Inspection device for detecting defects in a periodic pattern on a
semiconductor wafer
    3.
    发明授权
    Inspection device for detecting defects in a periodic pattern on a semiconductor wafer 失效
    用于检测半导体晶片周期性图案中的缺陷的检查装置

    公开(公告)号:US5170063A

    公开(公告)日:1992-12-08

    申请号:US661140

    申请日:1991-02-27

    CPC分类号: G01N21/95623 G03H1/00

    摘要: An inspection device for detecting defects in a periodic pattern on a semiconductor wafer includes a laser oscillator. In the exposure process, light emitted from the laser oscillator is divided into a subject beam and a reference beam. The subject beam is guided to a semiconductor wafer having a periodic pattern thereon by mirrors and a beam expander. The light scattered from the specimen is collected by a lens on a photographic plate. The reference beam is guided to the photographic plate via a second beam expander and another mirror. The intensity of the reference beam is adjusted to a level at which the reference beams interferes on the photographic plate with the light scattered from defects in the periodic pattern and collected by the lens. Thus, a hologram of the defects in the pattern is recorded on the photographic plate. After development, the photographic plate is returned to its original position and used to form a holographic image of the defects with a transmitted regeneration light beam.

    摘要翻译: 用于检测半导体晶片周期性图案中的缺陷的检查装置包括激光振荡器。 在曝光过程中,从激光振荡器发射的光被分成目标光束和参考光束。 目标光束通过反射镜和光束扩展器被引导到其上具有周期性图案的半导体晶片。 从样本散射的光由照相板上的透镜收集。 参考光束通过第二光束扩展器和另一个反射镜被引导到照相板。 参考光束的强度被调整到参考光束干涉照相板的水平,其中光从周期性图案中的缺陷散射并由透镜收集。 因此,图案上的缺陷的全息图被记录在照相板上。 在显影之后,照相板返回其原始位置,并用于通过发射的再生光束形成缺陷的全息图像。

    Alignment method and semiconductor device
    4.
    发明授权
    Alignment method and semiconductor device 失效
    对准方法和半导体器件

    公开(公告)号:US06400038B2

    公开(公告)日:2002-06-04

    申请号:US09822178

    申请日:2001-04-02

    IPC分类号: H01L23544

    CPC分类号: H01L21/68

    摘要: The alignment method allows a constant decision of an alignment point even with an indistinct outline of an alignment mark. An operator moves a chip (2) so that the whole or parts of an alignment mark (1) (including at least angles D0A0B0 and A0B0C0) is included within a lens view field (4), and then decides an alignment point (AP0). More specifically, the operator reads angles which are specified to obtain bisectors, from a defect inspection apparatus; obtains respective bisectors of the angles; and decides the intersection thereof to be the alignment point (AP0). Then, a stage drive required to superimpose the alignment point (AP0) on the center (O) is calculated on the basis of the shift amount between the position of the alignment point (AP0) and the center (O) of a target scope (5) displayed at the lens view field (4). The chip (2) is then moved by the stage drive.

    摘要翻译: 对准方法允许对准点的恒定决定,即使对准标记的模糊轮廓也是如此。 操作者移动芯片(2),使得对准标记(1)(包括至少角度D0A0B0和A0B0C0)的整个或部分包括在透镜视野(4)内,然后确定对准点(AP0) 。 更具体地,操作者从缺陷检查装置读取被指定为获得平分线的角度; 获得角度的各自的平分线; 并确定其相交点为对准点(AP0)。 然后,基于对准点(AP0)的位置和目标范围的中心(O)之间的移动量来计算将对准点(AP0)叠加在中心(O)上所需的平台驱动 5)显示在镜头视野栏(4)。 芯片(2)然后被平台驱动器移动。

    Inspection data analyzing apparatus for in-line inspection with enhanced
display of inspection results
    5.
    发明授权
    Inspection data analyzing apparatus for in-line inspection with enhanced display of inspection results 失效
    检查数据分析仪器,用于在线检测,增强了检测结果的显示

    公开(公告)号:US6016562A

    公开(公告)日:2000-01-18

    申请号:US919166

    申请日:1997-08-28

    摘要: An ordinary user can easily learn a step at which a problem occurs during semiconductor manufacturing processes and improve the yield of manufacturing products and the quality of the products. At a certain in-line inspection step, a CPU (3) stores data signals (V1) taken by an inspection apparatus (1) into a memory (2), and reads a result (V6) obtained at a precedent step and stores the same in the memory (2). The CPU (3) reads stored data signals (V2) from the memory (2), performs comparison or referral on data about defects which are detected at a current step and the result (V6) regarding the precedent step, and generates a defect data analysis processing result signal (V5) regarding the current step. The result (V5) consists of disappeared defect data, common defect data, new defect data to which a label of a current step number is assigned, and reappeared defect data. The CPU (3) performs the processing above for each in-line inspection step, edits resultant data, and generates histogram data which provide the number of detected defects and the number of disappeared defects for each step.

