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10 条记录 (耗时 0.032 秒)

    Method for surface treatment of copper or copper alloys
    4.
    发明授权
    Method for surface treatment of copper or copper alloys 失效
    铜或铜合金表面处理方法

    公开(公告)号：US6106899A

    公开(公告)日：2000-08-22

    申请号：US116339

    申请日：1998-07-16

    申请人： Toshiko Nakagawa ,  Ryo Ogushi

    发明人： Toshiko Nakagawa ,  Ryo Ogushi

    IPC分类号： B32B15/08 ,  C23C22/52 ,  C23F11/00 ,  C23F11/14 ,  H05K3/38 ,  B05D3/00

    CPC分类号： C23F11/149 ,  H05K3/389

    摘要： A method for bonding a resin which has a high glass transition temperature but low affinity to copper surfaces with a copper surface with sufficient adhesive strength. The method comprises coating the copper surfaces with an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative, or an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative and at least 0.1% of aminotriazole or an aminotriazole derivative.

    摘要翻译： 一种具有高的玻璃化转变温度但对铜表面的亲和力低的树脂与铜表面具有足够的粘合强度的方法。 该方法包括用含有至少0.05％的氨基四唑或氨基四唑衍生物的水溶液或含有至少0.05％的氨基四唑或氨基四唑衍生物和至少0.1％的氨基三唑或氨基三唑衍生物的水溶液包被铜表面。

    Composition for microetching copper or copper alloy
    6.
    发明授权
    Composition for microetching copper or copper alloy 失效
    用于铜或铜合金微蚀刻的组成

    公开(公告)号：US5885476A

    公开(公告)日：1999-03-23

    申请号：US811531

    申请日：1997-03-04

    申请人： Yoong-koo Hong ,  Toshiko Nakagawa

    发明人： Yoong-koo Hong ,  Toshiko Nakagawa

    IPC分类号： C23F1/18 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46 ,  C09K13/04 ,  C09K13/08

    CPC分类号： C23F1/18 ,  H05K3/383 ,  H05K2203/125 ,  H05K3/064 ,  H05K3/28 ,  H05K3/4611

    摘要： A microetching composition for copper or copper alloys comprising, (a) nitric acid or sulfuric acid, or both, (b) ferric nitrate or ferric sulfate, or both, (c) at least one component selected from a group consisting of unsaturated carboxylic acids, salts of unsaturated carboxylic acid, and anhydrides of unsaturated carboxylic acid, and (d) water. The composition can produce a copper or copper alloy surface exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition is suitable for the manufacture of printed wiring boards with highly integrated fine line patterns.

    摘要翻译： 一种用于铜或铜合金的微蚀刻组合物，其包含（a）硝酸或硫酸或两者，（b）硝酸铁或硫酸铁，或两者，（c）至少一种选自不饱和羧酸 ，不饱和羧酸的盐和不饱和羧酸的酸酐，和（d）水。 该组合物可以产生对诸如预浸料和抗蚀剂的树脂具有优异粘附性和优异的可焊性的铜或铜合金表面。 该组合物适用于制造具有高度集成的细线图案的印刷线路板。

    Etching solution for copper or copper alloy
    8.
    发明授权
    Etching solution for copper or copper alloy 失效
    铜或铜合金蚀刻溶液

    公开(公告)号：US5700389A

    公开(公告)日：1997-12-23

    申请号：US510299

    申请日：1995-08-02

    申请人： Toshiko Nakagawa

    发明人： Toshiko Nakagawa

    IPC分类号： C23F1/18 ,  C23G1/10 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38 ,  C23F3/00 ,  C23F1/00

    CPC分类号： C23G1/103 ,  C23F1/18 ,  H05K3/383 ,  H05K2203/0796 ,  H05K2203/124 ,  H05K3/064 ,  H05K3/28

    摘要： An etching solution for copper or copper alloys comprising, (a) sulfuric acid, (b) a persulfate, (c) at least one compound selected from imidazole, imidazole derivatives, pyridine derivatives, triazine, and triazine derivatives, and (d) water. The etching solution exhibits a high etching speed and does not oxidize the copper surfaces after etching.

    摘要翻译： 一种用于铜或铜合金的蚀刻溶液，其包含（a）硫酸，（b）过硫酸盐，（c）至少一种选自咪唑，咪唑衍生物，吡啶衍生物，三嗪和三嗪衍生物的化合物，和（d）水 。 蚀刻溶液表现出高蚀刻速度，并且在蚀刻后不会氧化铜表面。

    Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
    9.
    发明授权
    Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby 有权
    接合层形成溶液，使用该溶液的铜 - 树脂粘合层的制造方法以及由此得到的层叠体

    公开(公告)号：US07156904B2

    公开(公告)日：2007-01-02

    申请号：US10826091

    申请日：2004-04-16

    申请人： Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Jun Hisada ,  Naomi Kanda ,  Toshiko Nakagawa

    发明人： Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Jun Hisada ,  Naomi Kanda ,  Toshiko Nakagawa

    IPC分类号： C23C18/31 ,  C23C18/34 ,  C23C18/48 ,  C23C30/00

    CPC分类号： C23C18/48 ,  C23C18/31 ,  H01L2924/0002 ,  H05K3/384 ,  H05K2203/072 ,  Y10T428/31681 ,  H01L2924/00

    摘要： An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper. Subsequently, a portion of the alloy layer is removed, so that a bonding layer containing an alloy of diffused copper, tin, and the at least one type of metal selected in (c) is formed on a surface of copper which enhances the adhesion between copper and resin. The present invention provides the solution, a method of producing the bonding layer, and a product obtained thereby.

    摘要翻译： 一种铜 - 树脂粘合层水溶液，包括：（a）至少一种酸型; （b）锡盐或氧化锡; （c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属的盐或氧化物; （d）反应促进剂; 和（e）扩散保持溶剂，使得在铜的表面上形成锡的合金层和（c）中选择的至少一种类型的金属。 随后，去除合金层的一部分，使得在铜的表面上形成包含扩散的铜，锡和（c）中选择的至少一种类型的金属的合金的粘合层，这增强了 铜和树脂。 本发明提供了溶液，粘合层的制造方法和由此获得的产物。