公开(公告)号：US08067272B2

公开(公告)日：2011-11-29

申请号：US12578797

申请日：2009-10-14

申请人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee ,  Ii Kwon Shim

发明人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee ,  Ii Kwon Shim

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/495

CPC分类号： H01L23/49537 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable multi-chip package system is provided including forming an external interconnect having a base and a tip, connecting a first integrated circuit die and the base, stacking a second integrated circuit die over the first integrated circuit die in an active side to active side configuration, connecting the second integrated circuit die and the base, and molding the first integrated circuit die, the second integrated circuit die, and the external interconnect partially exposed.

摘要翻译： 提供了一种可堆叠的多芯片封装系统，包括形成具有基极和尖端的外部互连件，连接第一集成电路管芯和基座，将第二集成电路管芯在有源侧的第一集成电路管芯上堆叠到有源侧 配置，连接第二集成电路管芯和基座，以及模制第一集成电路管芯，第二集成电路管芯和部分暴露的外部互连。

公开(公告)号：US07645638B2

公开(公告)日：2010-01-12

申请号：US11462568

申请日：2006-08-04

申请人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

发明人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable multi-chip package system is provided including forming an external interconnect, having a base and a tip, and a paddle; mounting a first integrated circuit die over the paddle; stacking a second integrated circuit die over the first integrated circuit die in a active side to active side configuration; connecting the first integrated circuit die and the base; connecting the second integrated circuit die and the base; and molding the first integrated circuit die, the second integrated circuit die, the paddle, and the external interconnect with the external interconnect partially exposed.

摘要翻译： 提供了一种可堆叠的多芯片封装系统，包括形成具有基座和尖端的外部互连件和桨叶; 将第一集成电路管芯安装在所述桨上; 将第二集成电路管芯在有源侧的第一集成电路管芯上堆叠到主动侧构造; 连接第一集成电路管芯和基座; 连接第二集成电路管芯和基座; 并且第一集成电路管芯，第二集成电路管芯，焊盘和外部互连件与外部互连部分地露出成型。

公开(公告)号：US20070194463A1

公开(公告)日：2007-08-23

申请号：US11677487

申请日：2007-02-21

申请人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

发明人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

IPC分类号： H01L23/28

CPC分类号： H01L23/3107 ,  H01L21/6835 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first L-shaped leadfingers adjacent the single edge, connecting the die pads and the first L-shaped leadfingers, and encapsulating the die pads and portions of the first L-shaped leadfingers to form a first package.

摘要翻译： 集成电路封装系统包括具有与第一集成电路管芯的单个边缘相邻的管芯焊盘的第一集成电路管芯，与单个边缘相邻形成第一L形引线管，连接管芯焊盘和第一L形引线管，以及 封装所述管芯焊盘和所述第一L形引线管的部分以形成第一封装。

公开(公告)号：US20080029867A1

公开(公告)日：2008-02-07

申请号：US11462588

申请日：2006-08-04

申请人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee ,  Il Kwon Shim

发明人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee ,  Il Kwon Shim

IPC分类号： H01L23/02

CPC分类号： H01L23/49537 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable multi-chip package system is provided including forming an external interconnect having a base and a tip, connecting a first integrated circuit die and the base, stacking a second integrated circuit die over the first integrated circuit die in an active side to active side configuration, connecting the second integrated circuit die and the base, and molding the first integrated circuit die, the second integrated circuit die, and the external interconnect partially exposed.

摘要翻译： 提供了一种可堆叠的多芯片封装系统，包括形成具有基极和尖端的外部互连件，连接第一集成电路管芯和基座，将第二集成电路管芯在有源侧的第一集成电路管芯上堆叠到有源侧 配置，连接第二集成电路管芯和基座，以及模制第一集成电路管芯，第二集成电路管芯和部分暴露的外部互连。

公开(公告)号：US07915738B2

公开(公告)日：2011-03-29

申请号：US12615195

申请日：2009-11-09

申请人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

发明人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable multi-chip package system is provided including forming an external interconnect, having a base and a tip, and a paddle; mounting a first integrated circuit die over the paddle; stacking a second integrated circuit die over the first integrated circuit die in a active side to active side configuration; connecting the first integrated circuit die and the base; connecting the second integrated circuit die and the base; and molding the first integrated circuit die, the second integrated circuit die, the paddle, and the external interconnect with the external interconnect partially exposed.

摘要翻译： 提供了一种可堆叠的多芯片封装系统，包括形成具有基座和尖端的外部互连件和桨叶; 将第一集成电路管芯安装在所述桨上; 将第二集成电路管芯在有源侧的第一集成电路管芯上堆叠到主动侧构造; 连接第一集成电路管芯和基座; 连接第二集成电路管芯和基座; 并且第一集成电路管芯，第二集成电路管芯，焊盘和外部互连件与外部互连部分地露出成型。

公开(公告)号：US20100052117A1

公开(公告)日：2010-03-04

申请号：US12615195

申请日：2009-11-09

申请人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

发明人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

IPC分类号： H01L23/552

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable multi-chip package system is provided including forming an external interconnect, having a base and a tip, and a paddle; mounting a first integrated circuit die over the paddle; stacking a second integrated circuit die over the first integrated circuit die in a active side to active side configuration; connecting the first integrated circuit die and the base; connecting the second integrated circuit die and the base; and molding the first integrated circuit die, the second integrated circuit die, the paddle, and the external interconnect with the external interconnect partially exposed.

