公开(公告)号：US5636105A

公开(公告)日：1997-06-03

申请号：US503488

申请日：1995-07-18

申请人： Youji Inomata ,  Yasunobu Ikeda ,  Michiyoshi Kudoh ,  Kanta Judai

发明人： Youji Inomata ,  Yasunobu Ikeda ,  Michiyoshi Kudoh ,  Kanta Judai

IPC分类号： H05K9/00 ,  H04B1/38 ,  H04M1/02 ,  H04W88/02 ,  H05K5/00 ,  H05K7/14

CPC分类号： H05K5/0013 ,  H05K7/142 ,  H04B1/3833

摘要： There is disclosed an electronic equipment device. A pair of first and second printed boards are superposed with an electrically-conductive shield frame interposed therebetween in such a manner that those faces of the two printed boards having associated electronic parts mounted thereon are faced to each other. The shield frame has an integral peripheral wall extending over an entire peripheral edge thereof. This peripheral wall surrounds the electronic parts mounted on each of the two printed boards to achieve a shielding effect. Right and left sides of the stack of the two printed boards and the shield frame interposed therebetween are clamped respectively by a pair of resilient clamping members of a U-shaped cross-section to thereby provide a unitary assembly. These resilient clamping members cause earth portions of the first and second printed boards to be electrically connected to the shield frame. Finally, the above stack is housed in a casing body, thus completing the assembling of the electronic equipment device.

摘要翻译： 公开了一种电子设备装置。 一对第一和第二印刷电路板以插入其间的导电屏蔽框架重叠，使得其上安装有相关联的电子部件的两个印刷电路板的这些面相互面对。 屏蔽框架具有在其整个周边边缘上延伸的整体的外围壁。 该周壁围绕安装在两个印刷电路板的每一个上的电子部件，以实现屏蔽效果。 两个印刷电路板的叠层的左右两侧和插入其间的屏蔽框分别由U形横截面的一对弹性夹持构件夹紧，从而提供一体的组件。 这些弹性夹持构件使得第一和第二印刷电路板的接地部分电连接到屏蔽框架。 最后，将上述堆叠物收纳在壳体内，从而完成电子设备装置的组装。

公开(公告)号：US06515450B1

公开(公告)日：2003-02-04

申请号：US09980349

申请日：2002-02-13

申请人： Takashi Kaiho ,  Yasunobu Ikeda ,  Kanta Judai ,  Takeshi Sato

发明人： Takashi Kaiho ,  Yasunobu Ikeda ,  Kanta Judai ,  Takeshi Sato

IPC分类号： H01M1046

CPC分类号： H04M1/0262 ,  H01M2/1022 ,  H01M2/1066 ,  H01M2/30

摘要： An internal battery (2) has a battery terminal provided on a tip and has a third engagement projection (11) provided on the other end in a vertical direction. A battery housing portion (4) has a connector (5) provided on a tip and has, on a rear end, a battery hook (6) for pressing the third engagement projection (11) interlockingly with a sliding operation from a release position to a lock position. The battery hook (6) is slid from the release position to the lock position to press the third engagement projection (11). Consequently, the battery terminal is caused to abut on the connector (5) and the internal battery 2 is fixed into the battery housing portion (4). A battery (3) is fixed and attachment is thus completed.

摘要翻译： 内部电池（2）具有设置在尖端上的电池端子，并且具有在垂直方向上设置在另一端的第三接合突起（11）。 电池壳体部分（4）具有设置在尖端上的连接器（5），并且在后端具有电池钩（6），用于将滑动操作从释放位置互锁地按压到第三接合突起（11） 锁定位置。 电池钩（6）从释放位置滑动到锁定位置以按压第三接合突起（11）。 因此，使电池端子抵接在连接器（5）上，并且内部电池2被固定到电池容纳部分（4）中。 固定电池（3），从而完成安装。

公开(公告)号：US06809933B2

公开(公告)日：2004-10-26

申请号：US09980239

申请日：2002-01-28

申请人： Koji Kuchiishi ,  Toshihiro Higuchi ,  Hideo Haga ,  Yasunobu Ikeda

发明人： Koji Kuchiishi ,  Toshihiro Higuchi ,  Hideo Haga ,  Yasunobu Ikeda

IPC分类号： H05K500

CPC分类号： H04M1/0277 ,  H05K7/1417

摘要： First of all, a sub-PCB (6) is fixedly put on a surface of a chassis (5) as shown in an arrow I. At this time, a taper face (9a) of a guide rib (9) guides a fixed position of the sub-PCB (6) in a transverse direction. Next, the sub-PCB (6) is slid forward as shown in an arrow II. A front end of the sub-PCB (6) is led into a taper face (8b) of a fixed click (8) and is guided downward, and gets into the underside of the click and stops in a position of an abutting face (8c).

