公开(公告)号：US20070045351A1

公开(公告)日：2007-03-01

申请号：US11328287

申请日：2006-01-10

申请人： Yoshiyuki Seike ,  Shigeru Taniguchi ,  Masanori Kojima ,  Kentaro Otani ,  Keiji Miyachi ,  Masahiko Amari

发明人： Yoshiyuki Seike ,  Shigeru Taniguchi ,  Masanori Kojima ,  Kentaro Otani ,  Keiji Miyachi ,  Masahiko Amari

IPC分类号： B67D5/40 ,  B05C5/00

CPC分类号： B05B9/0413 ,  B05B15/40 ,  B24B57/02 ,  F04B53/16 ,  F04B53/162 ,  F05C2203/08 ,  F05C2203/0895 ,  F05C2225/12

摘要： To provide a liquid feed pump, a filter housing, a valve and a spray nozzle and a spray apparatus incorporating these components that can suppress contamination of the liquid being fed. A liquid feed pump 10 includes: a cylinder 12 having a substantially cylindrical shape; and a piston 14 fitted into the cylinder. The liquid feed pressure of the liquid feed pump 10 is equal to or higher than 1 MPa and equal to or lower than 50 MPa, and substantially the whole surface of a liquid contacting part of the liquid feed pump is made of a resin material or a ceramic material.

摘要翻译： 提供液体供给泵，过滤器壳体，阀和喷嘴以及包含这些部件的喷射装置，其可以抑制被供给的液体的污染。 液体供给泵10包括：具有大致圆筒形状的圆筒12; 以及装配到气缸中的活塞14。 液体供给泵10的液体供给压力等于或大于1MPa并且等于或低于50MPa，并且液体供给泵的液体接触部分的整个表面的大致整个表面由树脂材料或 陶瓷材料。

公开(公告)号：US20050164613A1

公开(公告)日：2005-07-28

申请号：US10979212

申请日：2004-11-03

申请人： Yoshiyuki Seike ,  Keiji Miyachi ,  Masahiko Amari ,  Ara Philipossian ,  Toshiro Doi

发明人： Yoshiyuki Seike ,  Keiji Miyachi ,  Masahiko Amari ,  Ara Philipossian ,  Toshiro Doi

IPC分类号： B24B53/007 ,  B24B53/017 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B53/017

摘要： Dressing is performed by spraying a cleaning liquid onto a polishing pad and after that abrasive slurry injected from a nozzle is supplied to the polishing pad. Provided is a method of conditioning a polishing pad for semiconductor wafer which is suitable for keeping the polishing performance of a polishing pad, provided with a polishing device for semiconductor wafer, in a stable condition for a long time.

摘要翻译： 通过将清洁液喷射到抛光垫上，之后将从喷嘴注入的研磨浆料供应到抛光垫来进行敷料。 本发明提供一种调节用于半导体晶片的抛光垫的方法，该方法适用于将设置有半导体晶片抛光装置的抛光垫的抛光性能长时间保持在稳定状态。

公开(公告)号：US07686022B2

公开(公告)日：2010-03-30

申请号：US11682944

申请日：2007-03-07

申请人： Yoshiyuki Seike ,  Keiji Miyachi

发明人： Yoshiyuki Seike ,  Keiji Miyachi

IPC分类号： B08B3/00

CPC分类号： B05B3/105 ,  B05B3/1092 ,  H01L21/67051

摘要： The present invention provides a nozzle device comprising a substantially cylindrical nozzle body and a cup member which is arranged within the cylinder of the nozzle body and jets out fluid droplets from the tip thereof while being driven to turn, wherein two or more fluids including a detergent and a gas are mixed and jetted out of the tip of the nozzle in order to achieve sufficient cleaning of a single wafer without a re-adhesion of contamination or destruction of the pattern of the wafer. Therefore, the fluid droplets can be controlled to a smaller size than the conventional double-fluid cleaning system or high pressure jet system.

摘要翻译： 本发明提供了一种喷嘴装置，其包括基本上为圆柱形的喷嘴体和杯形部件，其布置在喷嘴体的圆筒内，并且在被驱动转动时从其尖端射出流体液滴，其中两个或更多个流体包括洗涤剂 并且将气体混合并喷射出喷嘴的尖端，以便实现对单个晶片的充分清洁，而不会再次粘附污染或破坏晶片的图案。 因此，流体液滴可以被控制到比传统的双流体清洁系统或高压喷射系统更小的尺寸。