摘要:
A spatial frequency filter used in a pattern defect detection device, including a pattern which includes a black spot having a diameter expanded by a controlled amount in comparison with the diameter of a black spot on a photosensitive plate obtained by exposure by diffracted light from a pattern on a model specimen
摘要:
A spatial frequency filter used in a pattern defect detection device, including a pattern which includes a black spot having a diameter expanded by a controlled amount in comparison with the diameter of a black spot on a photosensitive plate obtained by exposure by diffracted light from a pattern on a model specimen.
摘要:
An inspection device for detecting defects in a periodic pattern on a semiconductor wafer includes a laser oscillator. In the exposure process, light emitted from the laser oscillator is divided into a subject beam and a reference beam. The subject beam is guided to a semiconductor wafer having a periodic pattern thereon by mirrors and a beam expander. The light scattered from the specimen is collected by a lens on a photographic plate. The reference beam is guided to the photographic plate via a second beam expander and another mirror. The intensity of the reference beam is adjusted to a level at which the reference beams interferes on the photographic plate with the light scattered from defects in the periodic pattern and collected by the lens. Thus, a hologram of the defects in the pattern is recorded on the photographic plate. After development, the photographic plate is returned to its original position and used to form a holographic image of the defects with a transmitted regeneration light beam.
摘要:
The alignment method allows a constant decision of an alignment point even with an indistinct outline of an alignment mark. An operator moves a chip (2) so that the whole or parts of an alignment mark (1) (including at least angles D0A0B0 and A0B0C0) is included within a lens view field (4), and then decides an alignment point (AP0). More specifically, the operator reads angles which are specified to obtain bisectors, from a defect inspection apparatus; obtains respective bisectors of the angles; and decides the intersection thereof to be the alignment point (AP0). Then, a stage drive required to superimpose the alignment point (AP0) on the center (O) is calculated on the basis of the shift amount between the position of the alignment point (AP0) and the center (O) of a target scope (5) displayed at the lens view field (4). The chip (2) is then moved by the stage drive.
摘要:
An ordinary user can easily learn a step at which a problem occurs during semiconductor manufacturing processes and improve the yield of manufacturing products and the quality of the products. At a certain in-line inspection step, a CPU (3) stores data signals (V1) taken by an inspection apparatus (1) into a memory (2), and reads a result (V6) obtained at a precedent step and stores the same in the memory (2). The CPU (3) reads stored data signals (V2) from the memory (2), performs comparison or referral on data about defects which are detected at a current step and the result (V6) regarding the precedent step, and generates a defect data analysis processing result signal (V5) regarding the current step. The result (V5) consists of disappeared defect data, common defect data, new defect data to which a label of a current step number is assigned, and reappeared defect data. The CPU (3) performs the processing above for each in-line inspection step, edits resultant data, and generates histogram data which provide the number of detected defects and the number of disappeared defects for each step.
摘要:
An object of the present invention is to provide an appearance inspection apparatus that can change the method of illumination, the shape of illumination light, and a spatial filter for the projection of an image of a sample dynamically during inspection, and also to provide a projection method for projecting the image of the sample. Illumination optics 12 and 13 and imaging optics 21 and 22 in the appearance inspection apparatus are respectively configured to form reflecting optical systems with mirror array devices 16 and 26 disposed at points conjugate to the pupil position 8 of an objective lens 3. The mirror array devices 16 and 26 are controlled in accordance with the field-of-view position of the objective lens 3 on the sample.
摘要:
A monitor wafer is processed by a processing apparatus, and thereafter, it is subjected to an inspection in a foreign object inspection apparatus in accordance with an inspection recipe. A measured result obtained by the inspection is compiled and analyzed in a data management system. Generally, a monitor wafer is not assigned a rot name or a wafer name, however, the measured result is assigned an identification name for identifying plural processing apparatuses from one another, and is stored in a database as storage data.
摘要:
An object of the present invention is to provide an appearance inspection apparatus that can change the method of illumination, the shape of illumination light, and a spatial filter for the projection of an image of a sample dynamically during inspection, and also to provide a projection method for projecting the image of the sample. Illumination optics 12 and 13 and imaging optics 21 and 22 in the appearance inspection apparatus are respectively configured to form reflecting optical systems with mirror array devices 16 and 26 disposed at points conjugate to the pupil position 8 of an objective lens 3. The mirror array devices 16 and 26 are controlled in accordance with the field-of-view position of the objective lens 3 on the sample.
摘要:
There are described a semiconductor inspection system for inspecting recessed defects formed in a semiconductor wafer and a semiconductor device manufacturing method including an inspection step of inspecting recessed defects formed in a semiconductor wafer. The semiconductor inspection system and the semiconductor device manufacturing method enable the following operations: an operation of radiating a laser beam onto a semiconductor wafer; an operation of detecting light scattered from foreign particles, as a result of a laser beam being radiated onto the semiconductor wafer; an operation of converting the detected scattered light into an electric signal; and an operation of outputting information about the recessed defects formed in the semiconductor wafer by means of subtracting the data pertaining to only the foreign particles located on the semiconductor wafer from the data pertaining to both the foreign particles and recessed defects formed in the semiconductor wafer.
摘要:
A defect inspection apparatus includes a first main controller for producing a reflectance distribution in a wafer surface to generate illumination light control data, based on the reflectance distribution, the illumination light control data being control data for adjusting the intensity of illumination light so that the intensity of reflected light from all locations in the wafer surface reaches an average intensity value, and a filter controller for inputting a filter control signal to a filter, based on the illumination light control data. The transmittance or reflectance of the filter for illumination light is controlled by the filter control signal. Consequently, the intensity of light reflected from a wafer to be inspected is controlled to provide uniformity in the wafer surface. Therefore, the defect inspection apparatus detects a defect occurring in the object to be inspected with high accuracy.