摘要:
In a non-volatile semiconductor memory device and a fabrication method thereof, a charge storage layer is formed on a substrate. A control gate layer is formed on the charge storage layer. A gate mask having a spacer-shape is formed on the control gate layer. The charge storage layer and the control gate layer are removed using the gate mask as protection to form a control gate and a charge storage region.
摘要:
In a non-volatile semiconductor memory device and a fabrication method thereof, a charge storage layer is formed on a substrate. A control gate layer is formed on the charge storage layer. A gate mask having a spacer-shape is formed on the control gate layer. The charge storage layer and the control gate layer are removed using the gate mask as protection to form a control gate and a charge storage region.
摘要:
A method for performing an erase operation in a memory cell. A first voltage and a second voltage are applied to the source and drain regions, respectively, for a predetermined erase time; and the first and second voltages are switched with each other between the source and drain regions at least one time for the erase time. Thereby, hole is easily injected to the source and drain regions and a channel lateral surface, and a uniform and high-speed erase operation is archived.
摘要:
Disclosed is a method of planarizing a non-volatile memory device. After forming a floating gate structure on a cell area of a semiconductor substrate, a conductive layer, a hard mask layer and a first insulating layer are sequentially formed on the entire surface of the resultant structure. After removing the first insulating layer of the cell area to leave a first insulating layer pattern only on the peripheral circuit area, the hard mask layer of the cell area is removed. A second insulating layer is formed on the conductive layer and the insulating layer pattern to increase the height of the insulating layer on the peripheral circuit area. The second insulating layer and the first insulating layer pattern are removed until the floating gate structure is exposed, thereby planarizing the cell area and the peripheral circuit area. The conductive layer is patterned to form wordlines on both sidewalls of the floating gate structure and simultaneously, to form a gate of a logic device on the peripheral circuit area. When a CMP process for forming the wordline is carried out, the excessive polishing of the cell area adjacent to the peripheral circuit area can be prevented.
摘要:
Nonvolatile memory cells having a split gate structure and methods of fabricating the same are provided. The nonvolatile memory cells include active regions defined at a predetermined region of a semiconductor substrate. A portion of each of the active regions is etched to form a cell trench region. Insulated floating gates are disposed on a pair of sidewalls parallel with the direction that crosses the active region. A source region is disposed at a bottom surface of the cell trench region. A gap region between the floating gates is filled with a common source line electrically connected to the source region. The common source line is extended along the direction that crosses the active regions. The active regions, which are adjacent to the floating gates, are covered with word lines parallel with the common source line. Drain regions are disposed in the active regions adjacent to the word lines. The drain regions are electrically connected to bit lines that cross over the word lines.
摘要:
Nonvolatile memory cells having a split gate structure and methods of fabricating the same are provided. The nonvolatile memory cells include active regions defined at a predetermined region of a semiconductor substrate. A portion of each of the active regions is etched to form a cell trench region. Insulated floating gates are disposed on a pair of sidewalls parallel with the direction that crosses the active region. A source region is disposed at a bottom surface of the cell trench region. A gap region between the floating gates is filled with a common source line electrically connected to the source region. The common source line is extended along the direction that crosses the active regions. The active regions, which are adjacent to the floating gates, are covered with word lines parallel with the common source line. Drain regions are disposed in the active regions adjacent to the word lines. The drain regions are electrically connected to bit lines that cross over the word lines.
摘要:
Nonvolatile memory cells having a split gate structure and methods of fabricating the same are provided. The nonvolatile memory cells include active regions defined at a predetermined region of a semiconductor substrate. A portion of each of the active regions is etched to form a cell trench region. Insulated floating gates are disposed on a pair of sidewalls parallel with the direction that crosses the active region. A source region is disposed at a bottom surface of the cell trench region. A gap region between the floating gates is filled with a common source line electrically connected to the source region. The common source line is extended along the direction that crosses the active regions. The active regions, which are adjacent to the floating gates, are covered with word lines parallel with the common source line. Drain regions are disposed in the active regions adjacent to the word lines. The drain regions are electrically connected to bit lines that cross over the word lines.
摘要:
The present invention provides a method of forming a split gate type flash memory. After exposure of a floating gate layer between silicon nitride layers, a conductive layer spacer is formed on a sidewall of the silicon nitride layer pattern. The conductive layer spacer is formed in a floating gate of a later-completed flash memory to form a tip on which tunneling is centralized in an erase operation. That is, the spacer is formed on a sidewall of the silicon nitride layer pattern over the floating gate layer to form the tunneling tip.
摘要:
Nonvolatile memory cells having a split gate structure and methods of fabricating the same are provided. The nonvolatile memory cells include active regions defined at a predetermined region of a semiconductor substrate. A portion of each of the active regions is etched to form a cell trench region. Insulated floating gates are disposed on a pair of sidewalls parallel with the direction that crosses the active region. A source region is disposed at a bottom surface of the cell trench region. A gap region between the floating gates is filled with a common source line electrically connected to the source region. The common source line is extended along the direction that crosses the active regions. The active regions, which are adjacent to the floating gates, are covered with word lines parallel with the common source line. Drain regions are disposed in the active regions adjacent to the word lines. The drain regions are electrically connected to bit lines that cross over the word lines.
摘要:
Nonvolatile memory cells having a split gate structure and methods of fabricating the same are provided. The nonvolatile memory cells include active regions defined at a predetermined region of a semiconductor substrate. A portion of each of the active regions is etched to form a cell trench region. Insulated floating gates are disposed on a pair of sidewalls parallel with the direction that crosses the active region. A source region is disposed at a bottom surface of the cell trench region. A gap region between the floating gates is filled with a common source line electrically connected to the source region. The common source line is extended along the direction that crosses the active regions. The active regions, which are adjacent to the floating gates, are covered with word lines parallel with the common source line. Drain regions are disposed in the active regions adjacent to the word lines. The drain regions are electrically connected to bit lines that cross over the word lines.