摘要翻译： 首先，如箭头I所示，将副PCB（6）固定地放置在底盘（5）的表面上。此时，引导肋（9）的锥面（9a）引导固定 子PCB（6）在横向上的位置。 接下来，子PCB（6）如箭头II所示向前滑动。 子PCB（6）的前端被引导到固定点击（8）的锥形面（8b）中并被向下引导，并进入咔嗒声的下侧并且停止在邻接面的位置 8c）。

公开(公告)号：US07043282B2

公开(公告)日：2006-05-09

申请号：US10466448

申请日：2002-06-07

申请人： Yoji Inomata ,  Yasunobu Ikeda ,  Toshihiro Higuchi

发明人： Yoji Inomata ,  Yasunobu Ikeda ,  Toshihiro Higuchi

IPC分类号： H04M1/00

CPC分类号： H04M1/0262 ,  H01M2/1022 ,  H01M2/1066

摘要： In order to enable both a back lid and a battery of a mobile electronic apparatus to be locked and unlocked with a single motion, the mobile electronic apparatus (10) in which the battery (11) is housed by opening the back lid (13) has such a structure that when a lock member (21) which is provided in a body of the mobile electronic apparatus so as to slide is slid to a locked position, the lock member (21) simultaneously locks both an engaging part (11a) provided in the battery (11) and an engaging part (13b) provided in the back lid (13), and when the lock member (21) is slid to an unlocked position, the lock member (21) simultaneously unlocks both the engaging parts (11a, 13b).

摘要翻译： 为了使得后盖和移动电子设备的电池能够以单一动作被锁定和解锁，通过打开后盖（13）来容纳电池（11）的移动电子设备（10） 具有这样的结构：当设置在移动电子设备的主体中以便滑动的锁定构件（21）滑动到锁定位置时，锁定构件（21）同时锁定接合部分（11a） 设置在电池（11）中的接合部（13b）和设置在后盖（13）中的接合部（13b），并且当锁定构件（21）滑动到解锁位置时，锁定构件（21）同时解锁接合 部分（11a，13b）。

公开(公告)号：US06968161B2

公开(公告)日：2005-11-22

申请号：US09796828

申请日：2001-03-01

申请人： Yoji Inomata ,  Yasunobu Ikeda ,  Ryuichi Toyoda ,  Akira Takahashi

发明人： Yoji Inomata ,  Yasunobu Ikeda ,  Ryuichi Toyoda ,  Akira Takahashi

IPC分类号： H05K5/02 ,  H04B1/38 ,  H04B1/3822 ,  H04M1/02 ,  H04W88/02

CPC分类号： H04M1/0283 ,  H01H2221/066 ,  H04M1/0214 ,  H04M1/0235 ,  H04M1/0254 ,  H04M1/027 ,  H04M1/72575

摘要： A portable telephone to which additional function units, such as a flip unit and a slide unit, that provide additional functions for the main body of a portable telephone, are easily mounted on the case of a basic unit that includes only the essential units required for speech. One or more of an LCD bezel 40, a flip cover 50, a keypad bezel 60, grips 70, a keypad slide cover 80 and a slide cover 90, which are additional function units, are mounted on a basic unit 20. Therefore, this arrangement can cope with a request from a user who desires to alter a portable telephone he or she purchased to obtain a model he or she favors.

