公开(公告)号：US20110090738A1

公开(公告)日：2011-04-21

申请号：US12977419

申请日：2010-12-23

申请人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

发明人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

IPC分类号： G11C16/12

CPC分类号： G11C16/0483 ,  G11C16/107 ,  G11C16/12 ,  G11C16/3445

摘要： A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith.

摘要翻译： NAND闪速存储器件包括控制电路，其被配置为在编程操作期间将第一字线电压施加到多个串联存储器单元中的未选择的电压，第二字线电压大于第一字线电压 到多个存储单元中的一个选择的一个，以及比第一字线电压低的第三字线电压到与多个存储单元串联连接的虚拟存储单元。 在其他实施例中，控制电路被配置为在与每个擦除操作之间的每个擦除操作之前和/或之后对与其串联的多个存储器单元进行编程。 在其他实施例中，控制电路被配置为在擦除与其串联连接的多个存储器单元时，放弃擦除伪存储器单元。

公开(公告)号：US07480178B2

公开(公告)日：2009-01-20

申请号：US11279607

申请日：2006-04-13

申请人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

发明人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

IPC分类号： G11C16/06

CPC分类号： G11C16/0483 ,  G11C16/107 ,  G11C16/12 ,  G11C16/3445

摘要： A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith.

摘要翻译： NAND闪速存储器件包括控制电路，其被配置为在编程操作期间将第一字线电压施加到多个串联存储器单元中的未选择的电压，第二字线电压大于第一字线电压 到多个存储单元中的一个选择的一个，以及比第一字线电压低的第三字线电压到与多个存储单元串联连接的虚拟存储单元。 在其他实施例中，控制电路被配置为在与每个擦除操作之间的每个擦除操作之前和/或之后对与其串联的多个存储器单元进行编程。 在其他实施例中，控制电路被配置为在擦除与其串联连接的多个存储器单元时，放弃擦除伪存储器单元。

公开(公告)号：US07881114B2

公开(公告)日：2011-02-01

申请号：US12340250

申请日：2008-12-19

申请人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

发明人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

IPC分类号： G11C16/04 ,  G11C16/06 ,  G11C16/10

CPC分类号： G11C16/0483 ,  G11C16/107 ,  G11C16/12 ,  G11C16/3445

摘要： A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith.

摘要翻译： NAND闪速存储器件包括控制电路，其被配置为在编程操作期间将第一字线电压施加到多个串联存储器单元中的未选择的电压，第二字线电压大于第一字线电压 到多个存储单元中的一个选择的一个，以及比第一字线电压低的第三字线电压到与多个存储单元串联连接的虚拟存储单元。 在其他实施例中，控制电路被配置为在与每个擦除操作之间的每个擦除操作之前和/或之后对与其串联的多个存储器单元进行编程。 在其他实施例中，控制电路被配置为在擦除与其串联连接的多个存储器单元时，放弃擦除伪存储器单元。

公开(公告)号：US08228738B2

公开(公告)日：2012-07-24

申请号：US12977419

申请日：2010-12-23

申请人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

发明人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

IPC分类号： G11C16/04 ,  G11C16/06 ,  G11C16/10

CPC分类号： G11C16/0483 ,  G11C16/107 ,  G11C16/12 ,  G11C16/3445

摘要： A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith.

摘要翻译： NAND闪速存储器件包括控制电路，其被配置为在编程操作期间将第一字线电压施加到多个串联存储器单元中的未选择的电压，第二字线电压大于第一字线电压 到多个存储单元中的一个选择的一个，以及比第一字线电压低的第三字线电压到与多个存储单元串联连接的虚拟存储单元。 在其他实施例中，控制电路被配置为在与每个擦除操作之间的每个擦除操作之前和/或之后对与其串联的多个存储器单元进行编程。 在其他实施例中，控制电路被配置为在擦除与其串联连接的多个存储器单元时，放弃擦除伪存储器单元。

公开(公告)号：US20090097326A1

公开(公告)日：2009-04-16

申请号：US12340250

申请日：2008-12-19

申请人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

发明人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

IPC分类号： G11C16/06

CPC分类号： G11C16/0483 ,  G11C16/107 ,  G11C16/12 ,  G11C16/3445

摘要： A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith.

