第二板构件的主表面上的多个第二电极; 设置在第一电极和第二电极之间的多个焊料，用于电连接; 以及检测器，用于检测所述监视电极和所述第二电极中的至少一个之间的断电。
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公开(公告)号：US08482291B2
公开(公告)日：2013-07-09
申请号：US12769122
申请日：2010-04-28
申请人： Nobutaka Itoh , Makoto Sakairi , Mami Nakadate
发明人： Nobutaka Itoh , Makoto Sakairi , Mami Nakadate
IPC分类号： G01R31/08
CPC分类号： H01L23/49838 , H01L22/34 , H01L23/36 , H01L23/4006 , H01L23/49811 , H01L23/49816 , H01L2224/13 , H01L2924/14 , H01L2924/15311 , H01L2924/19043 , H05K1/0268 , H05K1/111 , H05K3/3436 , H05K2201/09663 , H05K2201/10734 , H05K2203/162 , Y02P70/611
摘要： A substrate includes a first plate member; a plurality of first electrodes provided on the major surface of the first plate member, the first electrodes including at least one electrode for circuit connection and at least one monitor electrode separate from the electrode for circuit connection; a second plate member; a plurality of second electrodes provided on the major surface of the second plate member; a plurality of solder members provided between the first electrodes and the second electrodes for electrical connection therebetween, repeatedly; and a detector for detecting an electrical disconnection between at least one of the monitor electrode and the second electrode.
摘要翻译： 基板包括第一板构件; 设置在所述第一板构件的主表面上的多个第一电极，所述第一电极包括用于电路连接的至少一个电极和与用于电路连接的电极分开的至少一个监视电极; 第二板构件; 设置在所述第二板构件的主表面上的多个第二电极; 设置在第一电极和第二电极之间的多个焊料，用于电连接; 以及检测器，用于检测所述监视电极和所述第二电极中的至少一个之间的断电。
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10.发明授权Mesh number prediction method, analyzing apparatus and computer-readable storage medium 有权网格数预测方法，分析装置和计算机可读存储介质公开(公告)号：US09075943B2
公开(公告)日：2015-07-07
申请号：US13421085
申请日：2012-03-15
申请人： Sachiko Furuya , Makoto Sakairi , Akihiko Fujisaki
发明人： Sachiko Furuya , Makoto Sakairi , Akihiko Fujisaki
CPC分类号： G06F17/5018
摘要： A mesh number prediction method obtains a mesh length for a case in which a mesh having an arbitrary shape is created by approximating an entire analyzing target by a three-dimensional (3D) mesh model based on data of a 3D surface model of the analyzing target, obtains a mesh number of each part forming the analyzing target for a case in which a mesh having an arbitrary shape is created by approximating each part by a 3D mesh model based on the mesh length, and obtains a predicted total mesh number of the entire analyzing target from a ratio of volumes of the entire analyzing target and each part based on the mesh number.
摘要翻译： 网格数预测方法通过基于分析对象的3D表面模型的数据，通过三维（3D）网格模型逼近整个分析对象来获得具有任意形状的网格的情况的网格长度 通过基于网格长度的3D网格模型近似每个部分，获得形成具有任意形状的网格的情况下的每个部分的网格数，并且获得整个网格的预测总网格数 根据整个分析目标和每个部分的体积比，根据网格数目分析目标。
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