摘要翻译： 一种便携式电话，其中为便携式电话的主体提供附加功能的诸如翻转单元和滑动单元的附加功能单元容易地安装在基本单元的壳体上，该基本单元仅包括所需的基本单元 言语。 作为附加功能单元的LCD面板40，翻盖50，键盘挡板60，把手70，键盘滑盖80和滑盖90中的一个或多个安装在基本单元20上。 因此，这种安排可以应付来自希望改变他或她购买的便携式电话以获得他或她喜欢的模型的用户的请求。

公开(公告)号：US06942154B1

公开(公告)日：2005-09-13

申请号：US09980740

申请日：2000-02-23

申请人： Hideo Haga ,  Koji Kuchiishi ,  Yoji Inomata ,  Toshihiro Higuchi ,  Yasunobu Ikeda

发明人： Hideo Haga ,  Koji Kuchiishi ,  Yoji Inomata ,  Toshihiro Higuchi ,  Yasunobu Ikeda

IPC分类号： G06K7/00 ,  H01R24/00 ,  H01R107/00 ,  H04B1/38 ,  H04M1/02 ,  H04Q7/32

CPC分类号： G06K7/0021 ,  G06K7/003 ,  H04B1/3816 ,  H04M2250/14

摘要： A card connector includes a base member and two sets of contact members which are provided on the base member. One ends of the contact members serve as joining portions with respect to a circuit board of a portable telephone. The other ends of the contact members serve as contact portions with respect to a card. The joining portions are respectively disposed at mutually opposite ends of the base member. The contact portions are bent in a chevron shape and have terminations in a card fitting direction.

摘要翻译： 卡连接器包括基座构件和设置在基座构件上的两组接触构件。 接触构件的一端用作相对于便携式电话的电路板的接合部分。 接触构件的另一端用作相对于卡的接触部分。 接合部分分别设置在基体的相互相对的两端。 接触部分以人字形弯曲并具有卡配合方向的终端。

公开(公告)号：US07528049B2

公开(公告)日：2009-05-05

申请号：US11878255

申请日：2007-07-23

申请人： Yasunobu Ikeda ,  Shinichi Tomita ,  Hiroyuki Miyahara

发明人： Yasunobu Ikeda ,  Shinichi Tomita ,  Hiroyuki Miyahara

IPC分类号： H01L21/00

CPC分类号： H01L21/02052 ,  H01L21/3226 ,  H01L21/76256

摘要： A bonded SOI wafer is manufactured by performing bonding in a state where organics exist on a surface of an active layer wafer and/or on a surface of a supporting wafer and performing heat-treating for bonding reinforcement in a state where the organics are trapped at an interface between the active layer wafer and the supporting wafer to form crystal defects at an interface between the active layer wafer and an oxide film and/or at an interface between the supporting wafer and the oxide film. This allows a simple and inexpensive gettering source to be formed at the interface between an SOI layer and an insulating layer (oxide film). Also, the bonded SOI wafer of the present invention that is manufactured by this method can effectively remove heavy-metal impurities that may have a negative impact on the characteristics of the device and/or the withstand voltage characteristics of the oxide film. Therefore, the manufacturing method and the bonded SOI wafer according to the present invention can be utilized widely as an SOI wafer with improved device characteristics or as a manufacturing method thereof.

摘要翻译： 通过在有源层晶片的表面和/或支撑晶片的表面上存在有机物的状态下进行结合，并且在有机物被捕获的状态下进行接合强化的热处理来制造键合SOI晶片 有源层晶片和支撑晶片之间的界面，以在有源层晶片和氧化物膜之间的界面处和/或在支撑晶片和氧化物膜之间的界面处形成晶体缺陷。 这允许在SOI层和绝缘层（氧化物膜）之间的界面处形成简单且廉价的吸气源。 此外，通过该方法制造的本发明的接合SOI晶片可以有效地去除可能对器件的特性和/或氧化膜的耐电压特性具有负面影响的重金属杂质。 因此，根据本发明的制造方法和接合SOI晶片可以广泛地用作具有改进的器件特性的SOI晶片或其制造方法。