    摘要翻译: 普通用户可以轻松地学习在半导体制造过程中发生问题的步骤,并提高制造产品的产量和产品的质量。 在某个在线检查步骤中,CPU(3)将由检查装置(1)取得的数据信号(V1)存储到存储器(2)中,并读取在先前步骤获得的结果(V6) 在内存中相同(2)。 CPU(3)从存储器(2)读取存储的数据信号(V2),对与当前步骤检测到的缺陷有关的数据和关于先前步骤的结果(V6)进行比较或推荐,生成缺陷数据 关于当前步骤的分析处理结果信号(V5)。 结果(V5)由消失的缺陷数据,公共缺陷数据,分配了当前步骤编号的标签的新缺陷数据和重新出现的缺陷数据组成。 CPU(3)对于每个在线检查步骤执行上述处理,编辑结果数据,并且生成提供检测到的缺陷数量和每个步骤的消失缺陷数量的直方图数据。

    Appearance inspection apparatus and projection method for projecting image of sample under inspection
    6.
    发明申请
    Appearance inspection apparatus and projection method for projecting image of sample under inspection 失效
    检测样品投影图像的外观检查装置和投影方法

    公开(公告)号:US20060007436A1

    公开(公告)日:2006-01-12

    申请号:US11177070

    申请日:2005-07-08

    IPC分类号: G01N21/88

    摘要: An object of the present invention is to provide an appearance inspection apparatus that can change the method of illumination, the shape of illumination light, and a spatial filter for the projection of an image of a sample dynamically during inspection, and also to provide a projection method for projecting the image of the sample. Illumination optics 12 and 13 and imaging optics 21 and 22 in the appearance inspection apparatus are respectively configured to form reflecting optical systems with mirror array devices 16 and 26 disposed at points conjugate to the pupil position 8 of an objective lens 3. The mirror array devices 16 and 26 are controlled in accordance with the field-of-view position of the objective lens 3 on the sample.

    摘要翻译: 本发明的目的是提供一种能够改变照明方法,照明光的形状和用于在检查期间动态地投影样品的图像的空间滤光器的外观检查装置,并且还提供投影 用于投影样本图像的方法。 外观检查装置中的照明光学系统12和13以及成像光学元件21和22分别被配置成形成具有设置在与物镜3的瞳孔位置8共轭的点的反射镜阵列器件16和26的反射光学系统。 根据物镜3在样本上的视场位置来控制反射镜阵列装置16和26。

    Inspection analyzing apparatus and semiconductor device

    公开(公告)号:US06551847B2

    公开(公告)日:2003-04-22

    申请号:US09955081

    申请日:2001-09-19

    IPC分类号: G01R3126

    CPC分类号: H01L22/20 G01R31/2831

    摘要: A monitor wafer is processed by a processing apparatus, and thereafter, it is subjected to an inspection in a foreign object inspection apparatus in accordance with an inspection recipe. A measured result obtained by the inspection is compiled and analyzed in a data management system. Generally, a monitor wafer is not assigned a rot name or a wafer name, however, the measured result is assigned an identification name for identifying plural processing apparatuses from one another, and is stored in a database as storage data.

    Appearance inspection apparatus and projection method for projecting image of sample under inspection
    8.
    发明授权
    Appearance inspection apparatus and projection method for projecting image of sample under inspection 失效
    检测样品投影图像的外观检查装置和投影方法

    公开(公告)号:US07330265B2

    公开(公告)日:2008-02-12

    申请号:US11177070

    申请日:2005-07-08

    IPC分类号: G01N21/55

    摘要: An object of the present invention is to provide an appearance inspection apparatus that can change the method of illumination, the shape of illumination light, and a spatial filter for the projection of an image of a sample dynamically during inspection, and also to provide a projection method for projecting the image of the sample. Illumination optics 12 and 13 and imaging optics 21 and 22 in the appearance inspection apparatus are respectively configured to form reflecting optical systems with mirror array devices 16 and 26 disposed at points conjugate to the pupil position 8 of an objective lens 3. The mirror array devices 16 and 26 are controlled in accordance with the field-of-view position of the objective lens 3 on the sample.

