摘要:
A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.
摘要:
A novel benzimidazole derivative is disclosed. The benzimidazole derivative is represented by the following formula (I), ##STR1## wherein R.sup.1 is a hydrogen atom, a lower alkyl group, or a halogen atom; R.sup.2 is a hydrogen atom or a lower alkyl group; R.sup.3 is an alkylene group with 1 to 18 carbon atoms; and n and m are integers from 0 to 3. The compound has an excellent rust preventing effect and can be used as a component of a composition for the treatment of surfaces of copper and copper alloys comprising the benzimidazole derivative which is particularly useful in preventing rust in printed-wiring boards.
摘要:
A novel benzimidazole derivative is disclosed. The benzimidazole derivative is represented by the following formula (I), ##STR1## wherein R.sup.1 is a hydrogen atom, a lower alkyl group, or a halogen atom; R.sup.2 is a hydrogen atom or a lower alkyl group; R.sup.3 is an alkylene group with 1 to 18 carbon atoms; and n and m are integers from 0 to 3. The compound has an excellent rust preventing effect and can be used as a component of a composition for the treatment of surfaces of copper and copper alloys comprising the benzimidazole derivative which is particularly useful in preventing rust in printed-wiring boards.