公开(公告)号：US20080020541A1

公开(公告)日：2008-01-24

申请号：US11878255

申请日：2007-07-23

申请人： Yasunobu Ikeda ,  Shinichi Tomita ,  Hiroyuki Miyahara

发明人： Yasunobu Ikeda ,  Shinichi Tomita ,  Hiroyuki Miyahara

IPC分类号： H01L21/762 ,  H01L29/00

CPC分类号： H01L21/02052 ,  H01L21/3226 ,  H01L21/76256

摘要： A bonded SOI wafer is manufactured by performing bonding in a state where organics exist on a surface of an active layer wafer and/or on a surface of a supporting wafer and performing heat-treating for bonding reinforcement in a state where the organics are trapped at an interface between the active layer wafer and the supporting wafer to form crystal defects at an interface between the active layer wafer and an oxide film and/or at an interface between the supporting wafer and the oxide film. This allows a simple and inexpensive gettering source to be formed at the interface between an SOI layer and an insulating layer (oxide film). Also, the bonded SOI wafer of the present invention that is manufactured by this method can effectively remove heavy-metal impurities that may have a negative impact on the characteristics of the device and/or the withstand voltage characteristics of the oxide film. Therefore, the manufacturing method and the bonded SOI wafer according to the present invention can be utilized widely as an SOI wafer with improved device characteristics or as a manufacturing method thereof.

摘要翻译： 通过在有源层晶片的表面和/或支撑晶片的表面上存在有机物的状态下进行结合，并且在有机物被捕获的状态下进行接合强化的热处理来制造键合SOI晶片 有源层晶片和支撑晶片之间的界面，以在有源层晶片和氧化物膜之间的界面处和/或在支撑晶片和氧化物膜之间的界面处形成晶体缺陷。 这允许在SOI层和绝缘层（氧化物膜）之间的界面处形成简单且廉价的吸气源。 此外，通过该方法制造的本发明的接合SOI晶片可以有效地去除可能对器件的特性和/或氧化膜的耐电压特性具有负面影响的重金属杂质。 因此，根据本发明的制造方法和接合SOI晶片可以广泛地用作具有改进的器件特性的SOI晶片或其制造方法。

公开(公告)号：US06947767B2

公开(公告)日：2005-09-20

申请号：US09980535

申请日：2001-02-23

申请人： Hideo Haga ,  Koji Kuchiishi ,  Toshihiro Higuchi ,  Yasunobu Ikeda

发明人： Hideo Haga ,  Koji Kuchiishi ,  Toshihiro Higuchi ,  Yasunobu Ikeda

IPC分类号： H01R13/639 ,  G06K7/00 ,  H04M1/02 ,  H04Q7/32 ,  H04M1/00

CPC分类号： G06K7/0021 ,  G06K13/085 ,  H04B1/3816 ,  H04M1/0202 ,  H04M2250/14

摘要： A card is slid and fitted to a card connector fixed in a card-fitting recessed portion provided inside a reverse surface-side housing of a portable terminal apparatus. A front portion of the card is held by card holding portions provided in a front portion, as viewed in a card sliding direction, of the card connector, and a rear portion of the card is held by an inner wall surface of a cover-cum-battery of the reverse surface-side housing. A housing-side stopper is provided on a bottom surface of the card-fitting recessed portion. The housing-side stopper is formed by a rectangular resilient piece having one end fixed to a bottom surface of the card-fitting recessed portion.

摘要翻译： 将卡滑动并安装在固定在设置在便携式终端装置的背面侧壳体内的卡嵌入凹部中的卡连接器上。 卡的前部由卡连接器的卡片滑动方向的前部设置的卡保持部保持，卡的后部被盖的内壁面保持 反面侧壳体的电池。 在卡配合凹部的底面设置有壳体侧止动件。 壳体侧止动器由一端固定在卡嵌凹部的底面上的矩形弹性片形成。

公开(公告)号：US06620285B2

公开(公告)日：2003-09-16

申请号：US09972851

申请日：2001-10-10

申请人： Shinichi Tomita ,  Shuhei Tsuda ,  Yasunobu Ikeda

发明人： Shinichi Tomita ,  Shuhei Tsuda ,  Yasunobu Ikeda

IPC分类号： B29C6500

CPC分类号： B32B38/1833 ,  B32B2038/1891 ,  H01L21/76251 ,  Y10T156/1702 ,  Y10T156/1744

摘要： A method for bonding substrates to tightly bond two overlaid substrates comprises the steps of: aligning the substrates, freely falling a second substrate onto a first substrate to overlay the first and second substrates; interposing an air layer between the joining surfaces of the first and second substrates, aligning the first and second substrates and holding the aligned first and second substrates; and pressing one point of the aligned two substrates. Thus, the bonded substrates which can be aligned accurately and free from occurrence of voids or the like can be obtained.