    摘要翻译: 本发明的目的是提供一种能够改变照明方法,照明光的形状和用于在检查期间动态地投影样品的图像的空间滤光器的外观检查装置,并且还提供投影 用于投影样本图像的方法。 外观检查装置中的照明光学系统12和13以及成像光学元件21和22分别被配置成形成具有设置在与物镜3的瞳孔位置8共轭的点的反射镜阵列器件16和26的反射光学系统。 根据物镜3在样本上的视场位置来控制反射镜阵列装置16和26。

    Semiconductor inspection system, and method of manufacturing a semiconductor device
    9.
    发明授权
    Semiconductor inspection system, and method of manufacturing a semiconductor device 失效
    半导体检查系统以及半导体装置的制造方法

    公开(公告)号:US06528334B1

    公开(公告)日:2003-03-04

    申请号:US09677846

    申请日:2000-10-03

    IPC分类号: H01L2166

    CPC分类号: G01N21/47 G01N21/9501

    摘要: There are described a semiconductor inspection system for inspecting recessed defects formed in a semiconductor wafer and a semiconductor device manufacturing method including an inspection step of inspecting recessed defects formed in a semiconductor wafer. The semiconductor inspection system and the semiconductor device manufacturing method enable the following operations: an operation of radiating a laser beam onto a semiconductor wafer; an operation of detecting light scattered from foreign particles, as a result of a laser beam being radiated onto the semiconductor wafer; an operation of converting the detected scattered light into an electric signal; and an operation of outputting information about the recessed defects formed in the semiconductor wafer by means of subtracting the data pertaining to only the foreign particles located on the semiconductor wafer from the data pertaining to both the foreign particles and recessed defects formed in the semiconductor wafer.

    摘要翻译: 描述了用于检查形成在半导体晶片中的凹陷缺陷的半导体检查系统和包括检查在半导体晶片中形成的凹陷缺陷的检查步骤的半导体器件制造方法。 半导体检查系统和半导体器件制造方法能够进行以下操作:将激光束照射到半导体晶片上的操作; 作为激光束照射到半导体晶片上的结果,检测从异物散射的光的操作; 将检测到的散射光转换成电信号的动作; 以及通过从与形成在半导体晶片中的异物和凹陷缺陷有关的数据中减去仅关于位于半导体晶片上的异物的数据,输出关于形成在半导体晶片中的凹陷缺陷的信息的操作。

    Defect inspection apparatus
    10.
    发明授权
    Defect inspection apparatus 失效
    缺陷检查装置

    公开(公告)号:US06437862B1

    公开(公告)日:2002-08-20

    申请号:US09457334

    申请日:1999-12-09

    IPC分类号: G01N2100

    CPC分类号: G01N21/9501

    摘要: A defect inspection apparatus includes a first main controller for producing a reflectance distribution in a wafer surface to generate illumination light control data, based on the reflectance distribution, the illumination light control data being control data for adjusting the intensity of illumination light so that the intensity of reflected light from all locations in the wafer surface reaches an average intensity value, and a filter controller for inputting a filter control signal to a filter, based on the illumination light control data. The transmittance or reflectance of the filter for illumination light is controlled by the filter control signal. Consequently, the intensity of light reflected from a wafer to be inspected is controlled to provide uniformity in the wafer surface. Therefore, the defect inspection apparatus detects a defect occurring in the object to be inspected with high accuracy.

    摘要翻译: 缺陷检查装置包括:第一主控制器,用于在晶片表面产生反射率分布,以基于反射率分布产生照明光控制数据;照明光控制数据是用于调节照明光强度的控制数据, 来自晶片表面中的所有位置的反射光达到平均强度值;以及滤波器控制器,用于基于照明光控制数据将滤波器控制信号输入到滤波器。 用于照明光的滤光器的透射率或反射率由滤光器控制信号控制。 因此,控制从被检查晶片反射的光的强度,以提供晶片表面的均匀性。 因此,缺陷检查装置高精度地检测出被检查对象物的缺陷。