CIRCUIT BOARD MODULE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    CIRCUIT BOARD MODULE AND METHOD OF MANUFACTURING THE SAME 有权
    电路板模块及其制造方法

    公开(公告)号:US20100252305A1

    公开(公告)日:2010-10-07

    申请号:US12550812

    申请日:2009-08-31

    IPC分类号: H05K1/00 B32B37/00 B32B38/00

    摘要: There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions.The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased.Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.

    摘要翻译: 提供了一种电路板模块及其制造方法。 电路板模块可以包括:电路板; 布置在电路板上的电阻器; 覆盖电阻器两端的焊盘; 粘合剂部分至少设置在焊盘上并由电绝缘材料形成; 以及散热构件,其设置在所述电阻器上并且使用所述粘合部分结合到所述焊盘。 选择性地形成粘合剂部分,从而防止在安装到电路板上的电阻器和散热构件之间发生短路。 因此,可以提高部件的可靠性。 此外,用于连接板和散热构件的粘合材料由导热材料形成,从而提高散热效率。