摘要翻译： 提供了一种可堆叠的多芯片封装系统，包括形成具有基座和尖端的外部互连件和桨叶; 将第一集成电路管芯安装在所述桨上; 将第二集成电路管芯在有源侧的第一集成电路管芯上堆叠到主动侧构造; 连接第一集成电路管芯和基座; 连接第二集成电路管芯和基座; 并且第一集成电路管芯，第二集成电路管芯，焊盘和外部互连件与外部互连部分地露出成型。

公开(公告)号：US07622333B2

公开(公告)日：2009-11-24

申请号：US11462588

申请日：2006-08-04

申请人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee ,  Il Kwon Shim

发明人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee ,  Il Kwon Shim

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49537 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable multi-chip package system is provided including forming an external interconnect having a base and a tip, connecting a first integrated circuit die and the base, stacking a second integrated circuit die over the first integrated circuit die in an active side to active side configuration, connecting the second integrated circuit die and the base, and molding the first integrated circuit die, the second integrated circuit die, and the external interconnect partially exposed.

摘要翻译： 提供了一种可堆叠的多芯片封装系统，包括形成具有基极和尖端的外部互连件，连接第一集成电路管芯和基座，将第二集成电路管芯在有源侧的第一集成电路管芯上堆叠到有源侧 配置，连接第二集成电路管芯和基座，以及模制第一集成电路管芯，第二集成电路管芯和部分暴露的外部互连。

公开(公告)号：US08471374B2

公开(公告)日：2013-06-25

申请号：US11677487

申请日：2007-02-21

申请人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

发明人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

IPC分类号： H01L23/3121 ,  H01L24/49 ,  H01L25/0657

CPC分类号： H01L23/3107 ,  H01L21/6835 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first L-shaped leadfingers adjacent the single edge, connecting the die pads and the first L-shaped leadfingers, and encapsulating the die pads and portions of the first L-shaped leadfingers to form a first package.

摘要翻译： 集成电路封装系统包括具有与第一集成电路管芯的单个边缘相邻的管芯焊盘的第一集成电路管芯，与单个边缘相邻形成第一L形引线管，连接管芯焊盘和第一L形引线管，以及 封装所述管芯焊盘和所述第一L形引线管的部分以形成第一封装。

公开(公告)号：US20100038768A1

公开(公告)日：2010-02-18

申请号：US12578797

申请日：2009-10-14

申请人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee ,  Il Kwon Shim

发明人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee ,  Il Kwon Shim

IPC分类号： H01L25/065 ,  H01L21/50

CPC分类号： H01L23/49537 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable multi-chip package system is provided including forming an external interconnect having a base and a tip, connecting a first integrated circuit die and the base, stacking a second integrated circuit die over the first integrated circuit die in an active side to active side configuration, connecting the second integrated circuit die and the base, and molding the first integrated circuit die, the second integrated circuit die, and the external interconnect partially exposed.

摘要翻译： 提供了一种可堆叠的多芯片封装系统，包括形成具有基极和尖端的外部互连件，连接第一集成电路管芯和基座，将第二集成电路管芯在有源侧的第一集成电路管芯上堆叠到有源侧 配置，连接第二集成电路管芯和基座，以及模制第一集成电路管芯，第二集成电路管芯和部分暴露的外部互连。

公开(公告)号：US20080029866A1

公开(公告)日：2008-02-07

申请号：US11462568

申请日：2006-08-04

申请人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

发明人： Young Cheol Kim ,  Koo Hong Lee ,  Jae Hak Yee

IPC分类号： H01L23/02

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable multi-chip package system is provided including forming an external interconnect, having a base and a tip, and a paddle; mounting a first integrated circuit die over the paddle; stacking a second integrated circuit die over the first integrated circuit die in a active side to active side configuration; connecting the first integrated circuit die and the base; connecting the second integrated circuit die and the base; and molding the first integrated circuit die, the second integrated circuit die, the paddle, and the external interconnect with the external interconnect partially exposed.

摘要翻译： 提供了一种可堆叠的多芯片封装系统，包括形成具有基座和尖端的外部互连件和桨叶; 将第一集成电路管芯安装在所述桨上; 将第二集成电路管芯在有源侧的第一集成电路管芯上堆叠到主动侧构造; 连接第一集成电路管芯和基座; 连接第二集成电路管芯和基座; 并且第一集成电路管芯，第二集成电路管芯，焊盘和外部互连件与外部互连部分地露出成型。