摘要翻译： NAND闪速存储器件包括控制电路，其被配置为在编程操作期间将第一字线电压施加到多个串联存储器单元中的未选择的电压，第二字线电压大于第一字线电压 到多个存储单元中的一个选择的一个，以及比第一字线电压低的第三字线电压到与多个存储单元串联连接的虚拟存储单元。 在其他实施例中，控制电路被配置为在与每个擦除操作之间的每个擦除操作之前和/或之后对与其串联的多个存储器单元进行编程。 在其他实施例中，控制电路被配置为在擦除与其串联连接的多个存储器单元时，放弃擦除伪存储器单元。

公开(公告)号：US20060208302A1

公开(公告)日：2006-09-21

申请号：US11354535

申请日：2006-02-15

申请人： Yoo-Cheol Shin ,  Jung-Dal Choi ,  Ki-Tae Park ,  Jong-Sun Sel

发明人： Yoo-Cheol Shin ,  Jung-Dal Choi ,  Ki-Tae Park ,  Jong-Sun Sel

IPC分类号： H01L29/76

CPC分类号： H01L29/66833 ,  H01L29/792

摘要： A non-volatile memory device having a charge trap layer and a method of fabricating the same are provided. The non-volatile memory device includes a semiconductor substrate having an active region and a field region in contact with the active region. A trench isolation layer is formed within the semiconductor substrate field region to define the active region and has a protrusion higher than a top surface of the semiconductor substrate active region. A memory storage pattern is formed which crosses and extends from the semiconductor substrate active region to cover sidewalls of the protrusion of the trench isolation layer. A gate electrode is formed on the memory storage pattern and extends upward from the trench isolation layer.

摘要翻译： 提供了具有电荷陷阱层的非易失性存储器件及其制造方法。 非易失性存储器件包括具有有源区和与有源区接触的场区的半导体衬底。 沟槽隔离层形成在半导体衬底场区内，以限定有源区，并具有高于半导体衬底有源区的顶表面的突起。 形成存储器存储图案，其跨越并从半导体衬底有源区域延伸以覆盖沟槽隔离层的突起的侧壁。 栅电极形成在存储器存储图案上并从沟槽隔离层向上延伸。

公开(公告)号：US20060239077A1

公开(公告)日：2006-10-26

申请号：US11279607

申请日：2006-04-13

申请人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

发明人： Ki-Tae Park ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Yoo-Cheol Shin

IPC分类号： G11C16/04 ,  G11C11/34

CPC分类号： G11C16/0483 ,  G11C16/107 ,  G11C16/12 ,  G11C16/3445

摘要： A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith.

摘要翻译： NAND闪速存储器件包括控制电路，其被配置为在编程操作期间将第一字线电压施加到多个串联存储器单元中的未选择的电压，第二字线电压大于第一字线电压 到多个存储单元中的一个选择的一个，以及比第一字线电压低的第三字线电压到与多个存储单元串联连接的虚拟存储单元。 在其他实施例中，控制电路被配置为在与每个擦除操作之间的每个擦除操作之前和/或之后对与其串联的多个存储器单元进行编程。 在其他实施例中，控制电路被配置为在擦除与其串联连接的多个存储器单元时，放弃擦除伪存储器单元。

公开(公告)号：US07863686B2

公开(公告)日：2011-01-04

申请号：US12536740

申请日：2009-08-06

申请人： Chang-Hyun Lee ,  Jung-Dal Choi ,  Chang-Seok Kang ,  Yoo-Cheol Shin ,  Jong-Sun Sel

发明人： Chang-Hyun Lee ,  Jung-Dal Choi ,  Chang-Seok Kang ,  Yoo-Cheol Shin ,  Jong-Sun Sel

IPC分类号： H01L29/66

CPC分类号： H01L27/115 ,  H01L27/11521

摘要： A nonvolatile memory device includes a semiconductor substrate and a device isolation layer on the semiconductor substrate. A fin-shaped active region is formed between portions of the device isolation layer. A sidewall protection layer is formed on the sidewall of the fin-shaped active region where source and drain regions are formed. Thus, it may be possible to reduce the likelihood of an undesirable connection between an interconnection layer connected to the source and drain regions and a lower sidewall of the active region so that charge leakage from the interconnection layer to a substrate can be prevented or reduced. The sidewall protection layer may be formed using the device isolation layer. Alternatively, an insulating layer having an etch selectivity with respect to an interlayer insulating layer may be formed on the device isolation layer so as to cover the sidewall of the active region.

