摘要:
The image reading device of the present invention includes (i) a sensor substrate which functions as a photoelectric transfer element having a photodetecting TFT and a pixel capacitor and (ii) a driving IC for applying a voltage to a gate electrode of the photodetecting TFT so as to drive the photodetecting TFT into an ON state or an OFF state. The driving IC applies a voltage, whose polarity is opposite to average polarity of a voltage making the photodetecting TFT in the OFF state, to the gate electrode of the photodetecting TFT in an arbitrary period. Thus, it is possible to provide the image reading device which can suppress variation of a photodetecting TFT property (resistance value) which is observed in a short time.
摘要:
The image reading device of the present invention includes (i) a sensor substrate which functions as a photoelectric transfer element having a photodetecting TFT and a pixel capacitor and (ii) a driving IC for applying a voltage to a gate electrode of the photodetecting TFT so as to drive the photodetecting TFT into an ON state or an OFF state. The driving IC applies a voltage, whose polarity is opposite to average polarity of a voltage making the photodetecting TFT in the OFF state, to the gate electrode of the photodetecting TFT in an arbitrary period. Thus, it is possible to provide the image reading device which can suppress variation of a photodetecting TFT property (resistance value) which is observed in a short time.
摘要:
In a two-dimensional image detector in accordance with the present invention, an active matrix substrate includes: a gate insulating film provided on gate electrodes and storage capacitance electrodes (Cs electrodes) provided in turn on a glass substrate; a first insulating protection layer and a second insulating protection layer sequentially provided on the gate insulating film; and pixel electrodes provided on the second insulating protection layer in a matrix. The second insulating protection layer is made of an acrylic resin, and its edges are completely covered with the photoconductor film.
摘要:
A composite active-matrix substrate includes: a plurality of active-matrix substrates which are disposed adjacent to one another; a base substrate which is disposed to oppose a bottom surface of the active-matrix substrates; a sealant which is disposed in the form of a frame between the active-matrix substrate and the base substrate; a first filler which fills a spacing surrounded by the active-matrix substrate, the base substrate, and the sealant; and a second filler which fills a gap between edges of the active-matrix substrates. The sealant prevents the first filler from seeping out. In this way, seeping of an adhesive filler can be prevented in the arrangement where a plurality of active-matrix substrates are fixed on the base substrate using the adhesive filler. An electromagnetic wave capturing device according to the present invention uses such a composite active-matrix substrate.
摘要:
An uneven pattern detector has a structure wherein (a) detecting elements, each being provided with a TFT which is a switching element and a detecting electrode, are arranged in a matrix manner, and (b) a CSA connected to each data line detects charged or discharged electric charges at the respective detecting elements on respective rows sequentially selected by a gate line, whereby a capacitance (a coupled capacitance of Cf and Cx) reflecting fingerprint unevenness on a finger as a detection object can be detected. In the uneven pattern detector, each of the detecting elements is provided with an auxiliary capacitor electrode located so as to face the detecting electrode. This forms an auxiliary capacitor Cs between the auxiliary capacitor electrode and the detecting electrode. Further, a positive-phase input terminal of an operational amplifier of the CSA is connected with the auxiliary capacitor electrode so as to hold the positive-phase input terminal of the operational amplifier of the CSA and the auxiliary capacitor electrode at an identical potential. As a result, the electric charges can be detected by the CSA without being affected by the auxiliary capacitor Cs.
摘要:
When TCP substrates serving as external circuits are packaged by thermocompression bonding onto input/output terminals on an active-matrix substrate including an a-Se film serving as an amorphous semiconductor layer, a cooling operation is performed by a cooling medium discharging nozzle on at least a part between the a-Se film and a thermocompression bonding part disposed between the TCP substrates and the input/output terminals on the active-matrix substrate. Thus, during the thermocompression bonding, a temperature of the a-Se film is maintained below its crystallizing temperature so as to prevent exfoliation of the amorphous semiconductor film and deterioration in characteristics thereof, upon packaging the external circuits by thermocompression bonding onto the input/output terminals on the substrate including the amorphous semiconductor film.
摘要:
A TFT array is formed on a glass substrate (step P1). A surface protection layer is formed on the glass substrate so as to cover the TFT array (step P2). The glass substrate is divided to form active matrix substrates with the surface protection layer being provided (step P3). The divided active matrix substrate is chamfered along its edges (step P4). The surface protection layer is removed from the active matrix substrate (step P5). An X-ray conductive layer is formed on the TFT array where the surface protection layer has been removed (step P6). By these steps, pollutants produced during the division and chamfering of the glass substrate are prevented from polluting the TFT array and the X-ray conductive layer, and the active element array and the semiconductor layer is prevented from deteriorating in terms of performance in manufacturing process for a two-dimensional image detector.
摘要:
An active matrix substrate provided with a matrix of electrode wires, a plurality of thin film transistors (TFTs) individually formed at intersections of the matrix, and pixel electrodes connected to the electrode wires through the thin film transistors (TFTs) is laminated to a counter substrate provided with connecting electrodes by means of an anisotropic conductive bonding agent. The counter substrate is composed of 12 divided pieces which are tiled as panes.
摘要:
What are formed on an insulating substrate are gate electrodes and data electrodes provided in a grid pattern, a TFT provided in each grid and connected to the gate electrode and the data electrode, an interlayer insulating film formed on the TFT and including a contact hole penetrating the film itself, and a sense electrode provided on the interlayer insulating film and passing through the contact hole. On the interlayer insulating film, an upper layer insulating film is formed so as to cover the sense electrode. A surface of the interlayer insulating film in which surface the sense electrode is formed is flat. On this account, it is possible to provide an uneven pattern sensing device capable of smoothing out a surface thereof without any increase of the manufacturing process and limitation of a choice of materials for a protective film.
摘要:
In a two-dimensional image detecting device, an active-matrix substrate and an opposing substrate are bonded to each other via conductive connecting members and space keeping members, that are disposed respectively for pixels, such that pixel electrodes and electrical charge collecting electrodes oppose each other. The pixel electrodes are formed on the active-matrix substrate, and the electrical charge collecting electrodes are formed on the opposing substrate. Further, when a resin material of the space keeping members is soft, reinforcing members, which have electrical insulation and are hardly deformed in a thermocompression bonding, are dispersed into the resin material, so that the space keeping ability is fully exhibited. According to this arrangement, it is possible to improve the responsivity so as to respond to a moving image. Additionally, an even space can be achieved between the substrates, and it is possible to prevent a connecting defect and a defect caused by a leak between the substrates.