摘要翻译： 非易失性存储器件包括半导体衬底和半导体衬底上的器件隔离层。 翅片形有源区形成在器件隔离层的各部分之间。 侧壁保护层形成在形成源区和漏区的鳍状有源区的侧壁上。 因此，可以降低连接到源极和漏极区域的互连层和有源区域的下侧壁之间的不期望的连接的可能性，从而可以防止或减少从互连层到衬底的电荷泄漏。 侧壁保护层可以使用器件隔离层形成。 或者，可以在器件隔离层上形成具有相对于层间绝缘层的蚀刻选择性的绝缘层，以覆盖有源区的侧壁。

公开(公告)号：US20100301425A1

公开(公告)日：2010-12-02

申请号：US12856295

申请日：2010-08-13

申请人： Chang-Seok Kang ,  Yoo-Cheol Shin ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Ju-Hyung Kim ,  Sang-Hun Jeon

发明人： Chang-Seok Kang ,  Yoo-Cheol Shin ,  Jung-Dal Choi ,  Jong-Sun Sel ,  Ju-Hyung Kim ,  Sang-Hun Jeon

IPC分类号： H01L27/088 ,  H01L29/78

CPC分类号： H01L27/11521 ,  H01L21/823462 ,  H01L21/823475 ,  H01L27/115 ,  H01L27/11524 ,  H01L29/7883

摘要： A semiconductor device has a gate contact structure, including a semiconductor substrate, a polycrystalline silicon layer used as a gate electrode of a transistor, a middle conductive layer, a top metal layer having an opening exposing the polycrystalline silicon layer, and a contact plug directly contacting the polycrystalline silicon layer through the opening.

摘要翻译： 半导体器件具有栅极接触结构，包括半导体衬底，用作晶体管的栅电极的多晶硅层，中间导电层，具有暴露多晶硅层的开口的顶部金属层和直接接触的接触插塞 使多晶硅层通过开口接触。

公开(公告)号：US20090294837A1

公开(公告)日：2009-12-03

申请号：US12536740

申请日：2009-08-06

申请人： Chang-Hyun Lee ,  Jung-Dal Choi ,  Chang-Seok Kang ,  Yoo-Cheol Shin ,  Jong-Sun Sel

发明人： Chang-Hyun Lee ,  Jung-Dal Choi ,  Chang-Seok Kang ,  Yoo-Cheol Shin ,  Jong-Sun Sel

IPC分类号： H01L29/792 ,  H01L29/78

CPC分类号： H01L27/115 ,  H01L27/11521

摘要： A nonvolatile memory device includes a semiconductor substrate and a device isolation layer on the semiconductor substrate. A fin-shaped active region is formed between portions of the device isolation layer. A sidewall protection layer is formed on the sidewall of the fin-shaped active region where source and drain regions are formed. Thus, it may be possible to reduce the likelihood of an undesirable connection between an interconnection layer connected to the source and drain regions and a lower sidewall of the active region so that charge leakage from the interconnection layer to a substrate can be prevented or reduced. The sidewall protection layer may be formed using the device isolation layer. Alternatively, an insulating layer having an etch selectivity with respect to an interlayer insulating layer may be formed on the device isolation layer so as to cover the sidewall of the active region.

摘要翻译： 非易失性存储器件包括半导体衬底和半导体衬底上的器件隔离层。 翅片形有源区形成在器件隔离层的各部分之间。 侧壁保护层形成在形成源区和漏区的鳍状有源区的侧壁上。 因此，可以降低连接到源极和漏极区域的互连层和有源区域的下侧壁之间的不期望的连接的可能性，从而可以防止或减少从互连层到衬底的电荷泄漏。 侧壁保护层可以使用器件隔离层形成。 或者，可以在器件隔离层上形成具有相对于层间绝缘层的蚀刻选择性的绝缘层，以覆盖有源区的侧壁。